SCHEMBL3785809

SCHEMBL3785809

CCCCC(C(C)=O)C(=O)O.[Ag]

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 3/20 0.52
MAPK1 P28482 1/20 0.52
GPR84 Q9NQS5 5/20 0.45
FFAR1 O14842 1/20 0.45
SLC1A2 P43004 2/20 0.44
SLC1A1 P43005 2/20 0.44
SLC1A3 P43003 1/20 0.44
MAPT P10636 1/20 0.43
LCK P06239 1/20 0.43
PPARD Q03181 1/20 0.43
ZDHHC20 Q5W0Z9 1/20 0.43
ZDHHC2 Q9UIJ5 1/20 0.43
CHRM1 P11229 1/20 0.42
AKR1A1 P14550 1/20 0.42
CHRM3 P20309 1/20 0.42
HTR2A P28223 1/20 0.42
HTR2C P28335 1/20 0.42
ADRA1A P35348 1/20 0.42
HRH1 P35367 1/20 0.42
DRD3 P35462 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL321281 0.98 CA2 (0.54) CA2MAPK1GPR84FFAR1SLC1A2
SCHEMBL17106060 0.95 CA2 (0.52) CA2MAPK1GPR84FFAR1SLC1A2
SCHEMBL23093498 0.95 CA2 (0.52) CA2MAPK1GPR84FFAR1SLC1A2
SCHEMBL28473545 0.95 CA2 (0.52) CA2MAPK1GPR84FFAR1SLC1A2
SCHEMBL701584 0.95 CA2 (0.52) CA2MAPK1GPR84FFAR1SLC1A2
SCHEMBL5731738 0.91 GPR84 (0.56) CA2MAPK1GPR84FFAR1SLC1A2
SCHEMBL5972279 0.88 GPR84 (0.59) CA2GPR84FFAR1SLC1A2SLC1A1
SCHEMBL2702837 0.88 GPR84 (0.59) CA2GPR84FFAR1SLC1A2SLC1A1
SCHEMBL17480708 0.88 GPR84 (0.59) CA2GPR84FFAR1SLC1A2SLC1A1
SCHEMBL5972273 0.88 GPR84 (0.59) CA2GPR84FFAR1SLC1A2SLC1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10040960-B2 Silver ink composition, conductor and communication device TOPPAN FORMS CO., LTD. (JP) 2018-08-07 US claimed
US-9371465-B2 Silver ink composition TOPPAN FORMS CO., LTD. (JP) 2016-06-21 US claimed
US-20150259557-A1 SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE TOPPAN FORMS CO., LTD (JP) 2015-09-17 US claimed
US-20150008376-A1 Silver Ink Composition TOPPAN FORMS CO., LTD (JP) 2015-01-08 US claimed
US-12119131-B2 Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part SENJU METAL INDUSTRY CO., LTD. (JP) 2024-10-15 US disclosed
EP-4424441-A1 SINTERED MATERIAL, METAL SINTERED COMPACT, MANUFACTURING METHOD FOR SINTERED MATERIAL, MANUFACTURING METHOD FOR JOINED BODY, AND JOINED BODY Toppan Holdings Inc. (JP) 2024-09-04 EP disclosed
US-20240278321-A1 SINTERED MATERIAL, METAL SINTERED COMPACT, METHOD FOR PRODUCING SINTERED MATERIAL, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY TOPPAN HOLDINGS INC. (JP) 2024-08-22 US disclosed
WO-2023074580-A1 SINTERED MATERIAL, METAL SINTERED COMPACT, MANUFACTURING METHOD FOR SINTERED MATERIAL, MANUFACTURING METHOD FOR JOINED BODY, AND JOINED BODY トッパン・フォームズ株式会社 2023-05-04 WO disclosed
CN-112301346-B Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part 千住金属工业株式会社 2023-02-28 CN disclosed
US-11217359-B2 Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part SENJU METAL INDUSTRY CO., LTD. (JP) 2022-01-04 US disclosed
US-20210366627-A1 METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART SENJU METAL INDUSTRY CO., LTD. (JP) 2021-11-25 US disclosed
CN-111032912-B Method for synthesizing copper-silver alloy, method for forming conductive part, copper-silver alloy, and conductive part 千住金属工业株式会社 2021-03-09 CN disclosed
US-9371465-B2 Silver ink composition TOPPAN FORMS CO., LTD. (JP) 2016-06-21 US disclosed
US-20160155969-A1 Transistor THE UNIVERSITY OF TOKYO (JP) 2016-06-02 US disclosed
US-20150259557-A1 SILVER INK COMPOSITION, CONDUCTOR AND COMMUNICATION DEVICE TOPPAN FORMS CO., LTD (JP) 2015-09-17 US disclosed
US-20150008376-A1 Silver Ink Composition TOPPAN FORMS CO., LTD (JP) 2015-01-08 US disclosed
EP-1905756-B1 SILVER BETA-KETOCARBOXYLATE DERIVATIVES FOR FORMING SILVER METAL UNIV OSAKA (JP) 2013-02-27 EP disclosed
US-7683195-B2 Silver β-ketocarboxylate, material comprising the same for forming silver metal, and use thereof Osaka Industrial Promotional Organization (JP) 2010-03-23 US disclosed
US-20090209693-A1 Silver Beta-Ketocarboxylate, Material Comprising the Same for Forming Silver Metal, and Use Thereof OSAKA INDUSTRIAL PROMOTION (JP) 2009-08-20 US disclosed
EP-1905756-A1 SILVER BETA-KETOCARBOXYLATE, MATERIAL COMPRISING THE SAME FOR FORMING SILVER METAL, AND USE THEREOF OSAKA UNIVERSITY (JP) 2008-04-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090209693-A1 Silver Beta-Ketocarboxylate, Material Comprising the Same for Forming Silver Metal, and Use Thereof PCCA, BCKDK, MCCC2 CA2 133/4885MAPK1 3827/4885GPR84 2653/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.