SCHEMBL3835197

SCHEMBL3835197

CO[Si](C)(OC)OCCCCN=C=S

nearest known ligand 0.44

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 3/20 0.44
TRPA1 O75762 8/20 0.41
MIF P14174 5/20 0.39
KEAP1 Q14145 2/20 0.39
NFE2L2 Q16236 2/20 0.39
BACH1 O14867 2/20 0.39
MAFK O60675 2/20 0.39
ALDH1A1 P00352 1/20 0.39
LMNA P02545 1/20 0.39
TP53 P04637 1/20 0.39
EGFR P00533 1/20 0.39
PTGS2 P35354 1/20 0.39
GSK3B P49841 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29116550 0.81
SCHEMBL16908373 0.76
SCHEMBL551245 0.71 TRPA1 (0.47) NAAATRPA1MIFKEAP1NFE2L2
SCHEMBL3835195 0.71 NAAA (0.48) NAAATRPA1MIFKEAP1NFE2L2
SCHEMBL484045 0.69 MIF (0.68) NAAATRPA1MIFKEAP1NFE2L2
SCHEMBL6295813 0.69 DNM1 (0.35) NAAAALDH1A1LMNA
SCHEMBL841893 0.69
SCHEMBL550615 0.68 NAAA (0.45) NAAATRPA1MIFKEAP1NFE2L2
SCHEMBL25277699 0.67 DNM1 (0.39) NAAAALDH1A1
SCHEMBL2117630 0.67 HDAC3 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1448694-B1 CURABLE ORGANIC RESIN COMPOSITION DOW CORNING TORAY CO LTD (JP) 2009-10-07 EP disclosed
US-7446137-B2 Thermosetting resin and thiocyanato-containing organohydrocarbonoxysilane DOW CORNING TORAY SILICONE CO., LTD. (JP) 2008-11-04 US disclosed
US-20040249090-A1 Thermosetting organic resin composition DOW TORAY CO., LTD. (JP) 2004-12-09 US disclosed
EP-1448694-A1 CURABLE ORGANIC RESIN COMPOSITION Dow Corning Toray Silicone Co., Ltd. (JP) 2004-08-25 EP disclosed
WO-2003037976-A1 CURABLE ORGANIC RESIN COMPOSITION DOW CORNING TORAY SILICONE CO., LTD. (JP) 2003-05-08 WO disclosed