SCHEMBL3937299

SCHEMBL3937299

Nc1ncc(Cc2ccc(O)cc2)c(N)n1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
DHFR P00374 2/20 0.68

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8375784 0.83 DHFR (0.63) DHFR
SCHEMBL8380685 0.83 DHFR (0.63) DHFR
SCHEMBL11286352 0.83 DHFR (0.68) DHFR
SCHEMBL28876908 0.83 DHFR (0.63) DHFR
SCHEMBL380792 0.82 DHFR (0.67) DHFR
SCHEMBL3940417 0.81
Hydrochloric Acid SCHEMBL8377343 0.81 DHFR (0.65) DHFR
Water SCHEMBL28837029 0.81 DHFR (0.65) DHFR
SCHEMBL4468544 0.79 DHFR (0.62) DHFR
SCHEMBL8376680 0.79 DHFR (0.76) DHFR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9488911-B2 Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device FUJIFILM CORPORATION (JP) 2016-11-08 US disclosed
US-20150362836-A1 PHOTOSENSITIVE COMPOSITION, PHOTOCURABLE COMPOSITION, CHEMICAL AMPLIFICATION RESIST COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-12-17 US disclosed
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
CN-1286918-C Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof HITACHI CHEMICAL CO LTD (JP) 2006-11-29 CN disclosed
US-20060180908-A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same YANO YASUHIRO 2006-08-17 US disclosed
US-7061081-B2 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
CN-1416452-A Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof HITACHI CHEMICAL CO LTD (JP) 2003-05-07 CN disclosed
US-20030082925-A1 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 EP disclosed
EP-0054756-B1 ANTIBACTERIAL BENZYLPYRIMIDINES THE WELLCOME FOUNDATION LIMITED (GB) 1986-07-23 EP disclosed
US-4116958-A ORGANIC SYNTHETIC METHODS BENZYLPYRIMIDINE DERIVATIVES BURROUGHS WELLCOME CO. (US) 1978-09-26 US disclosed
US-4052553-A BACTERICIDE, ANTIMALARIAL BURROUGHS WELLCOME CO. (US) 1977-10-04 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150362836-A1 PHOTOSENSITIVE COMPOSITION, PHOTOCURABLE COMPOSITION, CHEMICAL AMPLIFICATION RESIST COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE POLQ, POLR1A, POLI DHFR 1899/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.