Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADRB2 | P07550 | 1/20 | 0.33 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.33 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3677702 | 0.86 | ADRB2 (0.33) | ADRB2ADRB1ADRB3CYP3A4TSHR | |
| SCHEMBL3687057 | 0.86 | — | — | |
| SCHEMBL11783212 | 0.79 | ADRB2 (0.35) | ADRB2ADRB1ADRB3CYP3A4TSHR | |
| SCHEMBL18983172 | 0.78 | DNM1 (0.35) | TSHR | |
| SCHEMBL20573065 | 0.78 | TSHR (0.37) | ADRB2ADRB1ADRB3TSHR | |
| SCHEMBL20572993 | 0.78 | TSHR (0.32) | ADRB2ADRB1ADRB3TSHR | |
| SCHEMBL11783896 | 0.78 | DNM1 (0.35) | TSHR | |
| SCHEMBL11784751 | 0.78 | DNM1 (0.35) | TSHR | |
| SCHEMBL4529265 | 0.78 | DNM1 (0.32) | — | |
| SCHEMBL4538216 | 0.78 | DNM1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024135780-A1 | POLYIMIDE FILM, MULTILAYER BODY, FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2024-06-27 | — | — | WO | disclosed |
| CN-116964131-A | Polyamic acid, polyimide, and use thereof | 东洋纺株式会社 | 2023-10-27 | — | — | CN | disclosed |
| WO-2023013453-A1 | ELECTRONIC DISPLAY APPARATUS | 東洋紡株式会社 | 2023-02-09 | — | — | WO | disclosed |
| US-11548984-B2 | Light- or heat-curing method and curable resin composition | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2023-01-10 | — | — | US | disclosed |
| WO-2023276864-A1 | SILSESQUIOXANE COMPOUND AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276880-A1 | POLYAMIC ACID, POLYIMIDE, AND USE THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276887-A1 | POLY(AMIC ACID), POLYIMIDE, AND USES THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| CN-108602955-B | Photocuring method, compound used in photocuring method, and composition | 富士胶片和光纯药株式会社 | 2021-08-06 | — | — | CN | disclosed |
| US-10774062-B2 | Photocuring method, compound and composition used therein | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2020-09-15 | — | — | US | disclosed |
| EP-3409709-B1 | PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN | FUJIFILM WAKO PURE CHEMICAL CORP (JP) | 2020-08-19 | — | — | EP | disclosed |
| US-20200123324-A1 | LIGHT- OR HEAT-CURING METHOD AND CURABLE RESIN COMPOSITION | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2020-04-23 | — | — | US | disclosed |
| CN-110678500-A | Photo-or thermosetting method and curable resin composition | 富士胶片和光纯药株式会社 | 2020-01-10 | — | — | CN | disclosed |
| US-20190055210-A1 | PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN | FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) | 2019-02-21 | — | — | US | disclosed |
| EP-3409709-A1 | PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN | FUJIFILM Wako Pure Chemical Corporation (JP) | 2018-12-05 | — | — | EP | disclosed |
| US-8841050-B2 | Photosensitive resin composition and applications thereof | CHI MEI CORPORATION (TW) | 2014-09-23 | — | — | US | disclosed |
| US-20140087308-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS THEREOF | CHI MEI CORPORATION (TW) | 2014-03-27 | — | — | US | disclosed |
| US-8318885-B2 | Curable resin composition, cured product thereof, and various articles derived from those | ARAKAWA CHEMICAL INDUSTRIES LTD. (JP) | 2012-11-27 | — | — | US | disclosed |
| US-20100215937-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND VARIOUS ARTICLES DERIVED FROM THOSE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2010-08-26 | — | — | US | disclosed |
| US-20090286015-A1 | Curable resin composition, cured product thereof, and various articles derived from those | AKAKAWA CHEMICAL INDUSTRIES, LTD (JP) | 2009-11-19 | — | — | US | disclosed |
| US-7371480-B2 | Silica sol composition, membrane electrode assembly with proton-exchange membrane, and fuel cell | FUJIFILM CORPORATION (JP) | 2008-05-13 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20190055210-A1 | PHOTOCURING METHOD, COMPOUND AND COMPOSITION USED THEREIN | ESD, TMT1A, PAM | ADRB2 3900/4885ADRB1 3771/4885ADRB3 4108/4885 |
| US-10774062-B2 | Photocuring method, compound and composition used therein | ESD, TMT1A, PAM | ADRB2 3900/4885ADRB1 3771/4885ADRB3 4108/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.