SCHEMBL3682160

SCHEMBL3682160

C=C(C)C(=O)OCOP(=O)(OC)OC

nearest known ligand 0.42

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.42
ALDH1A1 P00352 2/20 0.42
THRB P10828 1/20 0.40
POLB P06746 1/20 0.30
APEX1 P27695 1/20 0.30
HTT P42858 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21051155 0.90 TSHR (0.47) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL3686253 0.83 TSHR (0.48) TSHRALDH1A1THRBTDP1
SCHEMBL11474626 0.83 TSHR (0.41) TSHRALDH1A1THRB
SCHEMBL3680829 0.83 THRB (0.52) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL27838291 0.80 TSHR (0.56) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL3684416 0.80 TSHR (0.51) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL2020675 0.80 TSHR (0.45) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL11810640 0.80 TSHR (0.45) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL17705188 0.80 TSHR (0.45) TSHRALDH1A1THRBPOLBAPEX1
SCHEMBL19448939 0.79 ALDH1A1 (0.39) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110036047-B Methacrylic copolymer and molded article 株式会社可乐丽 2021-01-05 CN disclosed
US-10407524-B2 Copolymer and molded article KURARAY CO., LTD. (JP) 2019-09-10 US disclosed
US-10287380-B2 Copolymer, and molded article KURARAY CO., LTD. (JP) 2019-05-14 US disclosed
EP-3095800-B1 COPOLYMER, AND MOLDED ARTICLE KURARAY CO (JP) 2018-05-02 EP disclosed
US-20170226249-A1 COPOLYMER AND MOLDED ARTICLE KURARAY CO., LTD. (JP) 2017-08-10 US disclosed
US-20170174802-A1 COPOLYMER AND MOLDED ARTICLE KURARAY CO., LTD. (JP) 2017-06-22 US disclosed
EP-3181602-A1 COPOLYMER AND MOLDED ARTICLE Kuraray Co., Ltd. (JP) 2017-06-21 EP disclosed
EP-3095800-A1 COPOLYMER, AND MOLDED ARTICLE Kuraray Co., Ltd. (JP) 2016-11-23 EP disclosed
US-20160326288-A1 COPOLYMER, AND MOLDED ARTICLE KURARAY CO., LTD. (JP) 2016-11-10 US disclosed
CN-104995223-A Copolymer and molded body KURARAY CO 2015-10-21 CN disclosed
US-7851534-B2 Use between a radiating body such as a heat sink and a heat-generating part for electronics or parts such as integrated circuits; binder component, a maleated liquid polyolefin, and thermally conductive filler(s) selected from metal oxides and metal hydroxides; good flexibility, no offensive odor 3M INNOVATIVE PROPERTIES COMPANY (US) 2010-12-14 US disclosed
EP-1791874-B1 THERMALLY CONDUCTIVE SHEET 3M INNOVATIVE PROPERTIES CO (US) 2009-03-11 EP disclosed
US-20070249755-A1 Thermally Conductive Composition 3M INNOVATIVE PROPERTIES COMPANY (PA) 2007-10-25 US disclosed
US-20070224426-A1 Use between a radiating body such as a heat sink and a heat-generating part for electronics or parts such as integrated circuits; binder component, a maleated liquid polyolefin, and thermally conductive filler(s) selected from metal oxides and metal hydroxides; good flexibility, no offensive odor 3M INNOVATIVE PROPERTIES COMPANY 2007-09-27 US disclosed
EP-1791874-A1 THERMALLY CONDUCTIVE SHEET 3M Innovative Properties Company (US) 2007-06-06 EP disclosed
EP-1773925-A1 THERMALLY CONDUCTIVE COMPOSITION 3M Innovative Properties Company (US) 2007-04-18 EP disclosed
WO-2006019751-A1 THERMALLY CONDUCTIVE COMPOSITION 3M INNOVATIVE PROPERTIES COMPANY (US) 2006-02-23 WO disclosed
WO-2006016936-A1 THERMALLY CONDUCTIVE SHEET 3M INNOVATIVE PROPERTIES COMPANY (US) 2006-02-16 WO disclosed