SCHEMBL5794667

SCHEMBL5794667

Cc1nc(CCc2ncncn2)c[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL415674 0.75 CASP1 (0.42) —
SCHEMBL30586310 0.74 SMN1; SMN2 (0.31) —
SCHEMBL82665 0.72 — —
SCHEMBL9033628 0.72 SMN1; SMN2 (0.35) —
SCHEMBL4973455 0.71 CTSK (0.35) —
SCHEMBL2035621 0.71 — —
SCHEMBL8611446 0.71 — —
SCHEMBL6105714 0.71 — —
2-Methylhistamine SCHEMBL624809 0.71 — —
SCHEMBL7170380 0.71 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4524179-A1 CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE Shin-Etsu Chemical Co., Ltd. (JP) 2025-03-19 — — EP disclosed
US-20250084216-A1 CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-03-13 — — US disclosed
WO-2006019747-A1 COMPOSITION, COATED ABRASIVE ARTICLE, AND METHODS OF MAKING THE SAME 3M INNOVATIVE PROPERTIES COMPANY (US) 2006-02-23 — — WO disclosed
Send feedback