Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.33 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 2/20 | 0.32 |
| ▸ | BLM | P54132 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL410735 | 0.88 | TSHR (0.38) | CYP2D6ADRA2AADRA1AMAPTBLM | |
| SCHEMBL7193032 | 0.88 | LMNA (0.36) | CYP2D6ADRA2AADRA1AMAPTBLM | |
| SCHEMBL18782360 | 0.87 | DGKA (0.35) | CYP2D6KMT2AALDH1A1 | |
| SCHEMBL1625511 | 0.86 | ADRA2A (0.31) | ADRA2AADRA1AMAPTBLM | |
| SCHEMBL17830161 | 0.86 | KMT2A (0.34) | ADRA2AADRA1AMAPTBLMKMT2A | |
| SCHEMBL21443553 | 0.85 | CYP2D6 (0.31) | CYP2D6ADRA2AADRA1A | |
| SCHEMBL23074471 | 0.84 | EPHX2 (0.33) | CYP2D6KMT2A | |
| SCHEMBL10045651 | 0.83 | GAA (0.40) | CYP2D6BLMKMT2AALDH1A1 | |
| SCHEMBL1687733 | 0.83 | CYP2D6 (0.34) | CYP2D6KMT2A | |
| SCHEMBL9835731 | 0.83 | ALDH1A1 (0.37) | CYP2D6KMT2AALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8309658-B2 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-11-13 | — | — | US | disclosed |
| US-20120063109-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2012-03-15 | — | — | US | disclosed |