SCHEMBL3896348

SCHEMBL3896348

COc1cc(N=C=O)cc(N=C=O)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.43
CYP3A4 P08684 4/20 0.41
TDP1 Q9NUW8 2/20 0.41
HPGD P15428 2/20 0.41
TRPA1 O75762 1/20 0.39
MAPK1 P28482 1/20 0.38
TSHR P16473 1/20 0.35
CYP1A1 P04798 1/20 0.34
CYP1B1 Q16678 1/20 0.34
KMT2A Q03164 3/20 0.33
POLB P06746 1/20 0.33
GRIN2D O15399 1/20 0.33
GRIN3B O60391 1/20 0.33
GRIN1 Q05586 1/20 0.33
GRIN2A Q12879 1/20 0.33
GRIN2B Q13224 1/20 0.33
GRIN2C Q14957 1/20 0.33
GRIN3A Q8TCU5 1/20 0.33
HTR3E A5X5Y0 1/20 0.33
HTR3B O95264 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL135276 0.95 ALDH1A1 (0.50) ALDH1A1CYP3A4TDP1HPGDTRPA1
SCHEMBL5437206 0.86 TDP1 (0.40) ALDH1A1CYP3A4TDP1HPGDTRPA1
SCHEMBL29556081 0.86 CYP3A4 (0.36) ALDH1A1CYP3A4TDP1HPGDTRPA1
SCHEMBL7530889 0.83 CYP1A2 (0.47) ALDH1A1CYP3A4TDP1HPGDCYP1A1
SCHEMBL856528 0.82 RXRA (0.40) ALDH1A1CYP3A4TDP1HPGDTRPA1
SCHEMBL17170063 0.82 CYP3A4 (0.35) ALDH1A1CYP3A4TDP1HPGDTRPA1
SCHEMBL12539381 0.80 LMNA (0.44) ALDH1A1TDP1MAPK1TSHRKMT2A
SCHEMBL131042 0.80 TDP1 (0.50) ALDH1A1CYP3A4TDP1HPGDTRPA1
SCHEMBL29541540 0.79 HTR3E (0.53) ALDH1A1CYP3A4TDP1MAPK1KMT2A
SCHEMBL23447 0.79 HTR3E (0.53) ALDH1A1CYP3A4TDP1MAPK1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230265323-A1 ADHESIVE COMPOSITION AND ADHESIVE SHEET USING THE SAME DONGWOO FINE-CHEM CO., LTD. (KR) 2023-08-24 US disclosed
CN-116529330-A Adhesive composition and adhesive sheet using same 东友精细化工有限公司 2023-08-01 CN disclosed
US-10903435-B2 Flexible display device DONGWOO FINE-CHEM CO., LTD. (KR) 2021-01-26 US disclosed
US-20190115547-A1 FLEXIBLE DISPLAY DEVICE DONGWOO FINE-CHEM CO., LTD. (KR) 2019-04-18 US disclosed
EP-3233816-B1 DIFUNCTIONAL MONOMER COMPOUNDS CONTAINING CLICKABLE PENDANT FURYL GROUP AND POLYMERS THEREFROM COUNCIL SCIENT IND RES (IN) 2019-02-20 EP disclosed
EP-2910578-B1 METHOD FOR PRODUCING END-MODIFIED POLYBUTADIENE OR END-MODIFIED HYDROGENATED POLYBUTADIENE AND COMPOSITION CONTAINING SAME NIPPON SODA CO (JP) 2018-04-25 EP disclosed
US-9815922-B2 Method for producing end-modified polybutadiene or end-modified hydrogenated polybutadiene and composition containing same NIPPON SODA CO., LTD. (JP) 2017-11-14 US disclosed
US-20150240009-A1 METHOD FOR PRODUCING END-MODIFIED POLYBUTADIENE OR END-MODIFIED HYDROGENATED POLYBUTADIENE AND COMPOSITION CONTAINING SAME NIPPON SODA CO., LTD. (JP) 2015-08-27 US disclosed
EP-2910578-A1 METHOD FOR PRODUCING END-MODIFIED POLYBUTADIENE OR END-MODIFIED HYDROGENATED POLYBUTADIENE AND COMPOSITION CONTAINING SAME Nippon Soda Co., Ltd. (JP) 2015-08-26 EP disclosed
EP-2620455-B1 METHOD FOR PRODUCING TERMINAL ACRYLIC-MODIFIED POLYBUTADIENE OR TERMINAL ACRYLIC-MODIFIED HYDROGENATED POLYBUTADIENE, AND COMPOSITION CONTAINING SAME NIPPON SODA CO (JP) 2015-05-13 EP disclosed
US-20050158911-A1 Process for producing circuit board having built-in electronic part NITTO DENKO CORPORATION 2005-07-21 US disclosed
EP-1555862-A2 Process for producing circuit board having built-in electronic part NITTO DENKO CORPORATION (JP) 2005-07-20 EP disclosed
EP-1512706-A2 Thermosetting resin NITTO DENKO CORPORATION (JP) 2005-03-09 EP disclosed
US-20050049385-A1 Thermosetting resin NITTO DENKO CORPORATION 2005-03-03 US disclosed
EP-1460093-A1 Polycarbodiimide copolymer and production method thereof NITTO DENKO CORPORATION (JP) 2004-09-22 EP disclosed
US-20040178423-A1 Adhesive film for underfill and semiconductor device using the same NITTO DENKO CORPORATION 2004-09-16 US disclosed
US-20040176547-A1 Polycarbodiimide copolymer and production method thereof NITTO DENKO CORPORATION 2004-09-09 US disclosed
US-20040158021-A1 Polycarbodiimide having high index of refraction and production method thereof NITTO DENKO CORPORATION 2004-08-12 US disclosed
EP-1445269-A1 Polycarbodiimide having high index of refraction and production method thereof NITTO DENKO CORPORATION (JP) 2004-08-11 EP disclosed
US-4318850-A Carboxamide type azomethine pigment ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1982-03-09 US disclosed