Vinyl Chloride

Vinyl Chloride

SCHEMBL379531

C=CCl.O=C1C=C(C2CCCCC2)C(=O)N1

nearest known ligand 0.37

Full drug profile on Sugi Atlas →

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
MAOA P21397 1/20 0.37
MAOB P27338 1/20 0.37
PTPN1 P18031 2/20 0.35
PTPRC P08575 1/20 0.35
PTPRF P10586 1/20 0.35
CDC25B P30305 1/20 0.35
DAO P14920 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28123322 0.89 MAOA (0.44) MAOAMAOBPTPN1PTPRCPTPRF
SCHEMBL8885354 0.89 MAOA (0.44) MAOAMAOBPTPN1PTPRCPTPRF
SCHEMBL28720 0.89 MAOA (0.44) MAOAMAOBPTPN1PTPRCPTPRF
SCHEMBL9250741 0.89 MAOA (0.44) MAOAMAOBPTPN1PTPRCPTPRF
Ammonia Solution, Strong SCHEMBL27877904 0.88 MAOA (0.42) MAOAMAOBPTPN1PTPRCPTPRF
SCHEMBL27630042 0.88 MAOA (0.45) MAOAMAOBPTPN1PTPRCPTPRF
SCHEMBL5202489 0.84 MAOA (0.41) MAOAMAOBPTPN1PTPRCPTPRF
Styrene SCHEMBL8466012 0.82 PTPN1 (0.39) MAOAMAOBPTPN1PTPRCPTPRF
Nitrous Acid SCHEMBL25432519 0.81 MAOA (0.38) MAOAMAOBPTPN1PTPRCPTPRF
SCHEMBL8563214 0.80 MAOA (0.34) MAOAMAOBDAO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 205 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024622-B2 Composition, thermoplastic resin composition using same, and molded article thereof ADEKA CORPORATION (JP) 2024-07-02 US disclosed
WO-2024048524-A1 ANTISTATIC AGENT, ANTISTATIC AGENT COMPOSITION CONTAINING SAME, ANTISTATIC RESIN COMPOSITION CONTAINING SAID ANTISTATIC AGENT OR SAID ANTISTATIC AGENT COMPOSITION, AND MOLDED BODY AND FILM THEREOF 株式会社ADEKA 2024-03-07 WO disclosed
WO-2024048380-A1 METHOD FOR PRODUCING FLAME-RETARDANT ADDITIVELY MANUFACTURED PRODUCT AND FLAME-RETARDANT ADDITIVELY MANUFACTURED PRODUCT 株式会社ADEKA 2024-03-07 WO disclosed
US-20230331891-A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ITEM FORMED FROM SAME TORAY INDUSTRIES, INC. (JP) 2023-10-19 US disclosed
WO-2023163017-A1 THERMOPLASTIC RESIN COMPOSITION FOR FUSED DEPOSITION MODELING, MODELED BODY, AND METHOD FOR PRODUCING SAME 株式会社ADEKA 2023-08-31 WO disclosed
EP-4219620-A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ITEM FORMED FROM SAME Toray Industries, Inc. (JP) 2023-08-02 EP disclosed
EP-3945102-B1 ANTISTATIC AGENT, ANTISTATIC COMPOSITION COMPRISING SAME, ANTISTATIC RESIN COMPOSITION COMPRISING SAME, AND MOLDED ARTICLE THEREOF ADEKA CORP (JP) 2023-08-02 EP disclosed
WO-2023112546-A1 RESIN ADDITIVE MASTERBATCH, SYNTHETIC RESIN COMPOSITION, AND MOLDED OBJECT 株式会社ADEKA 2023-06-22 WO disclosed
WO-2023085082-A1 RESIN ADDITIVE MASTERBATCH, SYNTHETIC RESIN COMPOSITION, AND MOLDED OBJECT 株式会社ADEKA 2023-05-19 WO disclosed
US-20230143936-A1 COMPOSITION, THERMOPLASTIC RESIN COMPOSITION USING SAME, AND MOLDED ARTICLE OF SAME ADEKA CORPORATION (JP) 2023-05-11 US disclosed
US-20050256234-A1 Flame retardant composition and flame retardant resin composition containing the composition ASAHI DENKA CO., LTD (JP) 2005-11-17 US disclosed
EP-1516907-A1 FLAME RETARDER COMPOSITION AND FLAME RETARDANT RESIN COMPOSITION CONTAINING THE COMPOSITION Asahi Denka Co., Ltd. (JP) 2005-03-23 EP disclosed
US-20030162870-A1 Flame-retardant resin composition ASAHI DENKA CO., LTD. (JP) 2003-08-28 US disclosed
US-20030088000-A1 Flame-retardant resin composition ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2003-05-08 US disclosed
EP-1304350-A1 Flame-retardant resin composition Asahi Denka Co., Ltd. (JP) 2003-04-23 EP disclosed
EP-1277794-A1 Flame-retardant resin composition ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2003-01-22 EP disclosed
US-6500887-B1 IMPROVED WEATHERABILITY AND RESISTANCE TO DISCOLORATION; TRIARYLTRIAZINE COMPOUND HAS AT LEAST ONE ARYL GROUP WHICH IS A 2-HYDROXYPHENYL GROUP HAVING, AT THE 4-POSITION THEREOF, AN ALKYL GROUP SUBSTITUTED BY A (METH)ACRYLOYLOXY GROUP. ASAHI DENKA KOGYO K.K. (JP) 2002-12-31 US disclosed
EP-1094094-A1 POLYMERIC MATERIAL COMPOSITION ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2001-04-25 EP disclosed
EP-0775723-B1 Phosphite compounds and synthetic resin compositions containing the same ASAHI DENKA KOGYO KK (JP) 1999-02-17 EP disclosed
EP-0775723-A1 Phosphite compounds and synthetic resin compositions containing the same ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1997-05-28 EP disclosed