Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL428361 | 0.92 | TDP1 (0.47) | TDP1TSHRHSD17B10 | |
| SCHEMBL15387104 | 0.92 | TDP1 (0.47) | TDP1TSHRHSD17B10 | |
| SCHEMBL10277506 | 0.83 | TDP1 (0.41) | TDP1HSD17B10MAPK1 | |
| SCHEMBL2948120 | 0.81 | TDP1 (0.38) | TDP1TSHRHSD17B10MAPK1 | |
| SCHEMBL432085 | 0.80 | TDP1 (0.39) | TDP1HSD17B10 | |
| SCHEMBL4314541 | 0.77 | TDP1 (0.49) | TDP1HSD17B10 | |
| SCHEMBL429521 | 0.77 | MAPT (0.41) | TDP1HSD17B10 | |
| SCHEMBL18493329 | 0.77 | LMNA (0.48) | — | |
| SCHEMBL429420 | 0.75 | TDP1 (0.46) | TDP1HSD17B10 | |
| SCHEMBL426341 | 0.75 | TDP1 (0.46) | TDP1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 393 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114805122-B | Esterification reaction method | 江苏和成新材料有限公司 | 2024-03-01 | — | — | CN | claimed |
| US-20230249127-A1 | RATE ENHANCEMENT OF GAS CAPTURE PROCESSES | C-CAPTURE LTD (GB) | 2023-08-10 | — | — | US | claimed |
| EP-4182058-A1 | RATE ENHANCEMENT OF GAS CAPTURE PROCESSES | C-Capture Ltd. (GB) | 2023-05-24 | — | — | EP | claimed |
| CN-115867372-A | Rate enhancement of gas capture process | 碳捕获有限公司 | 2023-03-28 | — | — | CN | claimed |
| CN-114805122-A | Esterification reaction method | 江苏和成新材料有限公司 | 2022-07-29 | — | — | CN | claimed |
| US-20220026802-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT | JSR CORPORATION (JP) | 2022-01-27 | — | — | US | claimed |
| WO-2022013550-A1 | RATE ENHANCEMENT OF GAS CAPTURE PROCESSES | C-CAPTURE LTD (GB) | 2022-01-20 | — | — | WO | claimed |
| CN-113508337-A | Photosensitive resin composition, method for producing resist pattern film, and method for producing plated article | JSR株式会社 | 2021-10-15 | — | — | CN | claimed |
| CN-111808601-A | Quantum dot composition and display device | 苏州星烁纳米科技有限公司 | 2020-10-23 | — | — | CN | claimed |
| CN-107857780-B | Synthesis method of fluoro-phosphazene compound, fluoro-phosphazene compound and electrolyte for battery | 微宏动力系统（湖州）有限公司 | 2020-09-15 | — | — | CN | claimed |
| CN-111117779-A | Environment-friendly cleaning agent for aircraft glass and preparation method thereof | 西安元创化工科技股份有限公司 | 2020-05-08 | — | — | CN | claimed |
| EP-3228592-A1 | GRAPHENE DISPERSANT AND APPLICATION THEREOF | Ningbo Zkjh New Material Co. Ltd. (CN) | 2017-10-11 | — | — | EP | claimed |
| CN-105198713-A | Method for catalytically synthesizing 3,4'-dichlorodiphenyl ether by using microwaves | UNIV HUANGSHAN | 2015-12-30 | — | — | CN | claimed |
| US-20150333269-A1 | SOLVENT OR SOLVENT COMPOSITION FOR MANUFACTURING ORGANIC TRANSISTOR | DAICEL CORPORATION (JP) | 2015-11-19 | — | — | US | claimed |
| CN-103857751-A | Composition for preparing alignment layer, alignment layer prepared therefrom, and retardation film | DONGWOO FINE CHEM CO LTD | 2014-06-11 | — | — | CN | claimed |
| CN-101575397-A | Method for preparing water-soluble solid styrene/acrylic resin and application thereof | UNIV SUN YAT SEN (CN) | 2009-11-11 | — | — | CN | claimed |
| CN-100430451-C | Sprayable adhesive material for laser marking semiconductor wafers, dies and devices | NAT STARCH CHEM INVEST (US) | 2008-11-05 | — | — | CN | claimed |
| CN-1811596-A | Light-sensitive resin composite | DONGJIN SEMICHEM CO LTD (KR) | 2006-08-02 | — | — | CN | claimed |
| US-20050209355-A1 | [Novel Reactions and the Products of Such Reactions] | ROITMAN LIPA L | 2005-09-22 | — | — | US | claimed |
| US-12600811-B2 | Crosslinking agent composition for water-compatible resin, and water-compatible resin composition | NISSHINBO CHEMICAL INC. (JP) | 2026-04-14 | — | — | US | disclosed |
| EP-4083143-B1 | CROSSLINKING AGENT COMPOSITION FOR WATER-COMPATIBLE RESIN, AND WATER-COMPATIBLE RESIN COMPOSITION | NISSHINBO CHEMICAL INC (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250333548-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-10-30 | — | — | US | disclosed |
| EP-4012726-B1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORP (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-20250282900-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-09-11 | — | — | US | disclosed |
| US-20250138421-A1 | PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-05-01 | — | — | US | disclosed |
| US-12275856-B2 | Fast drying inkjet ink compositions | AVERY DENNISON CORPORATION (US) | 2025-04-15 | — | — | US | disclosed |
| WO-2025071108-A1 | RESIN COMPOSITION FOR ANTI-REFLECTIVE FILM, ANTI-REFLECTIVE FILM, AND SOLID-STATE IMAGING DEVICE | 동우 화인켐 주식회사 | 2025-04-03 | — | — | WO | disclosed |
| US-20250060668-A1 | PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-02-20 | — | — | US | disclosed |
| US-20240402602-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-12-05 | — | — | US | disclosed |
| CN-113025346-B | Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal element | JSR株式会社 | 2024-11-29 | — | — | CN | disclosed |
| US-12152169-B2 | Adhesive conductive paste | DAICEL CORPORATION (JP) | 2024-11-26 | — | — | US | disclosed |
| US-20240384056-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-11-21 | — | — | US | disclosed |
| WO-2024219382-A1 | LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE | 株式会社ダイセル | 2024-10-24 | — | — | WO | disclosed |
| CN-118488975-A | Photosensitive composition | 东京应化工业株式会社 | 2024-08-13 | — | — | CN | disclosed |
| WO-2024158178-A1 | THERMOSETTING RESIN COMPOSITION, CURED FILM, AND SOLID-STATE IMAGING DEVICE | 동우 화인켐 주식회사 | 2024-08-02 | — | — | WO | disclosed |
| US-20240239922-A1 | PHOTOCURABLE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| WO-2024147537-A1 | RESIN COMPOSITION FOR ANTI-REFLECTION FILM, ANTI-REFLECTION FILM, AND SOLID-STATE IMAGING DEVICE | 동우 화인켐 주식회사 | 2024-07-11 | — | — | WO | disclosed |
| US-20240191003-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-20240192593-A1 | PHOTOSENSITIVE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-20240182625-A1 | CARBODIIMIDE COMPOSITION | NISSHINBO CHEMICAL INC. (JP) | 2024-06-06 | — | — | US | disclosed |
| CN-117999296-A | Composition and photosensitive composition | 东京应化工业株式会社 | 2024-05-07 | — | — | CN | disclosed |
| CN-117980347-A | Photosensitive composition | 东京应化工业株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117980346-A | Composition and photosensitive composition | 东京应化工业株式会社 | 2024-05-03 | — | — | CN | disclosed |
| US-20240142874-A1 | NON-CHEMICALLY AMPLIFIED RESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2024-05-02 | — | — | US | disclosed |
| CN-117908327-A | Composition and photosensitive composition | 东京应化工业株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-117908326-A | Photosensitive composition | 东京应化工业株式会社 | 2024-04-19 | — | — | CN | disclosed |
| EP-4332161-A1 | CARBODIIMIDE COMPOSITION | Nisshinbo Chemical Inc. (JP) | 2024-03-06 | — | — | EP | disclosed |
| CN-114805122-B | Esterification reaction method | 江苏和成新材料有限公司 | 2024-03-01 | — | — | CN | disclosed |
| US-11905361-B2 | Base proliferating agent, and base-reactive resin composition containing said base proliferating agent | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2024-02-20 | — | — | US | disclosed |
| EP-4317196-A1 | PHOTOCURABLE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-07 | — | — | EP | disclosed |
| CN-115109413-B | Curable resin composition, film, color conversion panel, and display device | 三星SDI株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-117396566-A | Aqueous ink and ink set comprising same | DNP精细化工股份有限公司 | 2024-01-12 | — | — | CN | disclosed |
| CN-117396567-A | Pretreatment ink and ink set comprising the same | DNP精细化工股份有限公司 | 2024-01-12 | — | — | CN | disclosed |
| EP-3956410-B1 | FAST DRYING INKJET INK COMPOSITIONS | AVERY DENNISON CORP (US) | 2023-12-27 | — | — | EP | disclosed |
| CN-117295799-A | Nonaqueous ink composition, ink set, recorded matter, recording method, and method for producing recorded matter | DNP精细化工股份有限公司 | 2023-12-26 | — | — | CN | disclosed |
| WO-2023238286-A1 | PHOTOSENSITIVE RESIN COMPOSITION | ラサ工業株式会社 | 2023-12-14 | — | — | WO | disclosed |
