SCHEMBL4130407

SCHEMBL4130407

CCCC(=O)CC(=O)OOC(C)(C)C.CCCC(=O)CC(=O)OOC(C)(C)C.[Ti]

nearest known ligand 0.37

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
TSHR P16473 2/20 0.32
KDM4C Q9H3R0 1/20 0.32
HSD17B10 Q99714 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
HDAC3 O15379 2/20 0.31
HDAC1 Q13547 2/20 0.31
HDAC2 Q92769 2/20 0.31
HDAC8 Q9BY41 2/20 0.31
HDAC6 Q9UBN7 1/20 0.31
CES2 O00748 1/20 0.31
CES1 P23141 1/20 0.31
CTSD P07339 1/20 0.30
FFAR3 O14843 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6138575 0.96 ALDH1A1 (0.37) ALDH1A1TSHRKDM4CHSD17B10TDP1
SCHEMBL6138511 0.88 FFAR3 (0.36) ALDH1A1HDAC3HDAC1HDAC2HDAC8
SCHEMBL4139438 0.88 FFAR3 (0.36) ALDH1A1HDAC3HDAC1HDAC2HDAC8
SCHEMBL515690 0.81 ALDH1A1 (0.50) ALDH1A1TSHRHSD17B10TDP1HDAC3
SCHEMBL4138390 0.78 ALDH1A1 (0.41) ALDH1A1TSHRHSD17B10HDAC3HDAC1
SCHEMBL6415291 0.78 ALDH1A1 (0.41) ALDH1A1TSHRHDAC3HDAC1HDAC2
SCHEMBL4619662 0.76 ALDH1A1 (0.39) ALDH1A1TSHRHDAC3HDAC1HDAC2
Acetic Acid SCHEMBL28485319 0.76 ALDH1A1 (0.44) ALDH1A1TSHRHSD17B10TDP1HDAC3
SCHEMBL4151255 0.74 ALDH1A1 (0.38) ALDH1A1TSHRHDAC3HDAC1HDAC2
SCHEMBL11126370 0.74 TSHR (0.41) ALDH1A1TSHRHSD17B10TDP1HDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119768742-A Composition for forming silicon-containing resist underlayer film 日产化学株式会社 2025-04-04 CN disclosed
CN-119563142-A Composition for forming silicon-containing resist underlayer film containing multifunctional sulfonic acid 日产化学株式会社 2025-03-04 CN disclosed
WO-2025041813-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ASSEMBLY 日産化学株式会社 2025-02-27 WO disclosed
CN-119487453-A Method for manufacturing laminate and method for manufacturing semiconductor element 日产化学株式会社 2025-02-18 CN disclosed
US-20240419073-A1 ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2024-12-19 US disclosed
WO-2024237188-A1 MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND PHOTOSENSITIVE SURFACE MODIFIER 日産化学株式会社 2024-11-21 WO disclosed
WO-2024225431-A1 COMPOSITION FOR FORMING WET-REMOVABLE SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2024-10-31 WO disclosed
WO-2024195705-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM FOR i-RAY LITHOGRAPHY 日産化学株式会社 2024-09-26 WO disclosed
WO-2024185665-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2024-09-12 WO disclosed
WO-2024181394-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM HAVING CARBON-CARBON DOUBLE BOND 日産化学株式会社 2024-09-06 WO disclosed
WO-2022210944-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210960-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210901-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210262-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210954-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION 日産化学株式会社 2022-10-06 WO disclosed
US-20090214796-A1 Method for Forming Antireflection Film MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2009-08-27 US disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
EP-1117102-B1 Method of manufacturing material for forming insulating film JSR CORP (JP) 2005-08-10 EP disclosed
US-6642352-B2 Providing a silicon inorganic polymer compound or polyarylenes or polyphenylene ether organic polymer compound, treating the polymeric compound with a zeta-potential producing filter material, and producing curable polymer compound JSR CORPORATION (JP) 2003-11-04 US disclosed
US-20010009936-A1 Method of manufacturing material for forming insulating film JSR CORPORATION (JP) 2001-07-26 US disclosed