Hydrochloric Acid

Hydrochloric Acid

SCHEMBL39081

CCN(CC)c1ccc(-c2sc3ccccc3[n+]2Cc2ccccc2)cc1.[Cl-]

nearest known ligand 0.47

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ACHE known ✓ P22303 2/20 0.42
INSR P06213 11/20 0.47
MEN1 O00255 2/20 0.43
KMT2A Q03164 2/20 0.43
HSP90AA1 P07900 1/20 0.43
CNR2 P34972 3/20 0.41
RXFP1 Q9HBX9 1/20 0.40
GPR35 Q9HC97 1/20 0.40
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19305176 0.99 INSR (0.48) INSRMEN1KMT2AHSP90AA1ACHE
Hydrochloric Acid SCHEMBL19305185 0.87 INSR (0.52) INSRMEN1KMT2AHSP90AA1ACHE
Hydrochloric Acid SCHEMBL39306 0.87 APP (0.46) INSRMEN1KMT2AHSP90AA1ACHE
Hydrochloric Acid SCHEMBL40198 0.87 INSR (0.61) INSRMEN1KMT2A
SCHEMBL19305184 0.86 INSR (0.53) INSRMEN1KMT2AHSP90AA1ACHE
SCHEMBL19305174 0.86 APP (0.44) INSRMEN1KMT2AHSP90AA1ACHE
SCHEMBL19305173 0.86 INSR (0.62) INSRMEN1KMT2A
Hydrochloric Acid SCHEMBL39544 0.84 ALDH1A1 (0.38) INSRMEN1KMT2AHSP90AA1ACHE
SCHEMBL19305178 0.83 MAPT (0.39) INSRMEN1KMT2AHSP90AA1ACHE
Hydrochloric Acid SCHEMBL39637 0.75 APP (0.59) INSRMEN1KMT2AGPR35

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP claimed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US claimed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP claimed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP claimed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US claimed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US claimed
WO-2011147448-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2011-12-01 WO claimed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP claimed
EP-3034654-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-10-25 EP disclosed
US-20170275767-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-28 US disclosed
EP-2241653-B1 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2017-09-06 EP disclosed
EP-3034654-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2016-06-22 EP disclosed
US-8758634-B2 Composition and method for micro etching of copper and copper alloys ATOTECH DEUTSCHLAND GMBH (DE) 2014-06-24 US disclosed
US-20130056438-A1 COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS ATOTECH DEUTSCHLAND GMBH (DE) 2013-03-07 US disclosed
EP-2241653-A1 Composition and method for micro etching of copper and copper alloys ATOTECH Deutschland GmbH (DE) 2010-10-20 EP disclosed