Naphthalene

Naphthalene

SCHEMBL3945154

Nc1ccc(N)c2ccccc12.c1ccc2ccccc2c1

nearest known ligand 0.65

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.65
HSD17B10 Q99714 4/20 0.65
CYP3A4 P08684 4/20 0.65
TSHR P16473 3/20 0.65
HPGD P15428 3/20 0.65
KEAP1 Q14145 2/20 0.65
TDP1 Q9NUW8 3/20 0.61
IDO1 P14902 2/20 0.59
EP300 Q09472 2/20 0.59
KAT8 Q9H7Z6 2/20 0.59
HDAC3 O15379 1/20 0.59
KAT2B Q92831 1/20 0.59
NCOR2 Q9Y618 1/20 0.59
HPRT1 P00492 2/20 0.52
CHEK1 O14757 1/20 0.52
NEK2 P51955 1/20 0.52
LIMK1 P53667 1/20 0.52
DYRK1A Q13627 1/20 0.52
CLK4 Q9HAZ1 1/20 0.52
CYP2A6 P11509 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL201893 0.90 ALDH1A1 (0.73) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL29404342 0.90 ALDH1A1 (0.73) ALDH1A1HSD17B10CYP3A4TSHRHPGD
Hydrochloric Acid SCHEMBL7191297 0.87 CYP3A4 (0.69) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL21854609 0.84 ALDH1A1 (0.87) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL825325 0.82 ALDH1A1 (0.65) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL866216 0.81 ALDH1A1 (0.61) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL30851475 0.81 ALDH1A1 (0.61) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL30117590 0.80 KEAP1 (0.62) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL1334192 0.80 KEAP1 (0.62) ALDH1A1HSD17B10CYP3A4TSHRHPGD
SCHEMBL9029 0.79 ALDH1A1 (1.00) ALDH1A1HSD17B10CYP3A4TSHRHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
US-20060180908-A1 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same YANO YASUHIRO 2006-08-17 US disclosed
US-7061081-B2 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2006-06-13 US disclosed
US-20030082925-A1 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed