SCHEMBL3787466

SCHEMBL3787466

O=C(O)CC(C(=O)O)c1nnn[nH]1

nearest known ligand 0.35

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.35
L3MBTL1 Q9Y468 2/20 0.35
GAA P10253 1/20 0.35
TDP1 Q9NUW8 3/20 0.35
POLB P06746 2/20 0.35
KDM4E B2RXH2 2/20 0.35
APOBEC3G Q9HC16 1/20 0.35
CYP1A2 P05177 1/20 0.33
TSHR P16473 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.32
SLC22A6 Q4U2R8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1641200 0.82 TDP1 (0.34) ALDH1A1TDP1POLBKDM4EAPOBEC3G
SCHEMBL4119473 0.81 AKR1C3 (0.32)
SCHEMBL8893948 0.77 KDM4E (0.32) ALDH1A1TDP1POLBKDM4EAPOBEC3G
SCHEMBL8341038 0.77 KDM4E (0.32) ALDH1A1TDP1POLBKDM4EAPOBEC3G
SCHEMBL4122580 0.74 APEX1 (0.35) ALDH1A1TDP1POLBKDM4EAPOBEC3G
SCHEMBL7121273 0.70 L3MBTL1 (0.33) ALDH1A1L3MBTL1GAATDP1POLB
SCHEMBL4112058 0.69 POLB (0.35) POLB
SCHEMBL1696772 0.69 HPGD (0.36) ALDH1A1TDP1KDM4E
SCHEMBL10231795 0.69 GRM1 (0.34) KDM4E
SCHEMBL9138194 0.69 ALDH1A1 (0.35) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115210411-B Filled microstructure and method of transporting the same 富士胶片株式会社 2025-04-01 CN disclosed
WO-2024203030-A1 JOINED BODY MANUFACTURING METHOD AND STRUCTURE SET 富士フイルム株式会社 2024-10-03 WO disclosed
CN-115003864-B Method for manufacturing metal-filled microstructure 富士胶片株式会社 2024-08-16 CN disclosed
CN-115135809-B Metal-filled microstructure, method for producing metal-filled microstructure, and structure 富士胶片株式会社 2024-07-19 CN disclosed
CN-113423872-B Anodic oxidation method and method for producing anisotropic conductive member 富士胶片株式会社 2024-06-04 CN disclosed
US-12002713-B2 Method for manufacturing structure FUJIFILM CORPORATION (JP) 2024-06-04 US disclosed
WO-2024053564-A1 PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE 住友ベークライト株式会社 2024-03-14 WO disclosed
CN-116830391-A Structure, method for producing anisotropic conductive member, and composition for forming protective layer 富士胶片株式会社 2023-09-29 CN disclosed
CN-116092726-A Anisotropic conductive member, method for producing anisotropic conductive member, structure, and method for producing structure 富士胶片株式会社 2023-05-09 CN disclosed
CN-116057681-A Structure, method for manufacturing structure, method for manufacturing bonded body, and method for manufacturing device 富士胶片株式会社 2023-05-02 CN disclosed
US-20080242090-A1 Using amino acid derivative and surfactant as polishing mixture FUJIFILM CORPORATION (JP) 2008-10-02 US disclosed
US-20080242090-A1 Using amino acid derivative and surfactant as polishing mixture FUJIFILM CORPORATION (JP) 2008-10-02 US disclosed
CN-101275057-A Metal-polishing liquid and polishing method FUJI FILM CORP (JP) 2008-10-01 CN disclosed
US-20080206995-A1 METAL-POLISHING LIQUID AND POLISHING METHOD THEREWITH FUJIFILM CORPORATION (JP) 2008-08-28 US disclosed
US-20080206995-A1 METAL-POLISHING LIQUID AND POLISHING METHOD THEREWITH FUJIFILM CORPORATION (JP) 2008-08-28 US disclosed
US-20080206995-A1 METAL-POLISHING LIQUID AND POLISHING METHOD THEREWITH FUJIFILM CORPORATION (JP) 2008-08-28 US disclosed
CN-101230238-A Metal-polishing liquid and polishing method therewith FUJIFILM CORP (JP) 2008-07-30 CN disclosed
US-20070200089-A1 Polishing liquid for metals FUJIFILM CORPORATION 2007-08-30 US disclosed
US-20070200089-A1 Polishing liquid for metals FUJIFILM CORPORATION 2007-08-30 US disclosed
US-20070200089-A1 Polishing liquid for metals FUJIFILM CORPORATION 2007-08-30 US disclosed