SCHEMBL3937575

SCHEMBL3937575

Nc1cc(N)cc(Oc2ccc(O)cc2)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.64
KMT2A Q03164 3/20 0.64
ESR1 P03372 1/20 0.64
ESR2 Q92731 1/20 0.64
F2 P00734 1/20 0.55
PRSS1 P07477 1/20 0.55
PRSS2 P07478 1/20 0.55
PRSS3 P35030 1/20 0.55
ST14 Q9Y5Y6 1/20 0.55
LTA4H P09960 5/20 0.54
NR1H2 P55055 1/20 0.54
BAX Q07812 1/20 0.54
NPC1 O15118 1/20 0.53
RAB9A P51151 1/20 0.53
NLRP3 Q96P20 1/20 0.53
ALDH1A1 P00352 4/20 0.50
CYP3A4 P08684 2/20 0.50
TSHR P16473 1/20 0.50
TDP1 Q9NUW8 1/20 0.50
PARP10 Q53GL7 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13157438 0.94 ESR2 (0.56) MEN1KMT2AESR1ESR2F2
SCHEMBL6138474 0.88 MEN1 (0.64) MEN1KMT2AF2PRSS1PRSS2
SCHEMBL2960969 0.86 MEN1 (0.52) MEN1KMT2AESR1ESR2F2
SCHEMBL719268 0.83 ALDH1A1 (0.74) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL20347020 0.83 ALDH1A1 (0.74) MEN1KMT2AF2PRSS1PRSS2
SCHEMBL3653673 0.83 ALDH1A1 (0.74) MEN1KMT2AF2PRSS1PRSS2
SCHEMBL16551547 0.83 MEN1 (0.82) MEN1KMT2AESR1ESR2ST14
SCHEMBL1362217 0.81 MAOB (0.70) MEN1KMT2AESR1ESR2F2
SCHEMBL249169 0.80 ESR2 (1.00) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL18198 0.80 ESR2 (1.00) MEN1KMT2AESR1ESR2LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117700740-A Polyimide containing benzoxazine suspension side group and preparation method and application thereof 华烁科技股份有限公司 2024-03-15 CN disclosed
CN-117701232-A Low-dielectric non-fluorine modified polyimide and preparation method and application thereof 华烁科技股份有限公司 2024-03-15 CN disclosed
CN-117384482-A Non-fluorine modified polyimide, low-dielectric flexible copper-clad plate and preparation method thereof 华烁电子材料(武汉)有限公司 2024-01-12 CN disclosed
CN-112759763-B Polyimide composite glue solution, black matte polyimide material, preparation and application 株洲时代新材料科技股份有限公司 2022-05-17 CN disclosed
CN-112759763-A Polyimide composite glue solution, black matte polyimide material, preparation and application 株洲时代新材料科技股份有限公司 2021-05-07 CN disclosed
US-9488911-B2 Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device FUJIFILM CORPORATION (JP) 2016-11-08 US disclosed
US-20150362836-A1 PHOTOSENSITIVE COMPOSITION, PHOTOCURABLE COMPOSITION, CHEMICAL AMPLIFICATION RESIST COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2015-12-17 US disclosed
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
US-20060180908-A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same YANO YASUHIRO 2006-08-17 US disclosed
US-7061081-B2 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
US-20030082925-A1 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150362836-A1 PHOTOSENSITIVE COMPOSITION, PHOTOCURABLE COMPOSITION, CHEMICAL AMPLIFICATION RESIST COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE POLQ, POLR1A, POLI MEN1 607/4885KMT2A 921/4885ESR1 99/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.