| CN-117178001-A | Photocurable composition | 东京应化工业株式会社 | 2023-12-05 | — | — | CN | disclosed |
| WO-2023203837-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-10-26 | — | — | WO | disclosed |
| WO-2023203845-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-10-26 | — | — | WO | disclosed |
| CN-113993954-B | Quick-drying inkjet ink composition | 艾利丹尼森公司 | 2023-10-24 | — | — | CN | disclosed |
| CN-116917423-A | Nonaqueous ink composition, ink set, recording method using same, method for producing recorded matter, and inkjet recording device | DNP精细化工股份有限公司 | 2023-10-20 | — | — | CN | disclosed |
| CN-116867860-A | Ink set | DNP精细化工股份有限公司 | 2023-10-10 | — | — | CN | disclosed |
| US-20230249127-A1 | RATE ENHANCEMENT OF GAS CAPTURE PROCESSES | C-CAPTURE LTD (GB) | 2023-08-10 | — | — | US | disclosed |
| US-20230242692-A1 | COMPOSITION AND CURED PRODUCT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-03 | — | — | US | disclosed |
| CN-116515023-A | Composition and cured product | 东京应化工业株式会社 | 2023-08-01 | — | — | CN | disclosed |
| WO-2023120077-A1 | COMPOSITION, AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-06-29 | — | — | WO | disclosed |
| WO-2023120076-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-06-29 | — | — | WO | disclosed |
| CN-116249807-A | Resin composition, nonwoven fabric, and fibrous product, separator for electric storage element, secondary battery, and electric double layer capacitor using same | 东丽株式会社 | 2023-06-09 | — | — | CN | disclosed |
| EP-4182058-A1 | RATE ENHANCEMENT OF GAS CAPTURE PROCESSES | C-Capture Ltd. (GB) | 2023-05-24 | — | — | EP | disclosed |
| WO-2023074265-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074266-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074264-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023058418-A1 | COMPOSITION, AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-04-13 | — | — | WO | disclosed |
| WO-2023047850-A1 | PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-03-30 | — | — | WO | disclosed |
| WO-2023047856-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-03-30 | — | — | WO | disclosed |
| WO-2023047855-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | 東京応化工業株式会社 | 2023-03-30 | — | — | WO | disclosed |
| CN-115867372-A | Rate enhancement of gas capture process | 碳捕获有限公司 | 2023-03-28 | — | — | CN | disclosed |
| CN-109799680-B | Chemically amplified positive photosensitive resin composition and use thereof | 奇美实业股份有限公司 | 2023-03-10 | — | — | CN | disclosed |
| US-11591435-B2 | Polycarbodiimide compound, production method therefor, and resin composition | NISSHINBO CHEMICAL INC. (JP) | 2023-02-28 | — | — | US | disclosed |
| US-20230040953-A1 | CROSSLINKING AGENT COMPOSITION FOR WATER-COMPATIBLE RESIN, AND WATER-COMPATIBLE RESIN COMPOSITION | NISSHINBO CHEMICAL INC. (JP) | 2023-02-09 | — | — | US | disclosed |
| CN-108241257-B | Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing molded article by plating | 奇美实业股份有限公司 | 2022-11-08 | — | — | CN | disclosed |
| WO-2022230742-A1 | CARBODIIMIDE COMPOSITION | 日清紡ケミカル株式会社 | 2022-11-03 | — | — | WO | disclosed |
| EP-4083143-A1 | CROSSLINKING AGENT COMPOSITION FOR WATER-COMPATIBLE RESIN, AND WATER-COMPATIBLE RESIN COMPOSITION | Nisshinbo Chemical Inc. (JP) | 2022-11-02 | — | — | EP | disclosed |
| WO-2022225029-A1 | PHOTOCURABLE COMPOSITION | 東京応化工業株式会社 | 2022-10-27 | — | — | WO | disclosed |
| US-20220332886-A1 | Base Proliferating Agent, and Base-Reactive Resin Composition Containing Said Base Proliferating Agent | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2022-10-20 | — | — | US | disclosed |
| CN-108241258-B | Resin composition for liquid crystal display device, film for liquid crystal display device, and copolymer | 住友化学株式会社 | 2022-10-18 | — | — | CN | disclosed |
| WO-2022208663-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND CURABLE COMPOSITION | 昭和電工マテリアルズ株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-115109413-A | Curable resin composition, film, color conversion panel, and display device | 三星SDI株式会社 | 2022-09-27 | — | — | CN | disclosed |
| CN-107561863-B | Positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2022-09-16 | — | — | CN | disclosed |
| US-20220275247-A1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORPORATION (JP) | 2022-09-01 | — | — | US | disclosed |
| US-11401370-B2 | Base proliferating agent, and base-reactive resin composition containing said base proliferating agent | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2022-08-02 | — | — | US | disclosed |
| CN-114805122-A | Esterification reaction method | 江苏和成新材料有限公司 | 2022-07-29 | — | — | CN | disclosed |
| CN-114787226-A | Composition and cured product thereof | 株式会社大赛璐 | 2022-07-22 | — | — | CN | disclosed |
| US-20220204794-A1 | FAST DRYING INKJET INK COMPOSITIONS | AVERY DENNISON CORPORATION | 2022-06-30 | — | — | US | disclosed |
| US-20220187517-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND WAVELENGTH CONVERSION RESIN COMPOSITION | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-06-16 | — | — | US | disclosed |
| EP-4012726-A1 | ADHESIVE CONDUCTIVE PASTE | Daicel Corporation (JP) | 2022-06-15 | — | — | EP | disclosed |
| US-20220179138-A1 | WAVELENGTH CONVERSION MEMBER AND UTILIZATION THEREOF, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-06-09 | — | — | US | disclosed |
| CN-108391449-B | Method for manufacturing semiconductor element and method for manufacturing solar cell | 东丽株式会社 | 2022-05-17 | — | — | CN | disclosed |
| CN-114270453-A | Adhesive conductor paste | 株式会社大赛璐 | 2022-04-01 | — | — | CN | disclosed |
| CN-110573545-B | Polycarbodiimide compound, method for producing same, and resin composition | 日清纺化学株式会社 | 2022-03-11 | — | — | CN | disclosed |
| EP-3956410-A1 | FAST DRYING INKJET INK COMPOSITIONS | Avery Dennison Corporation (US) | 2022-02-23 | — | — | EP | disclosed |
| CN-113993954-A | Quick drying inkjet ink compositions | 艾利丹尼森公司 | 2022-01-28 | — | — | CN | disclosed |
| US-20220026802-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT | JSR CORPORATION (JP) | 2022-01-27 | — | — | US | disclosed |
| WO-2022013550-A1 | RATE ENHANCEMENT OF GAS CAPTURE PROCESSES | C-CAPTURE LTD (GB) | 2022-01-20 | — | — | WO | disclosed |
| EP-3536683-B1 | POLYISOCYANATE COMPOSITION AND ISOCYANATE POLYMER COMPOSITION | ASAHI CHEMICAL IND (JP) | 2021-11-24 | — | — | EP | disclosed |
| CN-107963982-B | Polyisocyanate composition and isocyanate polymer composition | 旭化成株式会社 | 2021-11-12 | — | — | CN | disclosed |
| CN-113557456-A | Wavelength conversion member, application thereof, backlight unit and image display device | 昭和电工材料株式会社 | 2021-10-26 | — | — | CN | disclosed |
| CN-113557610-A | Wavelength conversion member, backlight unit, image display device, and resin composition for wavelength conversion | 昭和电工材料株式会社 | 2021-10-26 | — | — | CN | disclosed |
| CN-113508337-A | Photosensitive resin composition, method for producing resist pattern film, and method for producing plated article | JSR株式会社 | 2021-10-15 | — | — | CN | disclosed |
| CN-106336739-B | Colorant dispersion for color filter, coloring composition for color filter, and display device | DNP精细化工股份有限公司 | 2021-09-28 | — | — | CN | disclosed |
| US-20210292643-A1 | WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, RESIN COMPOSITION FOR WAVELENGTH CONVERSION, AND RESIN CURED PRODUCT FOR WAVELENGTH CONVERSION | SHOWA DENKO MATERIALS CO LTD (JP) | 2021-09-23 | — | — | US | disclosed |
| CN-111527139-B | Alkali proliferating agent and alkali-reactive resin composition containing the same | 日本化药株式会社 | 2021-08-17 | — | — | CN | disclosed |
| US-11061278-B2 | Wavelength conversion member, back light unit, image display device, resin composition for wavelength conversion, and resin cured product for wavelength conversion | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-07-13 | — | — | US | disclosed |
| WO-2021132474-A1 | CROSSLINKING AGENT COMPOSITION FOR WATER-COMPATIBLE RESIN, AND WATER-COMPATIBLE RESIN COMPOSITION | 日清紡ケミカル株式会社 | 2021-07-01 | — | — | WO | disclosed |
