SCHEMBL4276776

SCHEMBL4276776

CCC(C)C(CO)(CO)CO

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.37
DPP4 P27487 1/20 0.35
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL27717055 0.97 TSHR (0.35) TSHRDPP4
SCHEMBL1614870 0.88 TSHR (0.33) TSHRDPP4
SCHEMBL1615161 0.84 TSHR (0.30) TSHR
SCHEMBL9788210 0.84 TSHR (0.30) TSHR
Malonic Acid SCHEMBL10773480 0.83 LDHA (0.39) TSHR
Methacrylic Acid SCHEMBL27853217 0.80 TGFBR1 (0.32) TSHRTDP1
Acrylic Acid SCHEMBL29735550 0.80 LMNA (0.40) TSHR
SCHEMBL29780386 0.80 ALDH1A1 (0.33) TSHR
SCHEMBL35136 0.78 TSHR (0.41) TSHRDPP4TDP1
SCHEMBL5412610 0.77 TSHR (0.43) TSHRDPP4TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114806063-A Composite material with electric conduction, heat conduction and shape memory performance and preparation method thereof 江苏大学 2022-07-29 CN disclosed
WO-2022124388-A1 COMPOSITION FOR FORMING COATING 花王株式会社 2022-06-16 WO disclosed
CN-106393838-B Photoresist laminated body is rolled up 旭化成株式会社 2018-09-28 CN disclosed
CN-104903207-A Photosensitive resin laminate roll ASAHI KASEI E MATERIALS CORP 2015-09-09 CN disclosed
CN-104111585-A Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern ASAHI KASEI E MATERIALS CORP 2014-10-22 CN disclosed
CN-103025518-B Gas barrier film, process for production of gas barrier film, and electronic device KONICA MINOLTA HOLDINGS, INC. (JP) 2014-10-15 CN disclosed
CN-101779165-B Photosensitive resin composition and laminate thereof ASAHI KASEI E MATERIALS CORP 2014-09-24 CN disclosed
CN-104024894-A Optical substrate and light-emitting device ASAHI KASEI E MATERIALS CORP 2014-09-03 CN disclosed
CN-103958182-A Gas barrier film and electronic device KONICA MINOLTA INC 2014-07-30 CN disclosed
CN-103796827-A Gas barrier film, method for producing gas barrier film, and electronic device KONICA MINOLTA INC 2014-05-14 CN disclosed
US-20080194434-A1 Use Of Aqueous Dispersions For Tertiary Mineral Oil Production BASF AKTIENGESELLSCHAFT (DE) 2008-08-14 US disclosed
CN-101107419-A Use of aqueous dispersions for tertiary petroleum production BASF AG (DE) 2008-01-16 CN disclosed
CN-101030038-A Polymer solutions, aqueous developable thick film compositions, processes of making and electrodes formed thereof DU PONT (US) 2007-09-05 CN disclosed
CN-1945428-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 CN disclosed
CN-1768436-A Visible wavelength detector systems and filters therefor 3M INNOVATIVE PROPERTIES CO (US) 2006-05-03 CN disclosed
CN-1088319-C Thick-film conductor circuit and production method therefor ASAHI CHEMICAL IND (JP) 2002-07-24 CN disclosed
CN-1224565-A Thick film conductor circuit and method for manufacturing the same ASAHI CHEMICAL IND (JP) 1999-07-28 CN disclosed
EP-0267698-B1 CURING COMPOSITION IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1993-06-23 EP disclosed
US-4785035-A SILYL GROUP CONTAINING ACRYLATE AND ISOCYANATE OLIGOMER IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1988-11-15 US disclosed
EP-0267698-A2 Curing composition IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1988-05-18 EP disclosed