SCHEMBL3958545

SCHEMBL3958545

Cc1ccnc(-c2cc(CCl)ccn2)c1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CCR1 P32246 2/20 0.65
CCR5 P51681 2/20 0.65
CCR8 P51685 2/20 0.65
METAP2 P50579 1/20 0.47
UHRF1 Q96T88 1/20 0.43
CYP2A6 P11509 1/20 0.43
NOS2 P35228 2/20 0.41
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
KDM4E B2RXH2 2/20 0.41
NOS3 P29474 1/20 0.41
NOS1 P29475 1/20 0.41
POLB P06746 1/20 0.39
ALDH1A1 P00352 2/20 0.35
LMNA P02545 1/20 0.35
PLAU P00749 1/20 0.34
LOX P28300 1/20 0.34
LOXL2 Q9Y4K0 1/20 0.34
HPGD P15428 1/20 0.34
GRIN2D O15399 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29693626 1.00 CCR1 (0.65) CCR1CCR5CCR8METAP2UHRF1
SCHEMBL29558394 0.88 CCR1 (0.42) CCR1CCR5CCR8METAP2NOS2
SCHEMBL1681797 0.88 CCR1 (0.42) CCR1CCR5CCR8METAP2NOS2
SCHEMBL23037127 0.84 CCR1 (0.71) CCR1CCR5CCR8METAP2UHRF1
SCHEMBL29693673 0.84 CCR1 (0.71) CCR1CCR5CCR8METAP2UHRF1
SCHEMBL15082607 0.84 CCR1 (0.71) CCR1CCR5CCR8METAP2UHRF1
SCHEMBL8425645 0.82 CCR1 (0.68) CCR1CCR5CCR8METAP2UHRF1
SCHEMBL4772868 0.81 LOXL2 (0.43) CCR1CCR5CCR8CYP2A6MEN1
SCHEMBL29397106 0.81 CCR1 (1.00) CCR1CCR5CCR8METAP2UHRF1
SCHEMBL181893 0.81 CCR1 (1.00) CCR1CCR5CCR8METAP2UHRF1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11935803-B2 Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-19 US disclosed
US-20210277221-A1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-09-09 US disclosed
EP-3786200-A1 RESIN COMPOSITION, LAMINATE, RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR WAFER, SUBSTRATE FOR MOUNTING RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-03-03 EP disclosed
US-7598199-B2 absorber material magnetite (Fe3O4) particles coated with a copolymer of 4-vinylpyridine-N-phenacyloxime and acrylic acid; for adsorption or chemisorption and catalyzes the hydrolysis, destroying organophosphate chemical agents diisopropyl fluorophosphate MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2009-10-06 US disclosed
US-20090218543-A1 CATALYTIC NANOPARTICLES FOR NERVE-AGENT DESTRUCTION MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2009-09-03 US disclosed
WO-2007092029-A2 CATALYTIC NANOPARTICLES FOR NERVE-AGENT DESTRUCTION MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) 2007-08-16 WO disclosed
EP-0958055-B1 POLY N-CYCLIC AROMATIC LIGANDS BONDED TO SOLID SUPPORTS FOR REMOVING AND CONCENTRATING IONS FROM SOLUTIONS IBC ADVANCED TECH INC (US) 2005-02-09 EP disclosed
US-6071416-A Poly N-cyclic aromatic ligands bonded to solid supports for removing and concentrating ions from solutions IBC ADVANCED TECHNOLOGIES, INC. (US) 2000-06-06 US disclosed