SCHEMBL3940128

SCHEMBL3940128

Nc1cc(C(=O)O)cc(C(=O)O)c1N

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 9/20 0.45
KMT2A Q03164 4/20 0.43
GFER P55789 2/20 0.43
RXFP1 Q9HBX9 1/20 0.43
TDP1 Q9NUW8 4/20 0.42
ALDH1A1 P00352 4/20 0.42
MAPT P10636 4/20 0.42
THRB P10828 3/20 0.42
MEN1 O00255 3/20 0.42
USP2 O75604 2/20 0.42
PKM P14618 2/20 0.42
MCL1 Q07820 2/20 0.42
POLB P06746 1/20 0.42
APEX1 P27695 1/20 0.42
RECQL P46063 1/20 0.42
BLM P54132 1/20 0.42
HPGD P15428 2/20 0.42
GAA P10253 1/20 0.42
HTT P42858 1/20 0.42
PLEC Q15149 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL4299803 0.98 MAPT (0.45) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL1551912 0.88 KDM4E (0.50) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL1000015 0.85 CA12 (0.48) KDM4EKMT2AGFERTDP1ALDH1A1
SCHEMBL11694826 0.85 KDM4E (0.46) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL1552644 0.80 KDM4E (0.42) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL4306857 0.80 MMP2 (0.50) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL999012 0.79 KDM4E (0.63) KDM4EKMT2AGFERRXFP1TDP1
Hydrochloric Acid SCHEMBL4299531 0.78 MMP2 (0.48) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL2892410 0.78 KEAP1 (0.47) KDM4EKMT2AGFERRXFP1TDP1
SCHEMBL2890085 0.78 KDM4E (0.68) KDM4EKMT2AGFERRXFP1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
CN-1286918-C Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof HITACHI CHEMICAL CO LTD (JP) 2006-11-29 CN disclosed
US-20060180908-A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same YANO YASUHIRO 2006-08-17 US disclosed
US-7061081-B2 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
CN-1416452-A Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof HITACHI CHEMICAL CO LTD (JP) 2003-05-07 CN disclosed
US-20030082925-A1 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 EP disclosed