Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDE4A | P27815 | 2/20 | 0.33 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.33 |
| ▸ | PDE4B | Q07343 | 2/20 | 0.33 |
| ▸ | PDE4C | Q08493 | 2/20 | 0.33 |
| ▸ | PDE4D | Q08499 | 2/20 | 0.33 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.33 |
| ▸ | ADORA2B | P29275 | 1/20 | 0.33 |
| ▸ | TLR7 | Q9NYK1 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4117056 | 0.87 | APEX1 (0.39) | PDE4AADORA2APDE4BPDE4CPDE4D | |
| SCHEMBL557549 | 0.81 | ADORA2B (0.35) | PDE4AADORA2APDE4BPDE4CPDE4D | |
| SCHEMBL4120385 | 0.81 | RGS4 (0.30) | — | |
| SCHEMBL4129111 | 0.79 | ADORA2B (0.36) | PDE4AADORA2APDE4BPDE4CPDE4D | |
| SCHEMBL21357959 | 0.78 | ADORA2B (0.36) | ADORA2AADORA3ADORA2BMEN1KMT2A | |
| SCHEMBL28636308 | 0.77 | ALDH1A1 (0.32) | PDE4AADORA2APDE4BPDE4CPDE4D | |
| SCHEMBL22472307 | 0.76 | ADORA2B (0.38) | PDE4AADORA2APDE4BPDE4CPDE4D | |
| SCHEMBL22472338 | 0.75 | ADORA2B (0.40) | PDE4AADORA2APDE4BPDE4CPDE4D | |
| SCHEMBL28429834 | 0.73 | PDE4A (0.34) | PDE4AADORA2APDE4BPDE4CPDE4D | |
| SCHEMBL9681087 | 0.71 | ADORA2B (0.35) | PDE4AADORA2APDE4BPDE4CPDE4D |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116981751-A | Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device | 琳得科株式会社 | 2023-10-31 | — | — | CN | disclosed |
| CN-112739775-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-11-01 | — | — | CN | disclosed |
| CN-112739776-B | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-10-28 | — | — | CN | disclosed |
| CN-115124973-A | Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device | 琳得科株式会社 | 2022-09-30 | — | — | CN | disclosed |
| CN-112739748-B | Curable polysilsesquioxane compound, curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2022-07-12 | — | — | CN | disclosed |
| CN-108473767-B | Curable composition, method for producing curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2021-07-13 | — | — | CN | disclosed |
| CN-108368346-B | Curable composition, method for producing curable composition, cured product, method for using curable composition, and optical device | 琳得科株式会社 | 2021-07-13 | — | — | CN | disclosed |
| CN-112739748-A | Curable polysilsesquioxane compound, curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2021-04-30 | — | — | CN | disclosed |
| CN-112739775-A | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2021-04-30 | — | — | CN | disclosed |
| CN-112739776-A | Curable composition, cured product, and method for using curable composition | 琳得科株式会社 | 2021-04-30 | — | — | CN | disclosed |
| WO-2020067451-A1 | CURABLE POLYSILSESQUIOXANE COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, AND, METHOD FOR USING CURABLE COMPOSITION | リンテック株式会社 | 2020-04-02 | — | — | WO | disclosed |
| WO-2019176828-A1 | CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | リンテック株式会社 | 2019-09-19 | — | — | WO | disclosed |
| EP-2684690-B1 | ADHESIVE-BONDED STRUCTURE COMPRISING BOTH ADHESIVE COMPOSITION AND WOOD MATERIAL | KANEKA CORP (JP) | 2018-02-21 | — | — | EP | disclosed |
| EP-1418021-B1 | Polishing pad | JSR CORP (JP) | 2009-01-21 | — | — | EP | disclosed |
| EP-1348747-B1 | Gas barrier coating composition and method for manufacturing same | JSR CORP (JP) | 2007-02-14 | — | — | EP | disclosed |
| US-6992123-B2 | Polishing pad | JSR CORPORATION (JP) | 2006-01-31 | — | — | US | disclosed |
| US-20040118051-A1 | Polishing pad | JSR CORPORATION (JP) | 2004-06-24 | — | — | US | disclosed |
| EP-1418021-A1 | Polishing pad | JSR Corporation (JP) | 2004-05-12 | — | — | EP | disclosed |
| US-20030187113-A1 | Gas barrier coating composition and method for manufacturing same | JSR CORPORATION (JP) | 2003-10-02 | — | — | US | disclosed |
| EP-1348747-A1 | Gas barrier coating composition and method for manufacturing same | JSR Corporation (JP) | 2003-10-01 | — | — | EP | disclosed |