| CN-113025346-A | Liquid crystal aligning agent, liquid crystal alignment film, and liquid crystal element | JSR株式会社 | 2021-06-25 | — | — | CN | disclosed |
| US-20210139632-A1 | POLYCARBODIIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND RESIN COMPOSITION | NISSHINBO CHEMICAL INC. (JP) | 2021-05-13 | — | — | US | disclosed |
| US-20210139769-A1 | WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, CURABLE COMPOSITION AND CURED PRODUCT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-05-13 | — | — | US | disclosed |
| US-20210139768-A1 | WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, AND CURABLE COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-05-13 | — | — | US | disclosed |
| WO-2021084603-A1 | RESIN COMPOSITION FOR WAVELENGTH CONVERSION, CURED RESIN MATERIAL FOR WAVELENGTH CONVERSION, WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | 昭和電工マテリアルズ株式会社 | 2021-05-06 | — | — | WO | disclosed |
| WO-2021054201-A1 | COMPOSITION AND CURED PRODUCT THEREOF | 株式会社ダイセル | 2021-03-25 | — | — | WO | disclosed |
| CN-107272342-B | Negative photosensitive resin composition | 东友精细化工有限公司 | 2021-03-05 | — | — | CN | disclosed |
| US-20210040383-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-02-11 | — | — | US | disclosed |
| EP-3767345-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION | Hitachi Chemical Company, Ltd. (JP) | 2021-01-20 | — | — | EP | disclosed |
| CN-112230319-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2021-01-15 | — | — | CN | disclosed |
| EP-3761077-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, CURABLE COMPOSITION AND CURED PRODUCT | Hitachi Chemical Company, Ltd. (JP) | 2021-01-06 | — | — | EP | disclosed |
| EP-3761076-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION | Hitachi Chemical Company, Ltd. (JP) | 2021-01-06 | — | — | EP | disclosed |
| CN-112180488-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2021-01-05 | — | — | CN | disclosed |
| US-20200407487-A1 | Base Proliferating Agent, and Base-Reactive Resin Composition Containing Said Base Proliferating Agent | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| CN-105938298-B | Negative photosensitive resin composition, photocured pattern formed by using same and image display device | 东友精细化工有限公司 | 2020-12-29 | — | — | CN | disclosed |
| CN-111999980-A | Chemically amplified positive photosensitive resin composition, protective film and module | 奇美实业股份有限公司 | 2020-11-27 | — | — | CN | disclosed |
| CN-111971591-A | Wavelength conversion member, backlight unit, image display device, and curable composition | 日立化成株式会社 | 2020-11-20 | — | — | CN | disclosed |
| CN-111919142-A | Wavelength conversion member, backlight unit, image display device, curable composition, and cured product | 日立化成株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111902744-A | Wavelength conversion member, backlight unit, image display device, and curable composition | 日立化成株式会社 | 2020-11-06 | — | — | CN | disclosed |
| CN-107434941-B | Resin composition and cured film | 住友化学株式会社 | 2020-10-30 | — | — | CN | disclosed |
| EP-3372579-B1 | POLYISOCYANATE COMPOSITION AND ISOCYANATE POLYMER COMPOSITION | ASAHI CHEMICAL IND (JP) | 2020-10-28 | — | — | EP | disclosed |
| CN-111808601-A | Quantum dot composition and display device | 苏州星烁纳米科技有限公司 | 2020-10-23 | — | — | CN | disclosed |
| WO-2020214323-A1 | FAST DRYING INKJET INK COMPOSITIONS | AVERY DENNISON CORPORATION (US) | 2020-10-22 | — | — | WO | disclosed |
| CN-111763445-A | Quantum dot ink, electroluminescent device and preparation method thereof | 苏州星烁纳米科技有限公司 | 2020-10-13 | — | — | CN | disclosed |
| CN-107636033-B | Polyisocyanate composition, polyurethane resin, and two-pack type curable polyurethane composition | 三井化学株式会社 | 2020-10-13 | — | — | CN | disclosed |
| CN-107857780-B | Synthesis method of fluoro-phosphazene compound, fluoro-phosphazene compound and electrolyte for battery | 微宏动力系统（湖州）有限公司 | 2020-09-15 | — | — | CN | disclosed |
| US-20200255598-A1 | WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, RESIN COMPOSITION FOR WAVELENGTH CONVERSION, AND RESIN CURED PRODUCT FOR WAVELENGTH CONVERSION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-08-13 | — | — | US | disclosed |
| CN-111527139-A | Alkali proliferating agent and alkali-reactive resin composition containing the same | 日本化药株式会社 | 2020-08-11 | — | — | CN | disclosed |
| CN-107949876-B | Window substrate, method of manufacturing the same, and image display device having the same | 东友精细化工有限公司 | 2020-07-31 | — | — | CN | disclosed |
| US-20200241361-A1 | WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, RESIN COMPOSITION FOR WAVELENGTH CONVERSION, AND RESIN CURED PRODUCT FOR WAVELENGTH CONVERSION | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2020-07-30 | — | — | US | disclosed |
| EP-2915803-B1 | POLYISOCYANATE COMPOSITION AND ISOCYANATE POLYMER COMPOSITION | ASAHI CHEMICAL IND (JP) | 2020-07-22 | — | — | EP | disclosed |
| CN-111381442-A | Chemically amplified positive photosensitive resin composition and use thereof | 奇美实业股份有限公司 | 2020-07-07 | — | — | CN | disclosed |
| WO-2020137132-A1 | RESIN COMPOSITION, INK FOR INK JET PRINTING, AND ARTICLE HAVING RESIN FILM | 日立化成株式会社 | 2020-07-02 | — | — | WO | disclosed |
| US-10696790-B2 | Graphene dispersant and application thereof | NINGBO ZKJH NEW MATERIAL CO., LTD. (CN) | 2020-06-30 | — | — | US | disclosed |
| CN-105319852-B | Photosensitive resin composition, protective film and element with protective film | 奇美实业股份有限公司 | 2020-06-26 | — | — | CN | disclosed |
| CN-111324013-A | Chemically amplified positive photosensitive resin composition and use thereof | 奇美实业股份有限公司 | 2020-06-23 | — | — | CN | disclosed |
| US-10693080-B2 | Solvent for producing organic transistor | DAICEL CORPORATION (JP) | 2020-06-23 | — | — | US | disclosed |
| CN-106795285-B | Polyimide solution, heat-resistant nonwoven fabric, and method for producing same | 东丽株式会社 | 2020-06-05 | — | — | CN | disclosed |
| CN-106909028-B | Photosensitive resin composition, protective film and liquid crystal display element | 奇美实业股份有限公司 | 2020-06-05 | — | — | CN | disclosed |
| US-10669377-B2 | Polyimide solution, heat-resistant non-woven fabric, and method for manufacturing same | TORAY INDUSTRIES, INC. (JP) | 2020-06-02 | — | — | US | disclosed |
| CN-111183376-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2020-05-19 | — | — | CN | disclosed |
| CN-111149022-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2020-05-12 | — | — | CN | disclosed |
| CN-111117779-A | Environment-friendly cleaning agent for aircraft glass and preparation method thereof | 西安元创化工科技股份有限公司 | 2020-05-08 | — | — | CN | disclosed |
| CN-105319845-B | Photosensitive resin composition, protective film and element with protective film | 奇美实业股份有限公司 | 2020-04-21 | — | — | CN | disclosed |
| EP-3613784-A1 | POLYCARBODIIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND RESIN COMPOSITION | Nisshinbo Chemical Inc. (JP) | 2020-02-26 | — | — | EP | disclosed |
| CN-105785720-B | Photosensitive resin composition, photocured pattern formed therefrom, and image display device having the same | 东友精细化工有限公司 | 2020-02-07 | — | — | CN | disclosed |
| CN-105659404-B | Solvent for manufacturing organic transistor | 株式会社大赛璐 | 2020-02-07 | — | — | CN | disclosed |
| CN-110724604-A | Water-based environment-friendly neutral cleaning solution | 华璞微电子科技(宁波)有限公司 | 2020-01-24 | — | — | CN | disclosed |
| CN-105278243-B | Photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2020-01-07 | — | — | CN | disclosed |
| CN-110573545-A | Polycarbodiimide compound, method for producing same, and resin composition | 日清纺化学株式会社 | 2019-12-13 | — | — | CN | disclosed |
| CN-104950578-B | Colored photosensitive resin composition and color filter produced therefrom | 东友精细化工有限公司 | 2019-12-06 | — | — | CN | disclosed |
| US-10418559-B2 | Solvent or solvent composition for organic transistor production | DAICEL CORPORATION (JP) | 2019-09-17 | — | — | US | disclosed |
