Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC3 | O15379 | 6/20 | 0.36 |
| ▸ | HDAC4 | P56524 | 6/20 | 0.36 |
| ▸ | HDAC1 | Q13547 | 6/20 | 0.36 |
| ▸ | HDAC7 | Q8WUI4 | 6/20 | 0.36 |
| ▸ | HDAC2 | Q92769 | 6/20 | 0.36 |
| ▸ | HDAC10 | Q969S8 | 6/20 | 0.36 |
| ▸ | HDAC11 | Q96DB2 | 6/20 | 0.36 |
| ▸ | HDAC8 | Q9BY41 | 6/20 | 0.36 |
| ▸ | HDAC6 | Q9UBN7 | 6/20 | 0.36 |
| ▸ | HDAC9 | Q9UKV0 | 6/20 | 0.36 |
| ▸ | HDAC5 | Q9UQL6 | 6/20 | 0.36 |
| ▸ | ESR1 | P03372 | 1/20 | 0.34 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.34 |
| ▸ | IDO1 | P14902 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | FOLH1 | Q04609 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4346243 | 0.83 | MGAM (0.40) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL9225762 | 0.81 | ESR1 (0.42) | ESR1ESR2MAPT | |
| SCHEMBL8928206 | 0.79 | HTR2A (0.46) | — | |
| SCHEMBL11515549 | 0.78 | MAPT (0.35) | ESR1ESR2MAPT | |
| SCHEMBL4660213 | 0.78 | NR1H2 (0.40) | ESR1ESR2MAPT | |
| SCHEMBL10611414 | 0.78 | MAOA (0.40) | ESR1ESR2 | |
| SCHEMBL3238058 | 0.78 | ESR1 (0.34) | ESR1ESR2MAPT | |
| SCHEMBL12412624 | 0.78 | SIGMAR1 (0.48) | — | |
| SCHEMBL8684358 | 0.78 | HDAC3 (0.33) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL7139123 | 0.77 | HDAC3 (0.39) | HDAC3HDAC4HDAC1HDAC7HDAC2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | claimed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | claimed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | claimed |
| US-20090121251-A1 | Siloxane-hydantoin copolymer, optoelectronic device encapsulated therewith and method | LUMINATION LLC | 2009-05-14 | — | — | US | disclosed |
| US-20080160317-A1 | Optoelectronic device | GELCORE LLC | 2008-07-03 | — | — | US | disclosed |
| US-20080001140-A1 | Optoelectronic device | GELCORE LLC | 2008-01-03 | — | — | US | disclosed |
| US-20070299162-A1 | Light emitting semiconductor and encapsulant is made from nano-functionalized zirconia; silicone epoxy, epoxy isocyanurate and succinic anhydride, dodecenylsuccinic anhydride, phthalic anhydride curing agent; ancillary curing catalyst, cure modifier, coupling agent, UV, thermal stabilizer | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| US-20070295956-A1 | Optoelectronic device | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| US-20070295983-A1 | Optoelectronic device | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| EP-1408087-B1 | Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method | GEN ELECTRIC (US) | 2007-10-10 | — | — | EP | disclosed |
| US-7144763-B2 | light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging | GENERAL ELECTRIC COMPANY (US) | 2006-12-05 | — | — | US | disclosed |
| EP-1285938-A1 | Epoxy resin encapsulation compositions | GENERAL ELECTRIC COMPANY (US) | 2003-02-26 | — | — | EP | disclosed |
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | disclosed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | disclosed |
| WO-1998045368-A1 | OLEFIN (CO-)POLYMER COMPOSITIONS AND METHOD OF PRODUCING THE SAME | CHISSO CORPORATION (JP) | 1998-10-15 | — | — | WO | disclosed |
| EP-0564004-B1 | A highly stereoregular polypropylene | CHISSO CORP (JP) | 1996-09-25 | — | — | EP | disclosed |
| EP-0564004-A1 | A highly stereoregular polypropylene | CHISSO CORPORATION (JP) | 1993-10-06 | — | — | EP | disclosed |
| US-5145889-A | For light-emitting diodes | KABUSHIKI KAISHA TOSHIBA (JP) | 1992-09-08 | — | — | US | disclosed |
| US-5077341-A | Using coordination catalyst | CHISSO CORPORATION (JP) | 1991-12-31 | — | — | US | disclosed |
| EP-0404519-A2 | A process for producing a high-stiffness polypropylene | CHISSO CORPORATION (JP) | 1990-12-27 | — | — | EP | disclosed |