SCHEMBL4193671

SCHEMBL4193671

SCC[Si](c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 1/20 0.38
ALDH1A1 P00352 1/20 0.33
TSHR P16473 1/20 0.33
HDAC3 O15379 4/20 0.32
HDAC4 P56524 4/20 0.32
HDAC1 Q13547 4/20 0.32
HDAC7 Q8WUI4 4/20 0.32
HDAC2 Q92769 4/20 0.32
HDAC10 Q969S8 4/20 0.32
HDAC11 Q96DB2 4/20 0.32
HDAC8 Q9BY41 4/20 0.32
HDAC6 Q9UBN7 4/20 0.32
HDAC9 Q9UKV0 4/20 0.32
HDAC5 Q9UQL6 4/20 0.32
HTR2A P28223 1/20 0.31
HRH1 P35367 1/20 0.31
TAAR1 Q96RJ0 1/20 0.31
FOLH1 Q04609 1/20 0.30
ESR1 P03372 1/20 0.30
ESR2 Q92731 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7139123 0.85 HDAC3 (0.39) IDO1ALDH1A1TSHRHDAC3HDAC4
SCHEMBL4194521 0.83 HDAC3 (0.42) IDO1ALDH1A1TSHRHDAC3HDAC4
SCHEMBL10402043 0.83 CALM1 (0.35) IDO1ALDH1A1TSHRHTR2AHRH1
SCHEMBL4182445 0.79 IDO1 (0.38) IDO1HDAC3HDAC4HDAC1HDAC7
SCHEMBL4185589 0.78 IDO1 (0.41) IDO1ALDH1A1TSHRHDAC3HDAC4
SCHEMBL23364901 0.75 IDO1 (0.42) IDO1ALDH1A1TSHRTAAR1TDP1
SCHEMBL23364974 0.75 IDO1 (0.42) IDO1TAAR1
SCHEMBL23364946 0.74 ESR1 (0.30) ESR1ESR2
SCHEMBL23364934 0.74 ESR1 (0.30) ESR1ESR2
SCHEMBL8060293 0.74 MAPT (0.31) ALDH1A1ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6507049-B1 Encapsulants for solid state devices GENERAL ELECTRIC COMPANY 2003-01-14 US claimed
US-5145889-A For light-emitting diodes KABUSHIKI KAISHA TOSHIBA (JP) 1992-09-08 US claimed
US-12590246-B2 Precursor chemistry for quantum dot synthesis enabling temperature-independent modulation of reactivity THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS (US) 2026-03-31 US disclosed
US-20230109627-A1 PRECURSOR CHEMISTRY FOR QUANTUM DOT SYNTHESIS ENABLING TEMPERATURE-INDEPENDENT MODULATION OF REACTIVITY THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS (US) 2023-04-06 US disclosed
WO-2021097217-A1 PRECURSOR CHEMISTRY FOR QUANTUM DOT SYNTHESIS ENABLING TEMPERATURE-INDEPENDENT MODULATION OF REACTIVITY THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS (US) 2021-05-20 WO disclosed
CN-101307183-B Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method GEN ELECTRIC 2011-06-29 CN disclosed
US-20090121251-A1 Siloxane-hydantoin copolymer, optoelectronic device encapsulated therewith and method LUMINATION LLC 2009-05-14 US disclosed
CN-100480352-C Epoxy resin composition, solid state device encapsulated therewith and method GEN ELECTRIC (US) 2009-04-22 CN disclosed
CN-101307183-A Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method GEN ELECTRIC (US) 2008-11-19 CN disclosed
US-20080160317-A1 Optoelectronic device GELCORE LLC 2008-07-03 US disclosed
US-20080001140-A1 Optoelectronic device GELCORE LLC 2008-01-03 US disclosed
US-6617400-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
US-6617401-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
US-20030071368-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US disclosed
US-20030071367-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US disclosed
US-20030071366-A1 For encapsulating a solid state device, such as a light emitting diode GENERAL ELECTRIC COMPANY 2003-04-17 US disclosed
EP-1285938-A1 Epoxy resin encapsulation compositions GENERAL ELECTRIC COMPANY (US) 2003-02-26 EP disclosed
EP-1285939-A1 Epoxy resin compositions and solid state devices encapsulated therewith GENERAL ELECTRIC COMPANY (US) 2003-02-26 EP disclosed
US-6507049-B1 Encapsulants for solid state devices GENERAL ELECTRIC COMPANY 2003-01-14 US disclosed
US-5145889-A For light-emitting diodes KABUSHIKI KAISHA TOSHIBA (JP) 1992-09-08 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12590246-B2 Precursor chemistry for quantum dot synthesis enabling temperature-independent modulation of reactivity TBCD, TBL2, TYR IDO1 1747/4885ALDH1A1 2887/4885TSHR 1452/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.