| EP-3536683-A1 | POLYISOCYANATE COMPOSITION AND ISOCYANATE POLYMER COMPOSITION | Asahi Kasei Kabushiki Kaisha (JP) | 2019-09-11 | — | — | EP | disclosed |
| WO-2019163981-A1 | BASE PROLIFERATING AGENT, AND BASE-REACTIVE RESIN COMPOSITION CONTAINING SAID BASE PROLIFERATING AGENT | 日本化薬株式会社 | 2019-08-29 | — | — | WO | disclosed |
| US-10301417-B2 | Polyisocyanate composition and isocyanate polymer composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-05-28 | — | — | US | disclosed |
| CN-104835724-B | Form the composition and method of p-diffusion layer, and the method for preparing photovoltaic cell | 日立化成工业株式会社 | 2019-01-04 | — | — | CN | disclosed |
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| US-10125212-B2 | Polyisocyanate composition and isocyanate polymer composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-11-13 | — | — | US | disclosed |
| EP-3372579-A1 | POLYISOCYANATE COMPOSITION AND ISOCYANATE POLYMER COMPOSITION | Asahi Kasei Kabushiki Kaisha (JP) | 2018-09-12 | — | — | EP | disclosed |
| CN-104835723-B | Form the composition and method of p-diffusion layer, and the method for preparing photovoltaic cell | 日立化成工业株式会社 | 2018-04-10 | — | — | CN | disclosed |
| CN-105977143-B | Form the composition and method of p-diffusion layer, and the method for preparing photovoltaic cell | 日立化成工业株式会社 | 2018-03-30 | — | — | CN | disclosed |
| EP-3282470-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | Hitachi Chemical Company, Ltd. (JP) | 2018-02-14 | — | — | EP | disclosed |
| US-20170342214-A1 | POLYIMIDE SOLUTION, HEAT-RESISTANT NON-WOVEN FABRIC, AND METHOD FOR MANUFACTURING SAME | TORAY INDUSTRIES, INC. (JP) | 2017-11-30 | — | — | US | disclosed |
| EP-2876671-B1 | COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL CO LTD (JP) | 2017-11-22 | — | — | EP | disclosed |
| US-20170298169-A1 | Polyisocyanate Composition and Isocyanate Polymer Composition | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-10-19 | — | — | US | disclosed |
| EP-3228592-A1 | GRAPHENE DISPERSANT AND APPLICATION THEREOF | Ningbo Zkjh New Material Co. Ltd. (CN) | 2017-10-11 | — | — | EP | disclosed |
| US-20170260054-A1 | GRAPHENE DISPERSANT AND APPLICATION THEREOF | NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING, CHINESE ACADEMY OF SCIENCES (CN) | 2017-09-14 | — | — | US | disclosed |
| EP-3216819-A1 | POLYIMIDE SOLUTION, HEAT-RESISTANT NON-WOVEN FABRIC, AND METHOD FOR MANUFACTURING SAME | Toray Industries, Inc. (JP) | 2017-09-13 | — | — | EP | disclosed |
| EP-2562793-B1 | METHOD FOR PRODUCING p-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT | HITACHI CHEMICAL CO LTD (JP) | 2017-08-30 | — | — | EP | disclosed |
| US-9714262-B2 | Composition for forming passivation layer, semiconductor substrate having passivation layer, method of producing semiconductor substrate having passivation layer, photovoltaic cell element, method of producing photovoltaic cell element and photovoltaic cell | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-07-25 | — | — | US | disclosed |
| US-20170168390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT | CHI MEI CORPORATION (TW) | 2017-06-15 | — | — | US | disclosed |
| CN-102169738-B | Composition and method for forming p-type diffusion layer, and method for manufacturing photovoltaic cell | 日立化成工业株式会社 | 2017-06-13 | — | — | CN | disclosed |
| CN-104900724-B | Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell | 日立化成工业株式会社 | 2017-05-10 | — | — | CN | disclosed |
| US-9608143-B2 | Composition for forming N-type diffusion layer, method of forming N-type diffusion layer, and method of producing photovoltaic cell | HITACHI CHEMICAL CO., LTD. (JP) | 2017-03-28 | — | — | US | disclosed |
| US-9606436-B2 | Photosensitive resin composition and application thereof | CHI MEI CORPORATION (TW) | 2017-03-28 | — | — | US | disclosed |
| US-20170052446-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF | CHI MEI CORPORATION (TW) | 2017-02-23 | — | — | US | disclosed |
| US-9520529-B2 | Composition for forming P-type diffusion layer, method of forming P-type diffusion layer, and method of producing photovoltaic cell | HITACHI CHEMICAL CO., LTD. (JP) | 2016-12-13 | — | — | US | disclosed |
| US-20160359078-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE WITH N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL ELEMENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-12-08 | — | — | US | disclosed |
| CN-106158603-A | Form composition and the method for n-type diffusion layer, and the method preparing photovoltaic cell | 日立化成工业株式会社 | 2016-11-23 | — | — | CN | disclosed |
| US-20160293849-A1 | SOLVENT FOR PRODUCING ORGANIC TRANSISTOR | DAICEL CORPORATION (JP) | 2016-10-06 | — | — | US | disclosed |
| CN-105977143-A | Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell | 日立化成工业株式会社 | 2016-09-28 | — | — | CN | disclosed |
| US-20160211389-A1 | COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOV OLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-07-21 | — | — | US | disclosed |
| EP-3041030-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE WITH N-TYPE DIFFUSION LAYER, AND METHOD FOR MANUFACTURING SOLAR CELL ELEMENT | Hitachi Chemical Company, Ltd. (JP) | 2016-07-06 | — | — | EP | disclosed |
| EP-2665089-B1 | COMPOSITION FOR FORMING p-TYPE DIFFUSION LAYER, METHOD OF PRODUCING SILICON SUBSTRATE HAVING p-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING PHOTOVOLTAIC CELL , AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL CO LTD (JP) | 2016-06-29 | — | — | EP | disclosed |
| CN-105503545-A | Preparation method of (poly-) propanediol diether | DAICEL CORP | 2016-04-20 | — | — | CN | disclosed |
| EP-3007210-A2 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF PRODUCING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT | Hitachi Chemical Company, Ltd. (JP) | 2016-04-13 | — | — | EP | disclosed |
| US-20160035915-A1 | SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-02-04 | — | — | US | disclosed |
| CN-105254843-A | Polyisocyanate composition, blocking polyisocyanate composition and manufacture methods thereof | ASAHI KASEI CHEMICALS CORP | 2016-01-20 | — | — | CN | disclosed |
| CN-105198713-A | Method for catalytically synthesizing 3,4'-dichlorodiphenyl ether by using microwaves | UNIV HUANGSHAN | 2015-12-30 | — | — | CN | disclosed |
| CN-105161404-A | Composition for forming p-type diffusion layer, method of producing silicon substrate having p-type diffusion layer, method for producing photovoltaic cell , and photovoltaic cell | HITACHI CHEMICAL CO LTD | 2015-12-16 | — | — | CN | disclosed |
| CN-103483753-B | Curable resin composition, protective film and liquid crystal display element containing the protective film | CHI MEI CORP. (CN) | 2015-12-09 | — | — | CN | disclosed |
| US-20150333269-A1 | SOLVENT OR SOLVENT COMPOSITION FOR MANUFACTURING ORGANIC TRANSISTOR | DAICEL CORPORATION (JP) | 2015-11-19 | — | — | US | disclosed |
| US-20150303318-A1 | COMPOSITION FOR FORMING PASSIVATION FILM, SEMICONDUCTOR SUBSTRATE PROVIDED WITH PASSIVATION FILM AND PRODUCTION METHOD THEREFOR, AND PHOTOVOLTAIC CELL ELEMENT AND PRODUCTION METHOD THEREFOR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-10-22 | — | — | US | disclosed |
| US-20150303317-A1 | SEMICONDUCTOR SUBSTRATE PROVIDED WITH PASSIVATION FILM AND PRODUCTION METHOD, AND PHOTOVOLTAIC CELL ELEMENT AND PRODUCTION METHOD THEREFOR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-10-22 | — | — | US | disclosed |
| EP-2930740-A1 | COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | Hitachi Chemical Co., Ltd. (JP) | 2015-10-14 | — | — | EP | disclosed |
| CN-104910644-A | Method for producing pigment dispersion, pigment dispersion and colored resin composition for color filter | DNP FINE CHEMICALS CO LTD | 2015-09-16 | — | — | CN | disclosed |
| EP-2915803-A1 | POLYISOCYANATE COMPOSITION AND ISOCYANATE POLYMER COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2015-09-09 | — | — | EP | disclosed |
