SCHEMBL3775767

SCHEMBL3775767

CC[Si](CC)(c1ccc(N)cc1)c1ccc(N)cc1.Nc1cccc2c(N)cccc12

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.48
HSD17B10 Q99714 3/20 0.48
TDP1 Q9NUW8 3/20 0.48
CYP3A4 P08684 2/20 0.48
HPGD P15428 2/20 0.48
TSHR P16473 2/20 0.48
ESR1 P03372 2/20 0.44
NR4A2 P43354 1/20 0.39
KEAP1 Q14145 1/20 0.38
KDM4E B2RXH2 3/20 0.37
NSD2 O96028 3/20 0.37
MEN1 O00255 2/20 0.37
TDP2 O95551 2/20 0.37
POLB P06746 2/20 0.37
MAPT P10636 2/20 0.37
BLM P54132 2/20 0.37
KMT2A Q03164 2/20 0.37
NPSR1 Q6W5P4 1/20 0.37
PARP1 P09874 2/20 0.36
CDC25B P30305 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL65440 0.84 ESR1 (0.58) ALDH1A1HSD17B10TDP1CYP3A4TSHR
SCHEMBL28581970 0.77 CYP3A4 (0.81) ALDH1A1HSD17B10TDP1CYP3A4HPGD
Benzidine SCHEMBL29076656 0.74 CYP3A4 (0.48) ALDH1A1HSD17B10TDP1CYP3A4HPGD
SCHEMBL48843 0.69 ALDH1A1 (1.00) ALDH1A1HSD17B10TDP1CYP3A4HPGD
SCHEMBL27912581 0.69 ALDH1A1 (1.00) ALDH1A1HSD17B10TDP1CYP3A4HPGD
SCHEMBL29365003 0.69 ALDH1A1 (1.00) ALDH1A1HSD17B10TDP1CYP3A4HPGD
SCHEMBL29286065 0.69 LMNA (0.47) ALDH1A1HSD17B10TDP1CYP3A4HPGD
SCHEMBL3036362 0.68 CYP3A4 (0.46) ALDH1A1TDP1CYP3A4TSHRESR1
SCHEMBL9243328 0.68 NR1H2 (0.45) ALDH1A1TDP1CYP3A4TSHRESR1
SCHEMBL29052437 0.67 ALDH1A1 (0.62) ALDH1A1HSD17B10TDP1CYP3A4HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7858200-B2 heat resistant layer containing a highly heat resistant polyimide and an adhesive layer on surface of heat-resistant layer which contains a thermoplastic polyimide; enables obtaining of a flexible metal clad laminate suppressed in dimensional change when produced by heat roll lamination; printed circuits KANEKA CORPORATION (JP) 2010-12-28 US disclosed
US-20080305346-A1 heat resistant layer containing a highly heat resistant polyimide and an adhesive layer on surface of heat-resistant layer which contains a thermoplastic polyimide; enables obtaining of a flexible metal clad laminate suppressed in dimensional change when produced by heat roll lamination; printed circuits KANEKA CORPORATION (JP) 2008-12-11 US disclosed