SCHEMBL36858

SCHEMBL36858

[N-]=[N+]=C(S(=O)(=O)CCCCCCS(=O)(=O)C(=[N+]=[N-])S(=O)(=O)c1ccccc1)S(=O)(=O)c1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC3 O15379 1/20 0.39
HDAC4 P56524 1/20 0.39
HDAC1 Q13547 1/20 0.39
HDAC7 Q8WUI4 1/20 0.39
HDAC2 Q92769 1/20 0.39
HDAC10 Q969S8 1/20 0.39
HDAC11 Q96DB2 1/20 0.39
HDAC8 Q9BY41 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
HDAC9 Q9UKV0 1/20 0.39
HDAC5 Q9UQL6 1/20 0.39
ALDH1A1 P00352 5/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
LMNA P02545 2/20 0.37
TP53 P04637 2/20 0.37
NPC1 O15118 1/20 0.37
S1PR2 O95136 1/20 0.37
PRNP P04156 1/20 0.37
MAPT P10636 1/20 0.37
XBP1 P17861 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13657224 1.00 HDAC3 (0.39) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL36313 1.00 HDAC3 (0.39) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL36315 0.98 ALDH1A1 (0.38) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL36075 0.95 ALDH1A1 (0.38) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL23923247 0.94 TDP1 (0.40) PKMTDP1PSIP1MMP1MMP9
SCHEMBL23923246 0.94 TDP1 (0.40) PKMTDP1PSIP1MMP1MMP9
SCHEMBL2965787 0.90 TDP1 (0.41) ALDH1A1SMN1; SMN2LMNATP53NPC1
SCHEMBL13597464 0.90 HDAC1 (0.39) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL10072231 0.88 ALDH1A1 (0.40) ALDH1A1SMN1; SMN2LMNATP53NPC1
SCHEMBL2165382 0.87 GAA (0.45) ALDH1A1SMN1; SMN2LMNATP53NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 589 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6153733-A (Disulfonyl diazomethane compounds) TOKYO OHKA KOGYO CO., LTD. (JP) 2000-11-28 US claimed
CN-120044751-A Photosensitive resin composition 东京应化工业株式会社 2025-05-27 CN disclosed
WO-2024053579-A1 PHOTOSENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2024-03-14 WO disclosed
US-20240034899-A1 CURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-01 US disclosed
EP-3896522-B1 PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-03 EP disclosed
EP-2584409-B1 RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMERIC COMPOUND, AND COMPOUND TOKYO OHKA KOGYO CO LTD (JP) 2021-04-28 EP disclosed
EP-2060600-B1 Resist composition, method of forming resist pattern, novel compound, and acid generator TOKYO OHKA KOGYO CO LTD (JP) 2017-12-27 EP disclosed
US-9834696-B2 Undercoat agent and method of forming pattern of layer containing block copolymer TOKYO OHKA KOGYO CO., LTD. (JP) 2017-12-05 US disclosed
US-9821338-B2 Method of producing structure containing phase-separated structure utilizing a brush composition comprising PS-PMMA TOKYO OHKA KOGYO., LTD. (JP) 2017-11-21 US disclosed
EP-2093213-B1 Positive resist composition and method of forming a resist pattern using the same TOKYO OHKA KOGYO CO LTD (JP) 2017-10-04 EP disclosed
EP-1602977-A1 Positive resist composition and compound used therein TOKYO OHKA KOGYO CO., LTD. (JP) 2005-12-07 EP disclosed
US-20050266340-A1 Positive resist composition and compound used therein TOKYO OHKA KOGYO CO., LTD. (JP) 2005-12-01 US disclosed
US-20050244740-A1 Chemically amplified positive photo resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2005-11-03 US disclosed
US-20050227171-A1 Lift-off positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-13 US disclosed
US-20050227170-A1 Positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-13 US disclosed
US-20050221225-A1 Positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-06 US disclosed
EP-1582926-A2 Positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-05 EP disclosed
EP-1582925-A2 Positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-05 EP disclosed
US-6180313-B1 SUITABLE AS RADIATION-SENSITIVE ACID-GENERATING AGENT; PHOTORESISTS FOR USE IN PHOTOLITHOGRAPHY TOKYO OHKA KOGYO CO., LTD. (JP) 2001-01-30 US disclosed
US-6153733-A (Disulfonyl diazomethane compounds) TOKYO OHKA KOGYO CO., LTD. (JP) 2000-11-28 US disclosed