SCHEMBL415674

SCHEMBL415674

Cc1nc(CCc2nc(N)nc(N)n2)c[nH]1

nearest known ligand 0.42

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
▸ CASP1 P29466 1/20 0.42
▸ TSHR P16473 1/20 0.38
▸ CYP1A2 P05177 1/20 0.33
▸ HRH4 Q9H3N8 1/20 0.31
▸ NPC1 O15118 1/20 0.30
▸ JAK2 O60674 1/20 0.30
▸ RAB9A P51151 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5708662 0.91 CASP1 (0.35) CASP1TSHRCYP1A2
SCHEMBL5983529 0.90 CASP1 (0.53) CASP1TSHRCYP1A2
SCHEMBL5983208 0.79 CASP1 (0.39) CASP1TSHRCYP1A2
SCHEMBL5794667 0.75 — —
2-Methylhistamine SCHEMBL624809 0.75 — —
SCHEMBL4973455 0.75 CTSK (0.35) —
SCHEMBL30586310 0.74 SMN1; SMN2 (0.31) —
SCHEMBL546259 0.73 CASP1 (0.38) CASP1
SCHEMBL16460924 0.73 CASP1 (0.38) CASP1
2-Methylhistamine SCHEMBL29291045 0.73 HRH4 (0.39) TSHRCYP1A2HRH4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 91 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3331959-A1 ANIONIC CURABLE COMPOSITIONS Designer Molecules, Inc. (US) 2018-06-13 — — EP claimed
WO-2017027482-A1 ANIONIC CURABLE COMPOSITIONS DESIGNER MOLECULES, INC. (US) 2017-02-16 — — WO claimed
EP-2334728-A2 CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM Fry's Metals, Inc. (US) 2011-06-22 — — EP claimed
WO-2010036953-A2 CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM FRY'S METALS, INC. (US) 2010-04-01 — — WO claimed
EP-1530617-A1 EPOXY COMPOSITIONS HAVING IMPROVED SHELF LIFE AND ARTICLES CONTAINING THE SAME 3M Innovative Properties Company (US) 2005-05-18 — — EP claimed
WO-2004016703-A1 EPOXY COMPOSITIONS HAVING IMPROVED SHELF LIFE AND ARTICLES CONTAINING THE SAME 3M INNOVATIVE PROPERTIES COMPANY (US) 2004-02-26 — — WO claimed
US-12359018-B2 Room temperature stable one-part void filler 3M INNOVATIVE PROPERTIES COMPANY (US) 2025-07-15 — — US disclosed
US-12168729-B2 Flame-retardant epoxy composition and method of using the same CYTEC INDUSTRIES INC. (US) 2024-12-17 — — US disclosed
WO-2023166973-A1 CURABLE RESIN COMPOSITION, ADHESIVE, CURED PRODUCT, CAMERA MODULE, AND ELECTRONIC DEVICE ナミックス株式会社 2023-09-07 — — WO disclosed
CN-113166377-B Room temperature stable one-part void fillers 3M创新有限公司 2022-08-16 — — CN disclosed
EP-4001340-A1 COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND SURFACE-MODIFIED INORGANIC SUBSTANCE FUJIFILM Corporation (JP) 2022-05-25 — — EP disclosed
US-20220081551-A1 FLAME-RETARDANT EPOXY COMPOSITION AND METHOD OF USING THE SAME CYTEC INDUSTRIES INC 2022-03-17 — — US disclosed
CN-110036050-B Heat/moisture resistant low density epoxy compositions 3M创新有限公司 2022-01-25 — — CN disclosed
WO-1995020635-A2 NOVEL SHEET MATERIAL MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-08-03 — — WO disclosed
WO-1995013327-A1 TOPOGRAPHICAL METHOD MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-05-18 — — WO disclosed
US-5130831-A Particulate spacers and liquid crystal display cells containing these spacers SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1992-07-14 — — US disclosed
EP-0448862-A2 Particulate spacers and a method for producing the same, and a method for producing a liquid crystal display cell by using the particulate spacers SEKISUI FINE CHEMICAL CO., LTD. (JP) 1991-10-02 — — EP disclosed
US-5019605-A Hardener, smoke suppressant, filler MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1991-05-28 — — US disclosed
EP-0388037-A2 Low density self-extinguishing epoxide composition MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-09-19 — — EP disclosed
EP-0166588-A1 Epoxy resin composition SHIKOKU CHEMICALS CORPORATION (JP) 1986-01-02 — — EP disclosed
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