SCHEMBL4239055

SCHEMBL4239055

O=C(O)c1ccc(-c2ccc(C(=O)O)c(C(F)(F)F)c2C(F)(F)F)cc1

nearest known ligand 0.59

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CYP2C8 P10632 2/20 0.59
RXRA P19793 5/20 0.51
RXRB P28702 5/20 0.51
RXRG P48443 2/20 0.51
FOLH1 Q04609 1/20 0.45
SRD5A2 P31213 3/20 0.43
BCL2L1 Q07817 1/20 0.43
BAD Q92934 1/20 0.43
AKR1C3 P42330 1/20 0.43
AKR1C2 P52895 1/20 0.43
MAP4K4 O95819 1/20 0.42
PDK2 Q15119 1/20 0.40
TP53 P04637 1/20 0.40
TSHR P16473 1/20 0.40
HDAC1 Q13547 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
ADH5 P11766 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2524408 0.86 PTPN1 (0.46) CYP2C8RXRARXRBFOLH1AKR1C3
SCHEMBL27990317 0.80 ALDH1A1 (0.50) CYP2C8RXRARXRBRXRGSRD5A2
SCHEMBL28678120 0.78 CYP2C8 (0.49) CYP2C8RXRARXRBRXRGFOLH1
SCHEMBL2524411 0.75 RXRA (0.50) CYP2C8RXRARXRBRXRGFOLH1
SCHEMBL28160253 0.75 TTR (0.57) CYP2C8RXRARXRBRXRGFOLH1
SCHEMBL28847187 0.74 RXRA (0.49) CYP2C8RXRARXRBRXRGFOLH1
SCHEMBL30585141 0.74 BCL2L1 (0.52) CYP2C8FOLH1SRD5A2BCL2L1BAD
SCHEMBL26639280 0.74 BCL2L1 (0.52) CYP2C8FOLH1SRD5A2BCL2L1BAD
SCHEMBL5934445 0.73 HNF4A (0.54) CYP2C8RXRARXRBFOLH1AKR1C3
Hydrochloric Acid SCHEMBL29281803 0.73 FOLH1 (0.44) FOLH1PDK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119264851-A Type-C male connector epoxy pouring sealant and preparation method thereof 青岛德聚胶接技术有限公司 2025-01-07 CN claimed
CN-119264851-A Type-C male connector epoxy pouring sealant and preparation method thereof 青岛德聚胶接技术有限公司 2025-01-07 CN disclosed
CN-114599739-B Optical film and flexible display device 住友化学株式会社 2024-12-17 CN disclosed
US-20230139673-A1 RESIN PARTICLE, TONER, DEVELOPER, DEVELOPER STORAGE CONTAINER, RESIN PARTICLE PRODUCING METHOD, TONER PRODUCING METHOD, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD RICOH COMPANY, LTD. (JP) 2023-05-04 US disclosed
CN-109804310-B Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same 东丽株式会社 2022-09-30 CN disclosed
CN-114460809-A Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same 东丽株式会社 2022-05-10 CN disclosed
CN-108885399-B Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same 东丽株式会社 2022-03-15 CN disclosed
CN-109232226-B Microporous metal organic framework material and preparation method and application thereof 中山大学 2021-05-07 CN disclosed
CN-110100192-B Optical film and method for producing optical film 富士胶片株式会社 2021-02-09 CN disclosed
EP-2109008-B1 Image formation method RICOH CO LTD (JP) 2013-08-14 EP disclosed
EP-2109008-A1 Image formation method and image forming apparatus Ricoh Company, Ltd. (JP) 2009-10-14 EP disclosed