SCHEMBL3846629

SCHEMBL3846629

C=C(C)C(=O)C(=O)CC[Si](OC(C)=O)(OC(C)=O)OC(C)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7880169 0.89
SCHEMBL421091 0.82 ALDH1A1 (0.33)
SCHEMBL2711610 0.79 THRB (0.32)
SCHEMBL11647036 0.75
SCHEMBL707980 0.73 ALDH1A1 (0.37)
SCHEMBL5073193 0.73 ALDH1A1 (0.32)
SCHEMBL865267 0.73 ALDH1A1 (0.37)
SCHEMBL27769555 0.73 LMNA (0.40)
SCHEMBL2205863 0.72
SCHEMBL3362339 0.70 THRB (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8227058-B2 Heat-shrinkable laminated film, molded product and heat-shrinkable label employing the film, and container MITSUBISHI PLASTICS, INC. (JP) 2012-07-24 US disclosed
US-20090202758-A1 HEAT-SHRINKABLE LAMINATED FILM, MOLDED PRODUCT AND HEAT SHRINKABLE LABEL AND CONTAINER, EMPLOYING THE FILM MITSUBISHI PLASTICS , INC. (JP) 2009-08-13 US disclosed
EP-2036718-A1 HEAT-SHRINKABLE LAMINATED FILM, AND MOLDINGS, HEAT SHRINKABLE LABELS AND CONTAINERS, MADE BY USING THE FILM MITSUBISHI PLASTICS, INC. (JP) 2009-03-18 EP disclosed
US-20090022916-A1 HEAT-SHRINKABLE LAMINATED FILM, MOLDED PRODUCT AND HEAT-SHRINKABLE LABEL EMPLOYING THE FILM, AND CONTAINER MITSUBISHI PLASTICS, INC. (JP) 2009-01-22 US disclosed