SCHEMBL3735844

SCHEMBL3735844

NC(=S)c1c[nH]c(-c2ccccc2)n1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DCUN1D1 Q96GG9 1/20 0.39
ALDH1A1 P00352 5/20 0.38
CYP1A2 P05177 4/20 0.38
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
KDM4E B2RXH2 2/20 0.38
HPGD P15428 2/20 0.38
CYP2C19 P33261 2/20 0.38
CYP2C9 P11712 1/20 0.38
MTOR P42345 1/20 0.36
ADK P55263 1/20 0.36
NISCH Q9Y2I1 1/20 0.36
ASH1L Q9NR48 1/20 0.36
PARP1 P09874 1/20 0.36
NR1H2 P55055 1/20 0.35
NR1H3 Q13133 1/20 0.35
CXCR2 P25025 1/20 0.35
MAPT P10636 2/20 0.35
PLAU P00749 1/20 0.35
PRSS1 P07477 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1079995 0.84 ALDH1A1 (0.49) ALDH1A1CYP1A2KDM4EHPGDCYP2C19
SCHEMBL2790613 0.82 DCUN1D1 (0.39) DCUN1D1ALDH1A1CYP1A2MEN1KMT2A
SCHEMBL7231545 0.82 PRSS1 (0.44) ALDH1A1CYP1A2MEN1KMT2AKDM4E
SCHEMBL1080850 0.78 PIN1 (0.47) ALDH1A1CYP1A2KDM4EHPGDCYP2C19
SCHEMBL811735 0.76 MAPT (0.46) ALDH1A1CYP1A2MEN1KMT2AKDM4E
Hydrochloric Acid SCHEMBL6861539 0.76 PIN1 (0.46) ALDH1A1CYP1A2KMT2AKDM4EHPGD
SCHEMBL26070599 0.76 MTOR (0.35) ALDH1A1CYP1A2MEN1KMT2AKDM4E
SCHEMBL6861535 0.75 PIN1 (0.41) ALDH1A1CYP1A2CYP2C19MTORADK
SCHEMBL19734173 0.75 MEN1 (0.47) ALDH1A1CYP1A2MEN1KMT2AKDM4E
Propionamide SCHEMBL27851687 0.74 KDM4E (0.43) ALDH1A1CYP1A2KDM4ECYP2C19PARP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8193258-B2 Sealant composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-06-05 US claimed
US-20100280143-A1 SEALANT COMPOSITION INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2010-11-04 US claimed
US-8193258-B2 Sealant composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2012-06-05 US disclosed
US-20100280143-A1 SEALANT COMPOSITION INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2010-11-04 US disclosed
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed