Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20561129 | 0.88 | — | — | |
| SCHEMBL4117056 | 0.88 | APEX1 (0.39) | — | |
| SCHEMBL16412087 | 0.83 | RGS4 (0.33) | RGS4RGS8 | |
| SCHEMBL14495617 | 0.83 | RGS4 (0.33) | RGS4RGS8 | |
| SCHEMBL16412050 | 0.81 | — | — | |
| SCHEMBL4141489 | 0.81 | PDE4A (0.33) | — | |
| SCHEMBL16412089 | 0.80 | PDE4A (0.32) | RGS4RGS8 | |
| SCHEMBL16535315 | 0.79 | PDE4A (0.34) | RGS4RGS8 | |
| SCHEMBL155052 | 0.78 | LMNA (0.33) | RGS4 | |
| SCHEMBL15383201 | 0.75 | P2RX3 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022202844-A1 | ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022202845-A1 | ADHESIVE PASTE, USAGE METHOD FOR ADHESIVE PASTE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-09-29 | — | — | WO | disclosed |
| EP-3196254-B1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2022-07-13 | — | — | EP | disclosed |
| EP-3187546-B1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2022-07-13 | — | — | EP | disclosed |
| CN-108948065-B | Hydrophilic alkoxysilane-containing isocyanurates | 赢创运营有限公司 | 2022-07-05 | — | — | CN | disclosed |
| US-11315899-B2 | Die bonding material, light-emitting device, and method for producing light-emitting device | LINTEC CORPORATION (JP) | 2022-04-26 | — | — | US | disclosed |
| US-20200335471-A1 | DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE | LINTEC CORPORATION (JP) | 2020-10-22 | — | — | US | disclosed |
| US-10774249-B2 | Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device | LINTEC CORPORATION (JP) | 2020-09-15 | — | — | US | disclosed |
| US-10745559-B2 | Curable composition, method for producing curable composition, cured product, and use of curable composition | LINTEC CORPORATION (JP) | 2020-08-18 | — | — | US | disclosed |
| US-20190300710-A1 | CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, AND USE OF CURABLE COMPOSITION | LINTEC CORPORATION (JP) | 2019-10-03 | — | — | US | disclosed |
| US-20150065663-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC CORPORATION (JP) | 2015-03-05 | — | — | US | disclosed |
| EP-2829579-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC Corporation (JP) | 2015-01-28 | — | — | EP | disclosed |
| EP-2684690-A1 | ADHESIVE-BONDED STRUCTURE COMPRISING BOTH ADHESIVE COMPOSITION AND WOOD MATERIAL | Kaneka Corporation (JP) | 2014-01-15 | — | — | EP | disclosed |
| EP-1418021-B1 | Polishing pad | JSR CORP (JP) | 2009-01-21 | — | — | EP | disclosed |
| EP-1348747-B1 | Gas barrier coating composition and method for manufacturing same | JSR CORP (JP) | 2007-02-14 | — | — | EP | disclosed |
| US-6992123-B2 | Polishing pad | JSR CORPORATION (JP) | 2006-01-31 | — | — | US | disclosed |
| US-20040118051-A1 | Polishing pad | JSR CORPORATION (JP) | 2004-06-24 | — | — | US | disclosed |
| EP-1418021-A1 | Polishing pad | JSR Corporation (JP) | 2004-05-12 | — | — | EP | disclosed |
| US-20030187113-A1 | Gas barrier coating composition and method for manufacturing same | JSR CORPORATION (JP) | 2003-10-02 | — | — | US | disclosed |
| EP-1348747-A1 | Gas barrier coating composition and method for manufacturing same | JSR Corporation (JP) | 2003-10-01 | — | — | EP | disclosed |