SCHEMBL3871305

SCHEMBL3871305

Cc1ccccc1N(C)CN(C)c1ccccc1C

nearest known ligand 0.46

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.43
ACHE P22303 1/20 0.43
LMNA P02545 3/20 0.42
CYP3A4 P08684 2/20 0.42
TRPM8 Q7Z2W7 1/20 0.42
NOTUM Q6P988 1/20 0.41
SIGMAR1 Q99720 1/20 0.40
ALDH1A1 P00352 5/20 0.38
TP53 P04637 3/20 0.38
SLC6A2 P23975 1/20 0.38
SLC6A4 P31645 1/20 0.38
GAA P10253 1/20 0.37
MAPT P10636 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
KDM4E B2RXH2 1/20 0.37
KMT2A Q03164 2/20 0.36
HSD17B1 P14061 1/20 0.36
HSD17B2 P37059 1/20 0.36
MEN1 O00255 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5430919 0.83 LMNA (0.49) TSHRACHELMNACYP3A4TRPM8
SCHEMBL25766263 0.81 NOTUM (0.46) TSHRACHELMNACYP3A4TRPM8
SCHEMBL5421931 0.79 TP53 (0.45) TSHRACHELMNACYP3A4TRPM8
SCHEMBL763820 0.79 AR (0.41) TSHRACHELMNACYP3A4TRPM8
SCHEMBL450600 0.78 TRPM8 (0.57) TSHRTRPM8ALDH1A1SLC6A2SLC6A4
SCHEMBL7186151 0.78 CARM1 (0.42) TSHRACHELMNACYP3A4TRPM8
SCHEMBL11702654 0.78 ALDH1A1 (0.45) TSHRLMNACYP3A4TRPM8NOTUM
SCHEMBL18873158 0.78 NOTUM (0.38) TSHRACHELMNACYP3A4TRPM8
SCHEMBL18426171 0.78 LMNA (0.45) TSHRACHELMNACYP3A4TRPM8
SCHEMBL14088065 0.78 AOC3 (0.39) TSHRACHELMNACYP3A4TRPM8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210024816-A1 HIGH PERFORMANCE PROPPANTS PREFERRED TECHNOLOGY, LLC 2021-01-28 US claimed
WO-2016183313-A1 HIGH PERFORMANCE PROPPANTS PREFERRED TECHNOLOGY, LLC (US) 2016-11-17 WO claimed
US-6348429-B1 POLYMERIZATION INITIATOR OF HIGH MOLECULAR WEIGHT DIACYL PEROXIDE AND TERTIARY AMINE; CEMENTS FOR BIOMEDICAL EQUIPMENT, ORTHOPEDICS, DENTISTRY THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 2002-02-19 US claimed
CN-118139742-A Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package 株式会社力森诺科 2024-06-04 CN disclosed
US-11827789-B2 Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof RESONAC CORPORATION (JP) 2023-11-28 US disclosed
WO-2023074646-A1 RESIN-COATED METAL FOIL, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE 株式会社レゾナック 2023-05-04 WO disclosed
US-20220186037-A1 COATED PARTICLES FOR TURF INFILL PREFERRED TECHNOLOGY, LLC 2022-06-16 US disclosed
WO-2022125953-A1 COATED PARTICLES FOR TURF INFILL COGNITION THERAPEUTICS, INC. (US) 2022-06-16 WO disclosed
WO-2022126013-A1 COATED PARTICLES FOR TURF INFILL PREFERRED TECHNOLOGY, LLC (US) 2022-06-16 WO disclosed
US-11331888-B2 Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-05-17 US disclosed
CN-109565931-B Composite film for electronic device using high-frequency band signal, printed wiring board, and method for manufacturing the same 昭和电工材料株式会社 2022-04-29 CN disclosed
US-7384683-B2 Substrate for flexible printed wiring board and method for manufacturing the same UNITIKA LTD. (JP) 2008-06-10 US disclosed
US-20070071984-A1 Substrate for flexible printed wiring board and method for manufacturing the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2007-03-29 US disclosed
US-20070026227-A1 Adhesive aid composition NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2007-02-01 US disclosed
EP-1666556-A1 ADHESIVE AID COMPOSITION Nippon Kayaku Kabushiki Kaisha (JP) 2006-06-07 EP disclosed
EP-1667501-A1 SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME UNITIKA LTD. (JP) 2006-06-07 EP disclosed
US-6348429-B1 POLYMERIZATION INITIATOR OF HIGH MOLECULAR WEIGHT DIACYL PEROXIDE AND TERTIARY AMINE; CEMENTS FOR BIOMEDICAL EQUIPMENT, ORTHOPEDICS, DENTISTRY THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 2002-02-19 US disclosed
EP-0758268-A4 POLYMER CEMENT COMPOSITIONS AND INITIATORS FOR USE IN THE PREPARATION THEREOF UNIV CALIFORNIA (US) 1999-04-28 EP disclosed
EP-0758268-A1 POLYMER CEMENT COMPOSITIONS AND INITIATORS FOR USE IN THE PREPARATION THEREOF THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1997-02-19 EP disclosed
WO-1995030480-A2 INITIATORS OF TERTIARY AMINE/PEROXIDE AND POLYMER THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 1995-11-16 WO disclosed