SCHEMBL383743

SCHEMBL383743

O=[N+]([O-])c1cccc([N+](=O)[O-])c1CS(=O)(=O)O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR35 Q9HC97 2/20 0.52
TDP1 Q9NUW8 2/20 0.48
KMT2A Q03164 2/20 0.47
MEN1 O00255 1/20 0.47
S100A4 P26447 2/20 0.46
CA1 P00915 1/20 0.44
CA2 P00918 1/20 0.44
MMP1 P03956 1/20 0.44
MMP2 P08253 1/20 0.44
MMP9 P14780 1/20 0.44
MMP8 P22894 1/20 0.44
MMP13 P45452 1/20 0.44
POLB P06746 1/20 0.44
ACP1 P24666 1/20 0.44
ALDH1A1 P00352 3/20 0.42
TSHR P16473 3/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
PTPRC P08575 1/20 0.42
ERN1 O75460 1/20 0.42
F2 P00734 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7783117 0.83 GPR35 (0.47) GPR35TDP1KMT2AMEN1S100A4
SCHEMBL29856630 0.81 GPR35 (0.49) GPR35TDP1KMT2AMEN1CA1
SCHEMBL64725 0.81 ALDH1A1 (0.56) GPR35TDP1KMT2AMEN1CA1
Hydrochloric Acid SCHEMBL27512791 0.79 ALDH1A1 (0.55) GPR35TDP1KMT2AMEN1CA1
SCHEMBL28669190 0.79 TDP1 (0.52) GPR35TDP1KMT2AMEN1S100A4
SCHEMBL2474011 0.79 TDP1 (0.53) TDP1CA1CA2MMP1MMP2
SCHEMBL8432870 0.78 GPR35 (0.53) GPR35TDP1KMT2AMEN1S100A4
SCHEMBL14991413 0.78 KMT2A (0.50) GPR35TDP1KMT2AMEN1S100A4
SCHEMBL14991414 0.78 KMT2A (0.50) GPR35TDP1KMT2AMEN1S100A4
SCHEMBL514833 0.77 GPR35 (0.58) GPR35TDP1KMT2AMEN1S100A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 454 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4607277-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND ENHANCING ADHESION Ycchem Co., Ltd. (KR) 2025-08-27 EP claimed
US-20250199406-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND ENHANCING ADHESION YCCHEM CO., LTD. (KR) 2025-06-19 US claimed
CN-117608167-A Photoresist composition and method for producing photoresist pattern 南开大学 2024-02-27 CN claimed
US-11906900-B2 Chemically amplified positive photoresist composition for improving pattern profile YOUNG CHANG CHEMICAL CO., LTD (KR) 2024-02-20 US claimed
CN-109429511-B Positive photoresist composition, photoresist pattern using the same, and method for manufacturing photoresist pattern 株式会社LG化学 2022-01-28 CN claimed
US-20210216013-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE YOUNG CHANG CHEMICAL CO., LTD (KR) 2021-07-15 US claimed
US-20190146338-A1 POSITIVE PHOTORESIST COMPOSITION, PHOTORESIST PATTERN USING THE SAME, AND MANUFACTURING METHOD OF THE PHOTORESIST PATTERN LG CHEM, LTD. (KR) 2019-05-16 US claimed
WO-2015135864-A1 PHOTOSENSITIVE POLYMER RESIN, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND LAYER MADE THEREFROM SOLVAY SA (BE) 2015-09-17 WO claimed
EP-2918616-A1 Photosensitive polymer resin, photosensitive resin composition comprising the same, and layer made therefrom Solvay SA (BE) 2015-09-16 EP claimed
US-9023980-B2 Organic passivation layer composition, transistor and/or electronic device including organic passivation layer fabricated therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-05-05 US claimed
US-6964839-B1 Photosensitive polymer having cyclic backbone and resist composition containing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-11-15 US claimed
US-6893793-B2 Photosensitive polymer and chemically amplified photoresist composition containing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-05-17 US claimed
EP-0921439-B1 Photosensitive polymer and chemically amplified resist composition using the same SAMSUNG ELECTRONICS CO LTD (KR) 2004-03-03 EP claimed
US-20030170563-A1 Photosensitive polymer and chemically amplified photoresist composition containing the same JUNG DONG-WON (KR) 2003-09-11 US claimed
US-20020193542-A1 Photosensitive polymer and chemically amplified photoresist composition containing the same JUNG DONG-WON (KR) 2002-12-19 US claimed
US-6472120-B1 IMPROVED ETCHING RESISTANCE ADHESION, WETTABILITY; FIRST MONOMER IS NORBORNENE ESTER, AND A SECOND MONOMER IS MALEIC ANHYDRIDE SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-29 US claimed
US-6143466-A Chemically amplified photoresist composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-11-07 US claimed
US-5691396-A POLYHYDROXYBENZYLSILSESQUIOXANE SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-11-25 US claimed
US-5164278-A Aromatic hydroxy compound INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1992-11-17 US claimed
EP-0445058-A1 Speed enhancers for acid sensitized resists International Business Machines Corporation (US) 1991-09-04 EP claimed