SCHEMBL4194780

SCHEMBL4194780

c1ccc(CSOP(OSCc2ccccc2)OSCc2ccccc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 5/20 0.40
NOS3 P29474 1/20 0.40
NOS1 P29475 1/20 0.40
NOS2 P35228 1/20 0.40
POLB P06746 1/20 0.39
HSD17B10 Q99714 1/20 0.39
TSHR P16473 1/20 0.39
MAOB P27338 1/20 0.39
CTSL P07711 1/20 0.38
CTSB P07858 1/20 0.38
CA12 O43570 1/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
CA9 Q16790 1/20 0.38
CALM1 P0DP23 1/20 0.38
CYP1A2 P05177 2/20 0.36
CYP3A4 P08684 2/20 0.36
CYP2D6 P10635 2/20 0.36
CYP2C19 P33261 2/20 0.36
PRMT1 Q99873 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8450 0.77 IDO1 (0.44) IDO1NOS3NOS1NOS2POLB
Water SCHEMBL28337532 0.75 IDO1 (0.43) IDO1NOS3NOS1NOS2POLB
SCHEMBL546541 0.73 CYP1A2 (0.42) IDO1NOS3NOS1NOS2POLB
SCHEMBL8580874 0.73 IDO1 (0.41) IDO1NOS3NOS1NOS2POLB
SCHEMBL14081414 0.73 IDO1 (0.46) IDO1NOS3NOS1NOS2POLB
SCHEMBL7955699 0.73 IDO1 (0.41) IDO1NOS3NOS1NOS2POLB
SCHEMBL28335148 0.73 IDO1 (0.48) IDO1NOS3NOS1NOS2POLB
SCHEMBL27634197 0.71 IDO1 (0.40) IDO1NOS3NOS1NOS2POLB
SCHEMBL7314820 0.70 IDO1 (0.39) IDO1NOS3NOS1NOS2POLB
SCHEMBL2878615 0.70 TP53 (0.44) IDO1NOS3NOS1NOS2POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6507049-B1 Encapsulants for solid state devices GENERAL ELECTRIC COMPANY 2003-01-14 US claimed
WO-2002019440-A1 ENCAPSULANTS FOR SOLID STATE DEVICES GENERAL ELECTRIC COMPANY (US) 2002-03-07 WO claimed
US-5145889-A For light-emitting diodes KABUSHIKI KAISHA TOSHIBA (JP) 1992-09-08 US claimed
US-10131817-B2 Cationically cross-linkable/polymerizable composition comprising an iodonium borate and releasing an acceptable odor ELKEM SILICONES FRANCE SAS (FR) 2018-11-20 US disclosed
EP-2912075-B1 CATIONICALLY CROSS-LINKABLE/POLYMERISABLE COMPOSITION COMPRISING AN IODONIUM BORATE AND RELEASING AN ACCEPTABLE ODOUR BLUESTAR SILICONES FRANCE (FR) 2016-12-14 EP disclosed
EP-2904021-B1 CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE ORGANIC RESIN COMPOSITION COMPRISING AN IODONIUM BORATE AND HAVING AN ACCEPTABLE SMELL BLUESTAR SILICONES FRANCE (FR) 2016-12-07 EP disclosed
US-9353257-B2 Cationically cross-linkable/polymerizable organic resin composition comprising an iodonium borate and having an acceptable smell BLUESTAR SILICONES FRANCE SAS (FR) 2016-05-31 US disclosed
EP-2912075-A1 CATIONICALLY CROSS-LINKABLE/POLYMERISABLE COMPOSITION COMPRISING AN IODONIUM BORATE AND RELEASING AN ACCEPTABLE ODOUR Bluestar Silicones France SAS (FR) 2015-09-02 EP disclosed
US-20150240069-A1 CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE ORGANIC RESIN COMPOSITION COMPRISING AN IODONIUM BORATE AND HAVING AN ACCEPTABLE SMELL BLUESTAR SILICONES FRANCE SAS (FR) 2015-08-27 US disclosed
US-20150232700-A1 CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE COMPOSITION COMPRISING AN IODONIUM BORATE AND RELEASING AN ACCEPTABLE ODOR ELKEM SILICONES FRANCE SAS (FR) 2015-08-20 US disclosed
EP-2904021-A1 CATIONICALLY CROSS-LINKABLE/POLYMERIZABLE ORGANIC RESIN COMPOSITION COMPRISING AN IODONIUM BORATE AND HAVING AN ACCEPTABLE SMELL Bluestar Silicones France SAS (FR) 2015-08-12 EP disclosed
US-6617401-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
US-6617400-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US disclosed
US-20030071367-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US disclosed
US-20030071368-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US disclosed
US-20030071366-A1 For encapsulating a solid state device, such as a light emitting diode GENERAL ELECTRIC COMPANY 2003-04-17 US disclosed
EP-1285938-A1 Epoxy resin encapsulation compositions GENERAL ELECTRIC COMPANY (US) 2003-02-26 EP disclosed
EP-1285939-A1 Epoxy resin compositions and solid state devices encapsulated therewith GENERAL ELECTRIC COMPANY (US) 2003-02-26 EP disclosed
US-6507049-B1 Encapsulants for solid state devices GENERAL ELECTRIC COMPANY 2003-01-14 US disclosed
US-5145889-A For light-emitting diodes KABUSHIKI KAISHA TOSHIBA (JP) 1992-09-08 US disclosed