Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CDC25A | P30304 | 6/20 | 0.30 |
| ▸ | CDC25B | P30305 | 6/20 | 0.30 |
| ▸ | CDC25C | P30307 | 5/20 | 0.30 |
| ▸ | KAT2A | Q92830 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6516632 | 0.68 | CDC25B (0.36) | CDC25ACDC25BCDC25C | |
| SCHEMBL6187511 | 0.64 | THRB (0.50) | — | |
| SCHEMBL2175960 | 0.64 | MAPK1 (0.34) | — | |
| SCHEMBL1463689 | 0.63 | SIRT2 (0.32) | — | |
| SCHEMBL20641871 | 0.62 | TP53 (0.30) | — | |
| SCHEMBL14127769 | 0.61 | CETP (0.33) | — | |
| Butane SCHEMBL727081 | 0.61 | FFAR3 (0.36) | CDC25ACDC25BCDC25CKAT2A | |
| SCHEMBL3153596 | 0.57 | — | — | |
| Hydrochloric Acid SCHEMBL11613521 | 0.56 | CYP2C19 (0.38) | — | |
| SCHEMBL21950897 | 0.55 | FFAR3 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7541404-B2 | Water-borne resin composition and electrocoating composition | NIPPON PAINT CO., LTD. (JP) | 2009-06-02 | — | — | US | disclosed |
| EP-1923436-B1 | Powder compositions comprising Beta-Hydroxyalkyl amides from the ring-opening of acidic coumpounds | ROHM & HAAS (US) | 2009-01-21 | — | — | EP | disclosed |
| EP-1923436-A1 | Powder compositions comprising Beta-Hydroxyalkyl amides from the ring-opening of acidic coumpounds | Rohm and Haas Company (US) | 2008-05-21 | — | — | EP | disclosed |
| US-20080114132-A1 | Powder compositions comprising beta-hydroxyalkyl amides from the ring-opening of acidic compounds | AKZO NOBEL COATINGS INTERNATIONAL B.V. (NL) | 2008-05-15 | — | — | US | disclosed |
| US-20070219308-A1 | Water-borne resin composition and electrocoating composition | NIPPON PAINT CO., LTD. (JP) | 2007-09-20 | — | — | US | disclosed |
| US-7259206-B2 | Water-borne resin composition and electrocoating composition | NIPPON PAINT CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20050059774-A1 | Water-borne resin composition and electrocoating composition | NIPPON PAINT CO., LTD. (JP) | 2005-03-17 | — | — | US | disclosed |
| US-6638631-B2 | Stress relieving films comprising crosslinked mixtures of polysiloxanes, polyimides, polyamideimides copolymers and/or polyamides used as interfaces for semiconductors or printed circuits | HITACHI, LTD. (JP) | 2003-10-28 | — | — | US | disclosed |
| US-6638352-B2 | For use in printed circuit boards; semiconductors | HITACHI, LTD. (JP) | 2003-10-28 | — | — | US | disclosed |
| US-20030049193-A1 | For use in printed circuit boards; semiconductors | HITACHI,L TD (JP) | 2003-03-13 | — | — | US | disclosed |
| US-4598117-A | MOLDING MATERIALS, POLYIMIDES; POLYETHERS, POLYESTERS, IMPACT STRENGTH | GENERAL ELECTRIC COMPANY (US) | 1986-07-01 | — | — | US | disclosed |
| US-4594377-A | From low molecular weight diol, dicarboxylic acid and polyoxyalkylene diimide diacid | GENERAL ELECTRIC COMPANY (US) | 1986-06-10 | — | — | US | disclosed |
| EP-0180148-A2 | Modified thermoplastic copolyetherimide ester elastomers | GENERAL ELECTRIC COMPANY (US) | 1986-05-07 | — | — | EP | disclosed |
| EP-0180149-A2 | High molecular weight diimide diacids and diimide diesters of tricarboxylic anhydrides | GENERAL ELECTRIC COMPANY (US) | 1986-05-07 | — | — | EP | disclosed |
| EP-0179470-A2 | Thermoplastic polyetherimide ester elastomers | GENERAL ELECTRIC COMPANY (US) | 1986-04-30 | — | — | EP | disclosed |
| US-4556688-A | STRESS-STRAIN RESISTANT, LOW TENSILE SET, HIGH MELTING POINT, HIGH-STRENGTH, TOUGHNESS, FLEXIBILITY; DIOL, DICARBOXYLIC ACID, POLYOXYALKYLENEDIAMINE, TRICARBOXYLIC ACID | GENERAL ELECTRIC COMPANY (US) | 1985-12-03 | — | — | US | disclosed |
| US-4556705-A | Thermoplastic polyetherimide ester elastomers | GENERAL ELECTRIC COMPANY (US) | 1985-12-03 | — | — | US | disclosed |
| US-4552950-A | Polyetherimide esters | GENERAL ELECTRIC COMPANY (US) | 1985-11-12 | — | — | US | disclosed |
| US-4544734-A | FLEXIBILITY | GENERAL ELECTRIC COMPANY (US) | 1985-10-01 | — | — | US | disclosed |
| US-3953310-A | ACRYLIC POLYMER, POLYESTER | DAINICHI-NIPPON CABLES, LTD. (JA) | 1976-04-27 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20030049193-A1 | For use in printed circuit boards; semiconductors | ASIC1, ASIC3, RIOK2 | CDC25A 2716/4885CDC25B 2083/4885CDC25C 2395/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.