SCHEMBL384906

SCHEMBL384906

CN(C)Cc1ccc(N(C)C)cc1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.64
TSHR P16473 4/20 0.64
CYP3A4 P08684 2/20 0.64
MAPK1 P28482 2/20 0.64
TDP1 Q9NUW8 2/20 0.64
HRH3 Q9Y5N1 2/20 0.64
ALOX15 P16050 2/20 0.58
HSD17B10 Q99714 1/20 0.58
TAAR1 Q96RJ0 1/20 0.54
TP53 P04637 1/20 0.46
KMT2A Q03164 2/20 0.46
MEN1 O00255 1/20 0.46
NOS3 P29474 1/20 0.45
NOS1 P29475 1/20 0.45
NOS2 P35228 1/20 0.45
RAB9A P51151 1/20 0.45
CALM1 P0DP23 1/20 0.44
G6PC1 P35575 1/20 0.43
KDM4E B2RXH2 1/20 0.43
GAA P10253 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL659509 0.86 HRH3 (0.82) ALDH1A1TSHRHRH3TAAR1NOS3
SCHEMBL12414402 0.84 ALDH1A1 (0.64) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL12167936 0.84 HRH3 (0.64) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL6887328 0.83 ALDH1A1 (0.77) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL25645368 0.80 ALDH1A1 (0.58) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL21078333 0.80 ALDH1A1 (0.58) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL7258143 0.80 HRH3 (0.58) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL17886950 0.78 ALDH1A1 (0.56) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL19718266 0.78 HRH3 (0.58) ALDH1A1TSHRCYP3A4MAPK1TDP1
SCHEMBL21078332 0.78 ALDH1A1 (0.56) ALDH1A1TSHRCYP3A4MAPK1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 452 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113683984-B Resin composition, master batch containing same and application thereof 苏州福斯特光伏材料有限公司 2023-11-24 CN claimed
US-9497856-B2 Laminated structure, dry film and method of producing laminated structure TAIYO INK MFG. CO., LTD. (JP) 2016-11-15 US claimed
US-20100255215-A1 Composition of Decolorable Ink and Decoloring Method GUAM INDUSTRY CORP. (KR) 2010-10-07 US claimed
US-20070269743-A1 Conductive lithographic polymer and method of making devices using same SHIA REBECCA 2007-11-22 US claimed
US-20060051707-A1 Conductive lithographic polymer and method of making devices using same INTEL CORPORATION 2006-03-09 US claimed
WO-2026105769-A1 THERMOSETTING RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD 太陽ホールディングス株式会社 2026-05-21 WO disclosed
EP-4720167-A1 METHOD FOR MANUFACTURING ENCAPSULANT COMPOSITION, ENCAPSULANT COMPOSITION, AND APPARATUS FOR MANUFACTURING ENCAPSULANT COMPOSITION Dow Silicones Corporation (US) 2026-04-08 EP disclosed
US-12448490-B2 Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same LG CHEM, LTD. (KR) 2025-10-21 US disclosed
US-12441843-B2 Diffraction light guide plate and manufacturing method thereof LG CHEM, LTD. (KR) 2025-10-14 US disclosed
US-12443101-B2 Cured coating film TAIYO HOLDINGS CO., LTD. (JP) 2025-10-14 US disclosed
US-20250297048-A1 (METH)ACRYLATE-BASED RESIN, AND DRY FILM SOLDER RESIST COMPRISING SAME LG CHEM, LTD. (KR) 2025-09-25 US disclosed
US-20250289975-A1 CURED PRODUCT AND PRINTED WIRING BOARD TAIYO HOLDINGS CO., LTD. (JP) 2025-09-18 US disclosed
US-5534565-A DICYANDIAMIDE DERIVATIVES FOR LAMINATES ALLIEDSIGNAL INC. (US) 1996-07-09 US disclosed
EP-0540644-B1 SUBSTITUTED CYANOGUANIDINES AS CURING AGENTS FOR EPOXY RESINS ALLIED SIGNAL INC (US) 1995-08-23 EP disclosed
US-5387656-A Soluble in various solvents; do not require the use of undesirable solvents necessary with cyanoguanidine itself ALLIEDSIGNAL INC. (US) 1995-02-07 US disclosed
EP-0612330-A1 Epoxy compositions containing bis-dicyandiamides as curing agents AlliedSignal Inc. (US) 1994-08-31 EP disclosed
WO-1994014866-A1 SOLVENT FREE EPOXY RESIN COMPOSITIONS ALLIEDSIGNAL, INC. (US) 1994-07-07 WO disclosed
WO-1993010168-A1 BIS-DICYANDIAMIDES AS CURING AGENTS FOR EPOXY RESINS ALLIED-SIGNAL INC. (US) 1993-05-27 WO disclosed
EP-0540644-A1 SUBSTITUTED CYANOGUANIDINES AS CURING AGENTS FOR EPOXY RESINS. ALLIED SIGNAL INC (US) 1993-05-12 EP disclosed
WO-1992001726-A1 SUBSTITUTED CYANOGUANIDINES AS CURING AGENTS FOR EPOXY RESINS ALLIED-SIGNAL INC. (US) 1992-02-06 WO disclosed