| CN-104900724-A | Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell | HITACHI CHEMICAL CO LTD | 2015-09-09 | — | — | CN | disclosed |
| CN-104844268-A | IMPURITIES DIFFUSION LAYER FORMING COMPOSITION, N-TYPE DIFFUSION LAYER FORMING COMPOSITION, METHOD FOR MANUFACTURING N-TYPE DIFFUSION LAYER, P-TYPE DIFFUSION LAYER FORMING COMPOSITION, METHOD FOR MANUFACTURING P-TYPE DIFFUSION LAYER, AND METHOD FOR MANUFACTURING SOLAR CELL ELEMENTS | HITACHI CHEMICAL CO LTD | 2015-08-19 | — | — | CN | disclosed |
| US-20150228812-A1 | COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOLOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-08-13 | — | — | US | disclosed |
| CN-104835724-A | Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell | HITACHI CHEMICAL CO LTD | 2015-08-12 | — | — | CN | disclosed |
| CN-104835723-A | Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell | HITACHI CHEMICAL CO LTD | 2015-08-12 | — | — | CN | disclosed |
| CN-103641694-B | A kind of preparation method of dipropylene glycol dipropyl ether | ANHUI LIXING CHEMICAL CO.,LTD. (CN) | 2015-08-12 | — | — | CN | disclosed |
| US-20150210631-A1 | Polyisocyanate Composition and Isocyanate Polymer Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2015-07-30 | — | — | US | disclosed |
| US-20150214390-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-07-30 | — | — | US | disclosed |
| US-20150214418-A1 | COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-07-30 | — | — | US | disclosed |
| CN-104810258-A | Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell | HITACHI CHEMICAL CO LTD | 2015-07-29 | — | — | CN | disclosed |
| US-20150166582-A1 | COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. a corporation | 2015-06-18 | — | — | US | disclosed |
| US-20150144845-A1 | SOLVENT OR SOLVENT COMPOSITION FOR ORGANIC TRANSISTOR PRODUCTION | DAICEL CORPORATION (JP) | 2015-05-28 | — | — | US | disclosed |
| EP-2876670-A1 | COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, SOLAR CELL ELEMENT, PRODUCTION METHOD FOR SOLAR CELL ELEMENT, AND SOLAR CELL | Hitachi Chemical Co., Ltd. (JP) | 2015-05-27 | — | — | EP | disclosed |
| EP-2876671-A1 | COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE WITH PASSIVATION LAYER, METHOD FOR PRODUCING SAID SEMICONDUCTOR SUBSTRATE, SOLAR CELL ELEMENT, AND METHOD FOR PRODUCING SAME | Hitachi Chemical Company, Ltd. (JP) | 2015-05-27 | — | — | EP | disclosed |
| CN-104619682-A | Polyisocyanate composition and isocyanate polymer composition | ASAHI KASEI CHEMICALS CORP | 2015-05-13 | — | — | CN | disclosed |
| US-9023589-B2 | Photosensitive resin composition and applications thereof | CHI MEI CORPORATION (TW) | 2015-05-05 | — | — | US | disclosed |
| US-20150099352-A1 | COMPOSITION FOR FORMING n-TYPE DIFFUSION LAYER, METHOD OF PRODUCING n-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT | HITACHI CHEMICAL COMPANY, LTD. | 2015-04-09 | — | — | US | disclosed |
| CN-104388058-A | Low-viscosity ultralow-temperature bidirectional wide-temperature secondary refrigerant | CHAOYANG GUANGDA CHEMICAL CO LTD | 2015-03-04 | — | — | CN | disclosed |
| EP-2819149-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE HAVING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT | Hitachi Chemical Company, Ltd. (JP) | 2014-12-31 | — | — | EP | disclosed |
| CN-104216223-A | PHOTOSENSITIVE RESIN COMPOSITION FOR SPACER AND SPACER MANUFACTURED BY THE SAME | DONGWOO FINE CHEM CO LTD | 2014-12-17 | — | — | CN | disclosed |
| CN-101955690-B | Method for manufacturing the pigment dispersed solution | SUMITOMO CHEMICAL CO | 2014-12-03 | — | — | CN | disclosed |
| CN-104119921-A | Etching paste composition and application thereof | CHI MEI CORP | 2014-10-29 | — | — | CN | disclosed |
| US-8841050-B2 | Photosensitive resin composition and applications thereof | CHI MEI CORPORATION (TW) | 2014-09-23 | — | — | US | disclosed |
| CN-103998957-A | Polarizing plate and image display device having same | DONGWOO FINE CHEM CO LTD | 2014-08-20 | — | — | CN | disclosed |
| EP-2743967-A1 | COMPOSITION THAT FORMS N-TYPE DIFFUSION LAYER, N-TYPE DIFFUSION LAYER MANUFACTURING METHOD AND SOLAR CELL ELEMENT MANUFACTURING METHOD | Hitachi Chemical Company, Ltd. (JP) | 2014-06-18 | — | — | EP | disclosed |
| US-20140158196-A1 | ELEMENT AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-06-12 | — | — | US | disclosed |
| CN-103857751-A | Composition for preparing alignment layer, alignment layer prepared therefrom, and retardation film | DONGWOO FINE CHEM CO LTD | 2014-06-11 | — | — | CN | disclosed |
| EP-2728624-A1 | SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD THEREFOR, SOLAR-CELL ELEMENT, AND SOLAR CELL | Hitachi Chemical Company, Ltd. (JP) | 2014-05-07 | — | — | EP | disclosed |
| US-20140120648-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| US-20140087307-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS THEREOF | CHI MEI CORPORATION (TW) | 2014-03-27 | — | — | US | disclosed |
| US-20140087308-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS THEREOF | CHI MEI CORPORATION (TW) | 2014-03-27 | — | — | US | disclosed |
| US-20140076396-A1 | SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-03-20 | — | — | US | disclosed |
| CN-103641694-A | Method for preparing dipropylene glycol dipropyl ether | ANHUI LIXING CHEMICAL CO LTD | 2014-03-19 | — | — | CN | disclosed |
| US-20140065761-A1 | COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-03-06 | — | — | US | disclosed |
| US-20140060385-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-03-06 | — | — | US | disclosed |
| CN-101970572-B | Photocurable composition | SEKISUI CHEMICAL CO LTD | 2014-01-29 | — | — | CN | disclosed |
| CN-103483753-A | Curable resin composition, protective film and liquid crystal display element containing the protective film | CHI MEI CORP | 2014-01-01 | — | — | CN | disclosed |
| CN-103492499-A | Silica-coating-forming composition for use with inkjets, method for forming silica coating, semiconductor device, and solar-cell system | HITACHI CHEMICAL CO LTD | 2014-01-01 | — | — | CN | disclosed |
| EP-2665089-A1 | COMPOSITION FOR FORMING p-TYPE DIFFUSION LAYER, METHOD OF PRODUCING SILICON SUBSTRATE HAVING p-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING PHOTOVOLTAIC CELL , AND PHOTOVOLTAIC CELL | Hitachi Chemical Company, Ltd. (JP) | 2013-11-20 | — | — | EP | disclosed |
| CN-101679829-B | Photocurable Adhesive Composition | SEKISUI CHEMICAL CO LTD | 2013-10-30 | — | — | CN | disclosed |
| EP-2642529-A1 | METHOD FOR PRODUCING PHOTOVOLTAIC CELL | Hitachi Chemical Company, Ltd. (JP) | 2013-09-25 | — | — | EP | disclosed |
| EP-2642527-A1 | METHOD FOR PRODUCING PHOTOVOLTAIC CELL | Hitachi Chemical Company, Ltd. (JP) | 2013-09-25 | — | — | EP | disclosed |
| EP-2642528-A1 | METHOD FOR PRODUCING SOLAR CELL | Hitachi Chemical Co., Ltd. (JP) | 2013-09-25 | — | — | EP | disclosed |
| CN-103323899-A | Polarizing plate and image display device comprising the same | DONGWOO FINE CHEM CO LTD | 2013-09-25 | — | — | CN | disclosed |
| US-8536242-B2 | Photocurable composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2013-09-17 | — | — | US | disclosed |
| CN-103299399-A | Composition for forming p-type diffusion layer, method for producing p-type diffusion layer, and method for producing solar cell element | HITACHI CHEMICAL CO LTD | 2013-09-11 | — | — | CN | disclosed |
| CN-101174089-B | Radiation sensitive resin composition for forming space body, space body and its forming method | JSR CORP | 2013-07-03 | — | — | CN | disclosed |
| CN-101770168-B | Photosensitive resin composition | SUMITOMO CHEMICAL CO | 2013-06-26 | — | — | CN | disclosed |
| US-8466229-B2 | Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film | HITACHI CHEMICAL CO., LTD. (JP) | 2013-06-18 | — | — | US | disclosed |
| CN-101458452-B | X-ray sensitive resin composition, barrier body and protection film of liquid crystal display member and their forming methods | JSR CORP | 2013-06-12 | — | — | CN | disclosed |
