SCHEMBL3912940

SCHEMBL3912940

CCCC(c1ccc(CCCC(C)O)cc1)(c1ccc(CCCC(C)O)cc1)c1ccc(CCCC(C)O)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.38
HSD17B10 Q99714 2/20 0.38
HPGD P15428 1/20 0.38
TNNC1 P63316 5/20 0.36
S1PR1 P21453 3/20 0.36
S1PR4 O95977 2/20 0.36
S1PR3 Q99500 2/20 0.36
S1PR5 Q9H228 2/20 0.36
KIF11 P52732 1/20 0.36
SGPL1 O95470 1/20 0.36
GPR183 P32249 1/20 0.36
CERS2 Q96G23 1/20 0.36
S1PR2 O95136 1/20 0.36
ESR1 P03372 3/20 0.36
ADRA2A P08913 2/20 0.36
ADORA3 P0DMS8 2/20 0.36
TACR2 P21452 2/20 0.36
SLC6A2 P23975 2/20 0.36
SLC6A4 P31645 2/20 0.36
SLC6A3 Q01959 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7804651 0.78 ESR1 (0.56) ALDH1A1HSD17B10ESR1ADRA2AADORA3
SCHEMBL27769809 0.77 TAAR1 (0.45) ALDH1A1HSD17B10HPGDS1PR1S1PR3
SCHEMBL8716205 0.73 RARB (0.57) ALDH1A1HSD17B10S1PR1S1PR2ESR1
SCHEMBL1827950 0.73 IGF1R (0.48) HPGD
SCHEMBL692205 0.73 ESR1 (0.53) ALDH1A1HSD17B10ESR1ADRA2AADORA3
SCHEMBL27301145 0.72 HRH3 (0.55) ALDH1A1S1PR1KDM4ELMNACYP3A4
SCHEMBL17189279 0.72 KIF11 (0.53) KIF11CYP3A4CHRM2CHRM5CHRM1
SCHEMBL11540618 0.72 TRPA1 (0.44) PTGS1PTGS2
SCHEMBL7056724 0.72 MAOB (0.50) ALDH1A1CYP3A4
SCHEMBL560468 0.71 CYP2D6 (0.49) HPGDSLC6A3LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7521016-B2 Pressurized gas introducing device, and injection molding method for moldings having hollow portion MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-04-21 US disclosed
US-20050226954-A1 Pressurized gas introducing device, and injection molding method for moldings having hollow portion MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2005-10-13 US disclosed