SCHEMBL3848174

SCHEMBL3848174

C#Cc1c(-c2ccccc2)[c]ccc1-c1ccccc1

nearest known ligand 0.36

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.36
CYP2A6 P11509 1/20 0.33
BACE1 P56817 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3845811 0.75 CYP19A1 (0.34) CYP19A1CYP2A6
SCHEMBL5183978 0.75 APP (0.38) CYP19A1
SCHEMBL891578 0.72 LMNA (0.36) CYP2A6BACE1
SCHEMBL3840723 0.71 CYP19A1 (0.34) CYP19A1CYP2A6
SCHEMBL3845011 0.71 ADORA1 (0.35) CYP19A1CYP2A6BACE1
SCHEMBL3850051 0.70 CYP2A6 (0.33) CYP2A6BACE1
SCHEMBL3846352 0.70 LMNA (0.31)
SCHEMBL4580879 0.67 ALDH1A1 (0.47) CYP2A6BACE1
SCHEMBL185890 0.67 ALDH1A1 (0.41) CYP2A6BACE1
SCHEMBL8510133 0.67 ALDH1A1 (0.37) CYP2A6BACE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7307137-B2 CROSSLINKING SHELL-CORE POLYMER HONEYWELL INTERNATIONAL INC. (US) 2007-12-11 US claimed
EP-1373358-A4 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF HONEYWELL INT INC (US) 2005-03-16 EP claimed
US-20040158024-A1 CROSSLINKING SHELL-CORE POLYMER HONEYWELL INTERNATIONAL INC. 2004-08-12 US claimed
EP-1373358-A1 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF Honeywell International, Inc. (US) 2004-01-02 EP claimed
WO-2002081546-A1 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF HONEYWELL INTERNATIONAL INC. (US) 2002-10-17 WO claimed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed
US-7307137-B2 CROSSLINKING SHELL-CORE POLYMER HONEYWELL INTERNATIONAL INC. (US) 2007-12-11 US disclosed
EP-1373358-A4 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF HONEYWELL INT INC (US) 2005-03-16 EP disclosed
US-6841256-B2 Low dielectric constant polyorganosilicon materials generated from polycarbosilanes HONEYWELL INTERNATIONAL INC. (US) 2005-01-11 US disclosed
US-20040158024-A1 CROSSLINKING SHELL-CORE POLYMER HONEYWELL INTERNATIONAL INC. 2004-08-12 US disclosed
EP-1373358-A1 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF Honeywell International, Inc. (US) 2004-01-02 EP disclosed
WO-2002081546-A1 LOW DIELECTRIC CONSTANT MATERIALS AND METHODS OF PREPARATION THEREOF HONEYWELL INTERNATIONAL INC. (US) 2002-10-17 WO disclosed