| CN-101339365-B | Radiation linear combination, colorful filter and colorful liquid crystal display unit | JSR CORP | 2013-06-12 | — | — | CN | disclosed |
| CN-101551589-B | Silica based positive type photosensitive organic compound | HITACHI CHEMICAL CO LTD | 2013-05-08 | — | — | CN | disclosed |
| US-8410000-B2 | Method for producing photovoltaic cell | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-04-02 | — | — | US | disclosed |
| US-20130078759-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | Hitachi Chemical Company ,Ltd. | 2013-03-28 | — | — | US | disclosed |
| CN-101921179-B | Preparation method of dipropylene glycol methyl propyl ether | ANHUI LIXING CHEMICAL CO LTD | 2013-03-27 | — | — | CN | disclosed |
| US-8404599-B2 | Method for producing photovoltaic cell | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-03-26 | — | — | US | disclosed |
| US-20130071968-A1 | COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-03-21 | — | — | US | disclosed |
| EP-2562793-A1 | COMPOSITION THAT FORMS p-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING p-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT | Hitachi Chemical Company, Ltd. (JP) | 2013-02-27 | — | — | EP | disclosed |
| EP-2562792-A1 | COMPOSITION THAT FORMS n-TYPE DIFFUSION LAYER, METHOD FOR PRODUCING n-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING SOLAR CELL ELEMENT | Hitachi Chemical Company, Ltd. (JP) | 2013-02-27 | — | — | EP | disclosed |
| US-20130025669-A1 | PHOTOVOLTAIC CELL SUBSTRATE, METHOD OF PRODUCING PHOTOVOLTAIC CELL SUBSTRATE, PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2013-01-31 | — | — | US | disclosed |
| US-20130025670-A1 | SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2013-01-31 | — | — | US | disclosed |
| CN-102827508-A | Solvent or solvent composition for printing | DAICEL FINECHEM LTD | 2012-12-19 | — | — | CN | disclosed |
| CN-101153121-B | Radiation-sensitive resin composition for spacer, spacer and method for forming the same | JSR CORP | 2012-11-14 | — | — | CN | disclosed |
| EP-1705207-B1 | METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM | JSR CORP (JP) | 2012-10-24 | — | — | EP | disclosed |
| CN-101387830-B | Radiation-sensitive resin composition for forming a colored layer and color filter | JSR CORP | 2012-10-03 | — | — | CN | disclosed |
| US-20120231575-A1 | METHOD FOR PRODUCING SOLAR CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-09-13 | — | — | US | disclosed |
| EP-2495771-A1 | SOLAR CELL | Hitachi Chemical Company, Ltd. (JP) | 2012-09-05 | — | — | EP | disclosed |
| EP-2495770-A1 | METHOD FOR PRODUCING SOLAR CELL | Hitachi Chemical Company, Ltd. (JP) | 2012-09-05 | — | — | EP | disclosed |
| US-20120211076-A1 | SOLAR CELL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-08-23 | — | — | US | disclosed |
| US-20120184062-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2012-07-19 | — | — | US | disclosed |
| US-20120178201-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2012-07-12 | — | — | US | disclosed |
| US-8217096-B2 | Photocurable pressure-sensitive adhesive composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2012-07-10 | — | — | US | disclosed |
| US-20120122263-A1 | METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2012-05-17 | — | — | US | disclosed |
| US-20120122264-A1 | METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2012-05-17 | — | — | US | disclosed |
| US-20120122265-A1 | METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2012-05-17 | — | — | US | disclosed |
| US-8158981-B2 | Radiation-sensitive composition, method of forming silica-based coating film, silica-based coating film, apparatus and member having silica-based coating film and photosensitizing agent for insulating film | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-04-17 | — | — | US | disclosed |
| US-8119323-B2 | Process for producing patterned film and photosensitive resin composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-20120021190-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING SILICA COATING FILM, AND APPARATUS AND MEMBER EACH COMPRISING SILICA COATING FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-26 | — | — | US | disclosed |
| US-8097745-B2 | Method of producing organosilicon compound | JSR CORPORATION (JP) | 2012-01-17 | — | — | US | disclosed |
| US-8093419-B2 | Method of producing organosilicon compound | JSR CORPORATION (JP) | 2012-01-10 | — | — | US | disclosed |
| CN-101025567-B | Radiation-sensitive resin composition, method for forming spacer and spacer | JSR CO., LTD. (JP) | 2011-12-14 | — | — | CN | disclosed |
| CN-101575397-B | Method for preparing water-soluble solid styrene/acrylic resin and application thereof | SUN YAT-SEN UNIVERSITY (CN) | 2011-12-14 | — | — | CN | disclosed |
| US-20110256658-A1 | METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2011-10-20 | — | — | US | disclosed |
| CN-102194672-A | Composition and method for forming n-type diffusion layer, and method for manufacturing photovoltaic cell | HITACHI CHEMICAL CO LTD | 2011-09-21 | — | — | CN | disclosed |
| CN-1664707-B | Scouring agent and flushing fluid for the planography | DAICEL CHEM | 2011-09-14 | — | — | CN | disclosed |
| CN-102187278-A | Photosensitive resin composition, method for forming silica-based coating film, and device and member having silica-based coating film | HITACHI CHEMICAL CO LTD | 2011-09-14 | — | — | CN | disclosed |
| CN-101017323-B | Radiation-sensitive resin composition, protrusion and spacer formed of the same, method of forming the radiation-sensitive resin composition, and liquid crystal display element | JSR CORP | 2011-09-07 | — | — | CN | disclosed |
| CN-1698018-B | Radiation-curable composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide | HITACHI CHEMICAL CO LTD | 2011-08-31 | — | — | CN | disclosed |
| CN-102169738-A | Composition and method for forming p-type diffusion layer and method for preparing photovoltaic cell | HITACHI CHEMICAL CO LTD | 2011-08-31 | — | — | CN | disclosed |
| US-20110195541-A1 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL | HITACHI CHEMICAL COMPANY, LTD. | 2011-08-11 | — | — | US | disclosed |
| EP-2348546-A2 | Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell | Hitachi Chemical Co., Ltd. (JP) | 2011-07-27 | — | — | EP | disclosed |
| CN-101137620-B | Alkali proliferating agent and alkali-reactive curable composition | SEKISUI CHEMICAL CO LTD | 2011-05-25 | — | — | CN | disclosed |
| CN-1935854-B | Polymers, radiation sensitive compositions for color filters, color filters and color liquid crystal display device or panel | JSR CORP | 2011-05-25 | — | — | CN | disclosed |
| CN-102040795-A | Resin composition | SUMITOMO CHEMICAL CO | 2011-05-04 | — | — | CN | disclosed |
| US-20110097669-A1 | PHOTOCURABLE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2011-04-28 | — | — | US | disclosed |
| US-20110082309-A1 | METHOD OF PRODUCING ORGANOSILICON COMPOUND | JSR CORPORATION (JP) | 2011-04-07 | — | — | US | disclosed |
| EP-1524306-B1 | Sprayable adhesive material for laser marking semiconductor wafers, dies and devices | HENKEL AG & CO KGAA (DE) | 2011-03-09 | — | — | EP | disclosed |
| CN-101955690-A | The manufacture method of dispersible pigment dispersion | SUMITOMO CHEMICAL CO | 2011-01-26 | — | — | CN | disclosed |
| CN-101258169-B | Radiation-sensitive resin composition and color filters | JSR CORP | 2011-01-19 | — | — | CN | disclosed |
| CN-101921179-A | Preparation method of dipropylene glycol methyl propyl ether | ANHUI LIXING CHEMICAL CO LTD | 2010-12-22 | — | — | CN | disclosed |
| CN-101910945-A | Photosensitive resin composition | SUMITOMO CHEMICAL CO | 2010-12-08 | — | — | CN | disclosed |
| CN-101130577-B | Polymer, radiation sensitive resin composition and spacer for liquid crystal display element | JSR CORP | 2010-08-25 | — | — | CN | disclosed |
| CN-1702554-B | Photosensitive resin composition | DONGJIN SIMIKEN CO LTD | 2010-08-18 | — | — | CN | disclosed |
