SCHEMBL3786568

SCHEMBL3786568

Cc1c(N)ccc(-c2ccccc2N)c1C

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.59
L3MBTL1 Q9Y468 2/20 0.59
CYP3A4 P08684 3/20 0.50
TSHR P16473 1/20 0.50
PIK3CA P42336 1/20 0.50
HSD17B10 Q99714 2/20 0.44
TDP1 Q9NUW8 3/20 0.41
KDM4E B2RXH2 4/20 0.40
NPC1 O15118 3/20 0.40
GAA P10253 3/20 0.40
POLB P06746 1/20 0.39
SMN1; SMN2 Q16637 5/20 0.39
ALOX15 P16050 1/20 0.39
CASP1 P29466 1/20 0.39
CASP7 P55210 1/20 0.39
CRHBP P24387 1/20 0.39
CRHR2 Q13324 1/20 0.39
KEAP1 Q14145 1/20 0.39
NFE2L2 Q16236 1/20 0.39
HPGD P15428 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31607635 1.00 ALDH1A1 (0.59) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL31607679 1.00 ALDH1A1 (0.59) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL3781456 0.86 ALDH1A1 (0.65) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL29103604 0.86 ALDH1A1 (0.43) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL9667 0.85 CYP3A4 (0.50) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL7647167 0.84 ALDH1A1 (0.56) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL22434026 0.83 ALDH1A1 (0.68) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL8504753 0.83 POLB (0.48) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
Hydrochloric Acid SCHEMBL526310 0.83 POLB (0.48) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA
SCHEMBL3220414 0.83 POLB (0.48) ALDH1A1L3MBTL1CYP3A4TSHRPIK3CA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116987399-A Preparation method of low-cost high-temperature-resistant 3D printing wire composite resin 成都正威新材料研发有限公司 2023-11-03 CN claimed
CN-109280992-B Combined resin 3D printing wire and preparation method thereof 宏威高新材料有限公司 2021-08-17 CN claimed
CN-114245809-B Polyimide resin composition, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2024-07-09 CN disclosed
CN-112601777-B Polyimide resin, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2024-02-23 CN disclosed
CN-114605764-B Carrier composition for inorganic microparticle dispersion, slurry composition for inorganic microparticle dispersion, and method for producing inorganic microparticle-dispersed sheet 积水化学工业株式会社 2024-01-19 CN disclosed
CN-117362562-A Preparation and application of full conjugated three-dimensional covalent organic framework with photocatalytic hydrogen production performance 北京化工大学 2024-01-09 CN disclosed
CN-111989353-B Polyamide-imide resin, polyamide-imide varnish and polyamide-imide film 三菱瓦斯化学株式会社 2023-12-19 CN disclosed
CN-117136216-A Curable resin composition, laminated structure, cured product, and electronic component 太阳控股株式会社 2023-11-28 CN disclosed
CN-116987399-A Preparation method of low-cost high-temperature-resistant 3D printing wire composite resin 成都正威新材料研发有限公司 2023-11-03 CN disclosed
CN-116984216-A Coating method of cable surface polythioether imide coating 成都正威新材料研发有限公司 2023-11-03 CN disclosed
WO-2023171705-A1 METHOD FOR MANUFACTURING SINGLE-SIDE METAL-CLAD LAYERED PLATE 株式会社カネカ 2023-09-14 WO disclosed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-116194435-A Fluorine-containing diamine or salt thereof, method for producing fluorine-containing diamine or salt thereof, polyamide, method for producing polyamide, polyamide solution, polyamide cyclized body, method for producing polyamide cyclized body, insulating material for high-frequency electronic component, method for producing insulating material for high-frequency electronic component, high-frequency machine, and insulating material for producing high-frequency electronic component 中央硝子株式会社 2023-05-30 CN disclosed
CN-116157448-A Laminate body 三菱瓦斯化学株式会社 2023-05-23 CN disclosed
CN-112041371-B Polyimide resin, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2023-05-02 CN disclosed
CN-111936554-B Polyimide resin, polyimide varnish and polyimide film 三菱瓦斯化学株式会社 2023-04-28 CN disclosed
CN-115720585-A Composition containing polyimide or precursor thereof, cured product thereof, polyimide film containing cured product, laminate provided with polyimide film, and apparatus provided with laminate 株式会社LG化学 2023-02-28 CN disclosed
CN-109280992-B Combined resin 3D printing wire and preparation method thereof 宏威高新材料有限公司 2021-08-17 CN disclosed
US-20100087680-A1 METHOD FOR PRODUCING BIARYL COMPOUND SUMITOMO CHEMICAL COMPANY LIMITED (JP) 2010-04-08 US disclosed
EP-1914221-A1 PROCESS FOR PRODUCING BIARYL COMPOUND Sumitomo Chemical Company, Limited (JP) 2008-04-23 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100087680-A1 METHOD FOR PRODUCING BIARYL COMPOUND NISCH, BLVRB, BBOX1 ALDH1A1 4339/4885L3MBTL1 3838/4885CYP3A4 177/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.