SCHEMBL10072231

SCHEMBL10072231

[N-]=[N+]=C(S(=O)(=O)CS(=O)(=O)C(=[N+]=[N-])S(=O)(=O)c1ccccc1)S(=O)(=O)c1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.40
SMN1; SMN2 Q16637 4/20 0.40
TP53 P04637 2/20 0.40
LMNA P02545 2/20 0.40
NPC1 O15118 1/20 0.40
S1PR2 O95136 1/20 0.40
PRNP P04156 1/20 0.40
MAPT P10636 1/20 0.40
XBP1 P17861 1/20 0.40
MAPK1 P28482 1/20 0.40
RAB9A P51151 1/20 0.40
KMT2A Q03164 1/20 0.40
ATM Q13315 1/20 0.40
TSHR P16473 1/20 0.39
HSD17B10 Q99714 2/20 0.39
HTT P42858 2/20 0.39
HTR6 P50406 1/20 0.37
PSIP1 O75475 1/20 0.36
CA1 P00915 2/20 0.35
CA2 P00918 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13657224 0.88 HDAC3 (0.39) ALDH1A1SMN1; SMN2TP53LMNANPC1
SCHEMBL36858 0.88 HDAC3 (0.39) ALDH1A1SMN1; SMN2TP53LMNANPC1
SCHEMBL36313 0.88 HDAC3 (0.39) ALDH1A1SMN1; SMN2TP53LMNANPC1
SCHEMBL65095 0.86 SMN1; SMN2 (0.46) ALDH1A1SMN1; SMN2TP53LMNANPC1
SCHEMBL36315 0.86 ALDH1A1 (0.38) ALDH1A1SMN1; SMN2TP53LMNANPC1
SCHEMBL36075 0.86 ALDH1A1 (0.38) ALDH1A1SMN1; SMN2TP53LMNANPC1
SCHEMBL2165382 0.84 GAA (0.45) ALDH1A1SMN1; SMN2TP53LMNANPC1
SCHEMBL23923247 0.82 TDP1 (0.40) PSIP1MMP1MMP9MMP13PKM
SCHEMBL23923246 0.82 TDP1 (0.40) PSIP1MMP1MMP9MMP13PKM
SCHEMBL2965787 0.82 TDP1 (0.41) ALDH1A1SMN1; SMN2TP53LMNANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9176381-B2 Positive type photosensitive resin composition CHEIL INDUSTRIES INC. (KR) 2015-11-03 US disclosed
US-8389197-B2 Compound, positive resist composition and resist pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-05 US disclosed
US-8304163-B2 Compound, dissolution inhibitor, positive type resist composition, and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-11-06 US disclosed
US-8216763-B2 Photosensitive resin composition and method of forming pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-07-10 US disclosed
US-8206887-B2 Positive resist composition and resist pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2012-06-26 US disclosed
US-8026047-B2 Providing film on substrate, forming resist pattern on film through lithography technique including exposure and development, and performing processing in which film is brought into contact with supercritical processing solution in which an organic matter is dissolved; accuracy, sensitivity NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2011-09-27 US disclosed
US-7981588-B2 Negative resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-07-19 US disclosed
US-7977036-B2 Using resist composition which has a photosensitivity to a predetermined light source and bringing the resist pattern formed on the substrate into contact with a supercritical processing solution comprising a supercritical fluid which contains a crosslinking agent; fine resist pattern, etching resistance NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2011-07-12 US disclosed
US-7972762-B2 resist pattern with reduced defects and excellent lithographic characteristics; acrylate ester copolymer obtained by polymerizing an ( alpha -lower alkyl)acrylate ester having tertiary alkyl ester-type acid dissociable dissolution inhibiting group, under a presence of acid TOKYO OHKA KOGYO CO., LTD. (JP) 2011-07-05 US disclosed
US-20110159428-A1 Positive Type Photosensitive Resin Composition CHEIL INDUSTRIES INC. (KR) 2011-06-30 US disclosed
US-20090068583-A1 resin comprises (2-adamantyloxymethyl)methacrylate monomers which exhibit increased alkali solubility under action of acid, and acid generator such as diphenyliodonium trifluoromethanesulfonate; reduced line edge roughness, improved shape and depth of focus TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-20090068588-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-20090047600-A1 high resolution pattern with reduced line edge roughness; increased alkali solubility under action of acid generator TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-19 US disclosed
US-20090042129-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR RESIST PATTERN FORMATION TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-12 US disclosed
US-20090035697-A1 NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKAKOGYO CO.,LTD. (JP) 2009-02-05 US disclosed
US-20090029291-A1 POSITIVE RESIST COMPOSITION FOR THIN-FILM IMPLANTATION PROCESS AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-01-29 US disclosed
US-20080145784-A1 Positive Resist Composition, Method For Resist Pattern Formation and Compound TOKYO OHKA KOGYO CO., LTD. (JP) 2008-06-19 US disclosed
US-20080124648-A1 Resist Pattern Forming Method, Supercritical Processing Solution For Lithography Process, And Antireflection Film Forming Method NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2008-05-29 US disclosed
US-20080118871-A1 Resist Pattern Forming Method NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2008-05-22 US disclosed
US-20070196764-A1 RESIST COMPOSITION FOR SUPERCRITICAL DEVELOPMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2007-08-23 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20080145784-A1 Positive Resist Composition, Method For Resist Pattern Formation and Compound POLR1A, POLR2A, POLR2B ALDH1A1 1525/4885SMN1; SMN2 2834/4885TP53 3271/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.