| CN-101792568-A | Cured film | SUMITOMO CHEMICAL CO | 2010-08-04 | — | — | CN | disclosed |
| US-20100184880-A1 | PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-07-22 | — | — | US | disclosed |
| CN-101770168-A | Photosensitive resin composition | SUMITOMO CHEMICAL CO | 2010-07-07 | — | — | CN | disclosed |
| CN-101735400-A | Curable resin composition | SUMITOMO CHEMICAL CO | 2010-06-16 | — | — | CN | disclosed |
| CN-101727001-A | Photosensitive resin composition | SUMITOMO CHEMICAL CO | 2010-06-09 | — | — | CN | disclosed |
| US-7714162-B2 | Base multiplying agents and base-reactive curable compositions | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-05-11 | — | — | US | disclosed |
| US-20100102321-A1 | RADIATION-SENSITIVE COMPOSITION, METHOD OF FORMING SILICA-BASED COATING FILM, SILICA-BASED COATING FILM, APPARATUS AND MEMBER HAVING SILICA-BASED COATING FILM AND PHOTOSENSITIZING AGENT FOR INSULATING FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-04-29 | — | — | US | disclosed |
| CN-101679829-A | Photocurable adhesive composition | SEKISUI CHEMICAL CO LTD | 2010-03-24 | — | — | CN | disclosed |
| CN-101622577-A | Radiation-sensitive resin composition, spacer for liquid crystal display element, protective film, and method for forming same | JSR CORP | 2010-01-06 | — | — | CN | disclosed |
| US-20090299086-A1 | METHOD OF PRODUCING ORGANOSILICON COMPOUND | JSR CORPORATION (JP) | 2009-12-03 | — | — | US | disclosed |
| CN-101575397-A | Method for preparing water-soluble solid styrene/acrylic resin and application thereof | UNIV SUN YAT SEN (CN) | 2009-11-11 | — | — | CN | disclosed |
| US-20090269683-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND COLOR FILTERS | JSR CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| CN-101551589-A | Silica based positive type photosensitive organic compound | HITACHI CHEMICAL CO LTD (JP) | 2009-10-07 | — | — | CN | disclosed |
| CN-101520605-A | Photosensitive linear resin composition and separator for liquid crystal display element | JSR CORP (JP) | 2009-09-02 | — | — | CN | disclosed |
| US-20090214796-A1 | Method for Forming Antireflection Film | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090206328-A1 | Silicon-Containing Photosensitive Composition, Method for Forming Thin Film Pattern Using Same, Protective Film for Electronic Device, Gate Insulating Film And Thin Film Transistor | Matsukawa, Kimihiro (JP) | 2009-08-20 | — | — | US | disclosed |
| US-20090202942-A1 | PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2009-08-13 | — | — | US | disclosed |
| CN-100510961-C | Radiation-curing composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide | HITACHI CHEMICAL CO LTD (JP) | 2009-07-08 | — | — | CN | disclosed |
| CN-101458452-A | X-ray sensitive resin composition, barrier body and protection film of liquid crystal display member and their forming methods | JSR CORP (JP) | 2009-06-17 | — | — | CN | disclosed |
| US-7528207-B2 | Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film | JSR CORPORATION (JP) | 2009-05-05 | — | — | US | disclosed |
| US-20090110838-A1 | Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film | HITACHI CHEMICAL CO., LTD (JP) | 2009-04-30 | — | — | US | disclosed |
| CN-101403858-A | Radiation-sensitive composition for forming colored layer, color filter and color liquid crystal display device | JSR CORP (JP) | 2009-04-08 | — | — | CN | disclosed |
| CN-101398498-A | Coloring composite for color filter, color filter, and displaying device for color filter | FUJIFILM CORP (JP) | 2009-04-01 | — | — | CN | disclosed |
| CN-101387830-A | Radiation-sensitive resin composition for forming a colored layer and color filter | JSR CORP (JP) | 2009-03-18 | — | — | CN | disclosed |
| CN-100460432-C | Side chain unsaturated polymer, radiation sensitive resin composition and spacer for liquid crystal display element | JSR CORP (JP) | 2009-02-11 | — | — | CN | disclosed |
| US-20090026425-A1 | COMPOSITION COMPRISING POLYESTER AMIDE ACID AND THE LIKE AND INK-JET INK COMPOSITION USING THE SAME | CHISSO CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
| CN-101339365-A | Radiation linear combination, colorful filter and colorful liquid crystal display unit | JSR CORP (JP) | 2009-01-07 | — | — | CN | disclosed |
| CN-101329510-A | Polymer having unsaturated side chain, radiation-sensitive resin composition and spacer for liquid crystal display element | JSR CORP (JP) | 2008-12-24 | — | — | CN | disclosed |
| CN-101271270-A | Radiation sensitive resin composition, space body for liquid crystal display element and manufacturing method thereof | JSR CORP (JP) | 2008-09-24 | — | — | CN | disclosed |
| CN-101258169-A | Radiation-sensitive resin composition and color filters | JSR CORP (JP) | 2008-09-03 | — | — | CN | disclosed |
| US-20080200580-A1 | Base Multiplying Agents and Base-Reactive Curable Compositions | SEKISUI CHEMICAL CO., LTD (JP) | 2008-08-21 | — | — | US | disclosed |
| CN-101231468-A | Radiation sensitive resin composition and color filter | JSR CORP (JP) | 2008-07-30 | — | — | CN | disclosed |
| CN-101194187-A | Method for forming antireflection film | HITACHI CHEMICAL CO LTD (JP) | 2008-06-04 | — | — | CN | disclosed |
| CN-101174089-A | Radiation sensitive resin composition for forming space body, space body and its forming method | JSR CORP (JP) | 2008-05-07 | — | — | CN | disclosed |
| CN-101158812-A | Radiation sensitive resin composition and color filter | JSR CORP (JP) | 2008-04-09 | — | — | CN | disclosed |
| CN-101158811-A | Radiation sensitive resin composition and color filter | JSR CORP (JP) | 2008-04-09 | — | — | CN | disclosed |
| CN-101153121-A | Radiation-sensitive resin composition for spacer, spacer and method for forming the same | JSR CORP (JP) | 2008-04-02 | — | — | CN | disclosed |
| CN-101137620-A | Alkali proliferating agent and alkali-reactive curable composition | SEKISUI CHEMICAL CO LTD (JP) | 2008-03-05 | — | — | CN | disclosed |
| CN-101130577-A | Polymer, radiation sensitive resin composition and spacer for liquid crystal display element | JSR CORP (JP) | 2008-02-27 | — | — | CN | disclosed |
| EP-1890172-A1 | METHOD FOR FORMING ANTIREFLECTION FILM | Hitachi Chemical Co., Ltd. (JP) | 2008-02-20 | — | — | EP | disclosed |
| CN-101124518-A | Radiation-sensitive resin composition and color filter | JSR CORP (JP) | 2008-02-13 | — | — | CN | disclosed |
| CN-101099113-A | Silicon-containing photosensitive composition, method for producing thin film pattern using the same, protective film for electronic device, gate insulating film, and thin film transistor | SEKISUI CHEMICAL CO LTD (JP) | 2008-01-02 | — | — | CN | disclosed |
| EP-1835344-A1 | SILICON-CONTAINING PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING THIN FILM PATTERN USING SAME, PROTECTIVE FILM FOR ELECTRONIC DEVICE, GATE INSULATING FILM AND THIN FILM TRANSISTOR | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-09-19 | — | — | EP | disclosed |
| CN-101030036-A | Radiation sensitive resin composition and spacer for liquid crystal display element | JSR CORP (JP) | 2007-09-05 | — | — | CN | disclosed |
| CN-101025567-A | Radiation-sensitive resin composition, method for forming spacer and spacer | JSR CORP (JP) | 2007-08-29 | — | — | CN | disclosed |
| CN-101017323-A | Radiation-sensitive resin composition, protrusion and spacer formed of the same, method of forming the radiation-sensitive resin composition, and liquid crystal display element | JSR CORP (JP) | 2007-08-15 | — | — | CN | disclosed |
| CN-1935854-A | Polymers, radiation sensitive compositions for color filters, color filters and color liquid crystal display device or panel | JSR CORP (JP) | 2007-03-28 | — | — | CN | disclosed |
| US-7186945-B2 | Sprayable adhesive material for laser marking semiconductor wafers and dies | NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) | 2007-03-06 | — | — | US | disclosed |
