SCHEMBL4078282

SCHEMBL4078282

C=Cc1c(CC)c(CC)c(CC)c(CC)c1CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20546831 0.90 TSHR (0.30)
SCHEMBL9310954 0.74 HTT (0.33)
SCHEMBL1004361 0.73
SCHEMBL15326224 0.71
SCHEMBL10084874 0.71 ALDH1A1 (0.32)
SCHEMBL18099100 0.69
SCHEMBL4441028 0.68 NOS3 (0.38)
SCHEMBL12802027 0.68 GABRA1 (0.31)
SCHEMBL23092870 0.67 TSHR (0.33)
SCHEMBL21251400 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4990386-A Terpolymer of aromatic vinyl monomer, cyclohexylmaleimide, and acrylic compound SHOWA DENKO KABUSHIKI KAISHI (JP) 1991-02-05 US claimed
EP-2019120-B1 BLOCK COPOLYMERS NIPPON SODA CO (JP) 2016-04-13 EP disclosed
US-8193285-B2 Block copolymers NIPPON SODA CO., LTD. (JP) 2012-06-05 US disclosed
US-20090253867-A1 BLOCK COPOLYMERS NIPPON SODA CO., LTD. (JP) 2009-10-08 US disclosed
EP-2019120-A1 BLOCK COPOLYMERS Nippon Soda Co., Ltd. (JP) 2009-01-28 EP disclosed
EP-0844006-B1 Liquid-absorbing material composition, molded product therefrom, process for preparing the same and use thereof SHOWA DENKO KK (JP) 2002-06-05 EP disclosed
US-5965651-A CONTAINING A CROSSLINKING AGENT, N-VINYLCARBOXAMIDE COPOLYMER HAVING A FUNCTIONAL GROUP CAPABLE OF CROSSLINKING WITH CROSSLINKER, WATER, WATER SOLUBLE ORGANIC SOLVENT, AND PLASTICIZER; MOLDED INTO FILMS, SHEETS, POWDER AND FLAKES SHOWA DENKO K.K. (JP) 1999-10-12 US disclosed
EP-0844006-A1 Liquid-absorbing material composition, molded product therefrom, process for preparing the same and use thereof SHOWA DENKO KABUSHIKI KAISHA (JP) 1998-05-27 EP disclosed
EP-0348906-B1 HEAT-RESISTANT RESIN COMPOSITION SHOWA DENKO KABUSHIKI KAISHA (JP) 1992-10-07 EP disclosed
US-4994515-A Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound SHOWA DENKO KABUSHIKI KAISHA (JP) 1991-02-19 US disclosed
US-4990386-A Terpolymer of aromatic vinyl monomer, cyclohexylmaleimide, and acrylic compound SHOWA DENKO KABUSHIKI KAISHI (JP) 1991-02-05 US disclosed
EP-0390957-A1 Optical disk substrate SHOWA DENKO KABUSHIKI KAISHA (JP) 1990-10-10 EP disclosed
EP-0348906-A1 Heat-resistant resin composition SHOWA DENKO KABUSHIKI KAISHA (JP) 1990-01-03 EP disclosed