SCHEMBL433428

SCHEMBL433428

C=CCC(O)=Cc1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.44
TSHR P16473 3/20 0.44
AKR1C3 P42330 1/20 0.39
CYP3A4 P08684 1/20 0.38
CYP2C9 P11712 1/20 0.38
PAM P19021 1/20 0.38
AKR1C1 Q04828 1/20 0.38
ESR1 P03372 1/20 0.38
RECQL P46063 1/20 0.37
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
FBP1 P09467 3/20 0.35
NR1I2 O75469 1/20 0.35
CYP2C19 P33261 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7219057 0.82 ALDH1A1 (0.44) ALDH1A1TSHRAKR1C3CYP3A4CYP2C9
SCHEMBL4911765 0.78 ALDH1A1 (0.41) ALDH1A1TSHRAKR1C3CYP3A4CYP2C9
SCHEMBL10533493 0.78 ALDH1A1 (0.41) ALDH1A1TSHRAKR1C3CYP3A4CYP2C9
SCHEMBL627745 0.78 TSHR (0.45) ALDH1A1TSHRAKR1C3RECQLMEN1
SCHEMBL7696952 0.78 FBP1 (0.41) ALDH1A1TSHRAKR1C3CYP3A4CYP2C9
SCHEMBL7731176 0.78 FBP1 (0.41) ALDH1A1TSHRAKR1C3CYP3A4CYP2C9
SCHEMBL2850504 0.77 ALDH1A1 (0.39) ALDH1A1TSHRAKR1C3CYP3A4CYP2C9
SCHEMBL7603630 0.77 MTNR1A (0.49) ALDH1A1TSHRAKR1C1ESR1MEN1
SCHEMBL7603627 0.77 MTNR1A (0.49) ALDH1A1TSHRAKR1C1ESR1MEN1
SCHEMBL7756538 0.77 MTNR1A (0.49) ALDH1A1TSHRAKR1C1ESR1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8859187-B2 Method of forming resist pattern and negative resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2014-10-14 US disclosed
EP-1895576-B1 PATTERN FORMING METHOD TOKYO OHKA KOGYO CO LTD (JP) 2014-07-23 EP disclosed
US-8349543-B2 Pattern-forming method, metal oxide film-forming material and method for using the metal oxide film-forming material TOKYO OHKA KOGYO CO. LTD. (JP) 2013-01-08 US disclosed
US-8263322-B2 Method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-09-11 US disclosed
US-8124312-B2 Method for forming pattern, and material for forming coating film TOKYO OHKA KOGYO CO., LTD. (JP) 2012-02-28 US disclosed
US-8101013-B2 Film-forming material and method of forming pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-01-24 US disclosed
US-8025923-B2 Method for manufacturing a structure TOKYO OHKA KOGYO CO., LTD. (JP) 2011-09-27 US disclosed
US-7932013-B2 Pattern coating material and pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2011-04-26 US disclosed
US-20100167217-A1 METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-07-01 US disclosed
CN-1965265-B Chemically amplified resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO LTD 2010-06-30 CN disclosed
US-20090029284-A1 PATTERN COATING MATERIAL AND PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2009-01-29 US disclosed
EP-1895576-A1 PATTERN COATING MATERIAL AND PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2008-03-05 EP disclosed
US-RE39635-E1 Polymerizing a hydrophobic siloxane prepolymer and a silylated hydrophobic monomer and hydrolyzing the resulting polymer polymerization is carried out by using one of heat or ultraviolet light VANDERLAAN DOUGLAS G 2007-05-15 US disclosed
EP-0990668-A1 Optically transparent hydrogels and processes for their production JOHNSON & JOHNSON VISION PRODUCTS, INC. (US) 2000-04-05 EP disclosed
US-6031059-A POLYMERIZING A HYDROPHOBIC SILOXANE PREPOPLYMER AND A SILYLATED HYDROPHILIC MONOMER AND HYDROLYZING THE RESULTING POLYMER WHEREIN POLYMERIZING IS CARRIED OUT BY USING ONE OF HEAT POLYMERIZATION, ULTRAVIOLET LIGHT JOHNSON & JOHNSON VISION PRODUCTS, INC. (US) 2000-02-29 US disclosed
US-5529886-A PHOTOSENSITIVE MIXTURE OF A COMPOUND WHICH ON EXPOSURE TO ACTINIC RADIATION FORMS ACID, AND AN ACID-CLEAVABLE ACRYLATE HOMO OR COPOLYMER HOECHST AKTIENGESELLSCHAFT (DE) 1996-06-25 US disclosed
EP-0514994-B1 Liquid compositions based on polyisocyanates and epoxides ENICHEM SPA (IT) 1995-09-06 EP disclosed
US-5442087-A Preparing offset printing plates and photoresists HOECHST AKTIENGESELLSCHAFT (DE) 1995-08-15 US disclosed
US-5288833-A Thermosetting resin with high softening point ISTITUTO GUIDO DONEGANI S.P.A. (IT) 1994-02-22 US disclosed
EP-0514994-A1 Liquid compositions based on polyisocyanates and epoxides ENICHEM S.p.A. (IT) 1992-11-25 EP disclosed