| US-20070021580-A1 | Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film | JSR CORPORATION (JP) | 2007-01-25 | — | — | US | disclosed |
| US-20070015892-A1 | Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film | JSR CORPORATION (JP) | 2007-01-18 | — | — | US | disclosed |
| CN-1841192-A | X-ray sensitive resin composition, protruded body and barrier body formed thereby and liquid crystal display member containing the same | JSR CORP (JP) | 2006-10-04 | — | — | CN | disclosed |
| CN-1841196-A | X-ray sensitive resin composition, protruded body and barrier body formed thereby, forming method thereof and liquid crystal display element | JSR CORP (JP) | 2006-10-04 | — | — | CN | disclosed |
| EP-1705206-A1 | METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM | JSR Corporation (JP) | 2006-09-27 | — | — | EP | disclosed |
| EP-1705207-A1 | METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM | JSR Corporation (JP) | 2006-09-27 | — | — | EP | disclosed |
| CN-1834744-A | Radiation sensitive resin composition, protuberance and partition formed by same, its forming method and liquid crystal display device | JSR CORP (JP) | 2006-09-20 | — | — | CN | disclosed |
| CN-1811596-A | Light-sensitive resin composite | DONGJIN SEMICHEM CO LTD (KR) | 2006-08-02 | — | — | CN | disclosed |
| CN-1782877-A | Anti-corrosion agent composition | DAICEL CHEM (JP) | 2006-06-07 | — | — | CN | disclosed |
| CN-1765948-A | Side chain unsaturated polymer, radiation sensitive resin composition and spacer for liquid crystal display element | JSR CORP (JP) | 2006-05-03 | — | — | CN | disclosed |
| CN-1250655-C | Coating composition | JSR CORP (JP) | 2006-04-12 | — | — | CN | disclosed |
| US-20060047034-A1 | Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-02 | — | — | US | disclosed |
| CN-1698018-A | Radiation-curable composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide | HITACHI CHEMICAL CO LTD (JP) | 2005-11-16 | — | — | CN | disclosed |
| CN-1698017-A | Radiation-curing composition, method for storing same, method for forming cured film, method for forming pattern, method for using pattern, electronic component, and optical waveguide | HITACHI CHEMICAL CO LTD (JP) | 2005-11-16 | — | — | CN | disclosed |
| US-20050209355-A1 | [Novel Reactions and the Products of Such Reactions] | ROITMAN LIPA L | 2005-09-22 | — | — | US | disclosed |
| CN-1664707-A | Scouring agent and flushing fluid for the planography | DAICEL CHEM (JP) | 2005-09-07 | — | — | CN | disclosed |
| US-20050082338-A1 | Sprayable adhesive material for laser marking semiconductor wafers, dies and devices | HENKEL AG & CO. KGAA (DE) | 2005-04-21 | — | — | US | disclosed |
| EP-1524306-A1 | Sprayable adhesive material for laser marking semiconductor wafers, dies and devices | National Starch and Chemical Investment Holding Corporation (US) | 2005-04-20 | — | — | EP | disclosed |
| CN-1163476-C | Biuret polyisocyanic acid ester and its producing process | 旭化成株式会社 | 2004-08-25 | — | — | CN | disclosed |
| CN-1335302-A | Biuret polyisocyanic acid ester and its producing process | ASAHI CHEMICAL IND (JP) | 2002-02-13 | — | — | CN | disclosed |
| CN-1297471-A | Coating composition | JSR CORP (JP) | 2001-05-30 | — | — | CN | disclosed |
| US-6030748-A | PHOTOSENSITIVE LAYER OF A HYDROLYZED AND POLYCONDENSED POLYMER OF ORGANOSILICONE OR ORGANOMETALLIC COMPOUND MONOMER IN A SOLVENT HAVING DISSOLVED THEREIN A PHENOL COMPOUND OR AN ORGANIC PHOSPHORIC ACID | FUJI PHOTO FILM CO., LTD. (JP) | 2000-02-29 | — | — | US | disclosed |
| US-5723253-A | PHOTOSENSITIVITY FOR LITHOGRAPHIC PRINTING PLATES | KONICA CORPORATION (JP) | 1998-03-03 | — | — | US | disclosed |
| US-5712234-A | Graffiti removers which comprise a dye bleaching agent | ARCO CHEMICAL TECHNOLOGY, L.P. (US) | 1998-01-27 | — | — | US | disclosed |
| US-5677101-A | CONTAINING AN O-QUINONEDIAZIDE COMPOUND | KONICA CORPORATION (JP) | 1997-10-14 | — | — | US | disclosed |
| EP-0639797-B1 | Light-sensitive lithographic printing plate and method of processing the same | KONISHIROKU PHOTO IND (JP) | 1997-07-30 | — | — | EP | disclosed |
| US-5635328-A | Light-sensitive lithographic printing plate utilizing o-quinone diazide light-sensitive layer containing cyclic clathrate compound | KONICA CORPORATION (JP) | 1997-06-03 | — | — | US | disclosed |
| EP-0716344-A1 | Light-sensitive composition and light-sensitive lithographic printing plate using the same | KONICA CORPORATION (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0639797-A1 | Light-sensitive lithographic printing plate and method of processing the same | KONICA CORPORATION (JP) | 1995-02-22 | — | — | EP | disclosed |
| EP-0558311-A1 | Light-sensitive lithographic printing plate | KONICA CORPORATION (JP) | 1993-09-01 | — | — | EP | disclosed |
| US-4845008-A | QUICK-DRYING, LITHOGRAPHIC PRINTING PLATES | FUJI PHOTO FILM CO., LTD. (JP) | 1989-07-04 | — | — | US | disclosed |
| US-4845008-A | QUICK-DRYING, LITHOGRAPHIC PRINTING PLATES | FUJI PHOTO FILM CO., LTD. (JP) | 1989-07-04 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (17 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-10301417-B2 | Polyisocyanate composition and isocyanate polymer composition | PAH, ALKBH1, ALKBH3 | TDP1 621/4885TSHR 4682/4885HSD17B10 474/4885 |
| US-20200407487-A1 | Base Proliferating Agent, and Base-Reactive Resin Composition Containing Said Base Proliferating Agent | PCNA, MKI67, POLR1A | TDP1 446/4885TSHR 2734/4885HSD17B10 3642/4885 |
| US-12600811-B2 | Crosslinking agent composition for water-compatible resin, and water-compatible resin composition | COL2A1, COL1A1, COL14A1 | TDP1 2655/4885TSHR 3165/4885HSD17B10 3316/4885 |
| US-20160293849-A1 | SOLVENT FOR PRODUCING ORGANIC TRANSISTOR | SCO2, SLCO2A1, OXSR1 | TDP1 4071/4885TSHR 362/4885HSD17B10 2340/4885 |
| US-20150333269-A1 | SOLVENT OR SOLVENT COMPOSITION FOR MANUFACTURING ORGANIC TRANSISTOR | C1R, C1S, C9 | TDP1 3934/4885TSHR 1182/4885HSD17B10 558/4885 |
| US-11905361-B2 | Base proliferating agent, and base-reactive resin composition containing said base proliferating agent | PCNA, MKI67, POLR1A | TDP1 430/4885TSHR 2835/4885HSD17B10 3788/4885 |
| US-20080200580-A1 | Base Multiplying Agents and Base-Reactive Curable Compositions | RAD1, RAD51, REV1 | TDP1 436/4885TSHR 4312/4885HSD17B10 3407/4885 |
| US-20170298169-A1 | Polyisocyanate Composition and Isocyanate Polymer Composition | TST, SUDS3, SCLY | TDP1 4009/4885TSHR 4448/4885HSD17B10 592/4885 |
| US-11401370-B2 | Base proliferating agent, and base-reactive resin composition containing said base proliferating agent | PCNA, MKI67, POLR1A | TDP1 430/4885TSHR 2835/4885HSD17B10 3788/4885 |
| US-20240402602-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | CHMP4B, PHOSPHO1, EXOSC9 | TDP1 1996/4885TSHR 4660/4885HSD17B10 4241/4885 |
| US-20220332886-A1 | Base Proliferating Agent, and Base-Reactive Resin Composition Containing Said Base Proliferating Agent | PCNA, MKI67, POLR1A | TDP1 430/4885TSHR 2835/4885HSD17B10 3788/4885 |
| US-10693080-B2 | Solvent for producing organic transistor | SCO2, SLCO2A1, OXSR1 | TDP1 4071/4885TSHR 362/4885HSD17B10 2340/4885 |
| US-20240384056-A1 | COMPOSITION AND PHOTOSENSITIVE COMPOSITION | CHMP4B, PHOSPHO1, EXOSC9 | TDP1 2002/4885TSHR 4661/4885HSD17B10 4233/4885 |
| US-10125212-B2 | Polyisocyanate composition and isocyanate polymer composition | TST, SUDS3, SCLY | TDP1 4009/4885TSHR 4448/4885HSD17B10 592/4885 |
| US-20240192593-A1 | PHOTOSENSITIVE COMPOSITION | PPOX, ERCC1, ERCC5 | TDP1 1756/4885TSHR 4858/4885HSD17B10 3320/4885 |
| US-20150166582-A1 | COMPOSITION FOR FORMING PASSIVATION LAYER, SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE HAVING PASSIVATION LAYER, PHOTOVOLTAIC CELL ELEMENT, METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL | MB, CD81, AP2M1 | TDP1 2931/4885TSHR 1677/4885HSD17B10 4324/4885 |
| US-20150210631-A1 | Polyisocyanate Composition and Isocyanate Polymer Composition | TST, SUDS3, SCLY | TDP1 4009/4885TSHR 4448/4885HSD17B10 592/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.