SCHEMBL4098086

SCHEMBL4098086

CCOC(C)N(C=O)C1CC(C)(C)NC(C)(C)C1

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ADH1B P00325 1/20 0.31
ADH1C P00326 1/20 0.31
ADH1A P07327 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4092952 0.84
SCHEMBL14141805 0.79 ADH1B (0.50) ADH1BADH1CADH1A
SCHEMBL14142142 0.77 ADH1B (0.32) ADH1BADH1CADH1A
SCHEMBL4098246 0.75 ADH1B (0.33) ADH1BADH1CADH1A
SCHEMBL28889146 0.75 ALOX15 (0.34)
SCHEMBL3836046 0.73 ADH1B (0.33) ADH1BADH1CADH1A
SCHEMBL29656329 0.72 ADH1C (0.37) ADH1BADH1CADH1A
SCHEMBL4093341 0.68 MEN1 (0.40)
SCHEMBL4087435 0.68 POLB (0.44)
SCHEMBL9668787 0.67 ADH1A (0.42) ADH1CADH1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2930210-B1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE ZEON CORP (JP) 2023-01-25 EP disclosed
US-10707442-B2 Composite gas barrier multilayer body, method for producing the same, and composite electrode ZEON CORPORATION (JP) 2020-07-07 US disclosed
EP-3089551-B1 SEALING FILM, ORGANIC ELECTROLUMINESCENT DISPLAY, AND ORGANIC SEMICONDUCTOR DEVICE ZEON CORP (JP) 2020-04-15 EP disclosed
US-10559778-B2 Composite gas barrier laminate and method for producing same ZEON CORPORATION (JP) 2020-02-11 US disclosed
US-20190334116-A1 METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE ZEON CORPORATION (JP) 2019-10-31 US disclosed
US-10374190-B2 Sealing film, organic electroluminescent display, and organic semiconductor device ZEON CORPORATION (JP) 2019-08-06 US disclosed
US-20180102500-A1 SEALING MATERIAL, METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE ZEON CORPORATION (JP) 2018-04-12 US disclosed
EP-3277055-A1 SEALING MATERIAL, METHOD FOR MANUFACTURING SEALING MATERIAL, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE Zeon Corporation (JP) 2018-01-31 EP disclosed
EP-2623526-B1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP, AND USE THEREFOR ZEON CORP (JP) 2017-07-26 EP disclosed
US-20170037157-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP AND USE THEREFOR ZEON CORPORATION (JP) 2017-02-09 US disclosed
EP-3089551-A1 SEALING FILM, ORGANIC ELECTROLUMINESCENT DISPLAY, AND ORGANIC SEMICONDUCTOR DEVICE Zeon Corporation (JP) 2016-11-02 EP disclosed
US-20150307758-A1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE ZEON CORPORATION (JP) 2015-10-29 US disclosed
EP-2930210-A1 RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE Zeon Corporation (JP) 2015-10-14 EP disclosed
US-20150249228-A1 COMPOSITE GAS BARRIER MULTILAYER BODY, METHOD FOR PRODUCING THE SAME, AND COMPOSITE ELECTRODE ZEON CORPORATION (JP) 2015-09-03 US disclosed
EP-2907657-A1 COMPOSITE GAS BARRIER LAMINATE AND METHOD FOR PRODUCING SAME, AND COMPOSITE ELECTRODE Zeon Corporation (JP) 2015-08-19 EP disclosed
US-20130244367-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP AND USE THEREFOR ZEON CORPORATION (JP) 2013-09-19 US disclosed
EP-2623526-A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP, AND USE THEREFOR Zeon Corporation (JP) 2013-08-07 EP disclosed
US-20130008506-A1 RESIN COMPOSITION FOR ENCAPSULATING SOLAR CELL AND SOLAR MODULE ZEON CORPORATION (JP) 2013-01-10 US disclosed
EP-2532692-A1 RESIN COMPOSITION FOR SEALING SOLAR CELL ELEMENT, AND SOLAR CELL MODULE Zeon Corporation (JP) 2012-12-12 EP disclosed
US-20090118400-A1 RESIN COMPOSITION ZEON CORPORATION (JP) 2009-05-07 US disclosed