SCHEMBL4356807

SCHEMBL4356807

Clc1cnn(Cc2ccccc2)c1Cl

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RECQL P46063 1/20 0.55
TSHR P16473 1/20 0.51
NPBWR1 P48145 2/20 0.50
P2RX7 Q99572 3/20 0.46
ALDH1A1 P00352 5/20 0.45
HTT P42858 3/20 0.45
NPSR1 Q6W5P4 3/20 0.45
LMNA P02545 1/20 0.45
CYP1A2 P05177 1/20 0.45
CYP3A4 P08684 1/20 0.45
CYP2C19 P33261 1/20 0.45
CYP19A1 P11511 1/20 0.45
SMN1; SMN2 Q16637 2/20 0.44
RAB9A P51151 2/20 0.44
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
PKM P14618 2/20 0.44
POLB P06746 1/20 0.44
BLM P54132 1/20 0.44
GPR35 Q9HC97 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4352717 0.81 RECQL (0.51) RECQLTSHRNPBWR1P2RX7ALDH1A1
SCHEMBL4361457 0.81 TSHR (0.57) RECQLTSHRNPBWR1P2RX7ALDH1A1
SCHEMBL4347817 0.81 TSHR (0.67) RECQLTSHRNPBWR1P2RX7ALDH1A1
SCHEMBL1691901 0.78 HTT (0.71) RECQLNPBWR1ALDH1A1HTTNPSR1
SCHEMBL4354841 0.77 HSD17B10 (0.51) RECQLTSHRNPBWR1ALDH1A1HTT
SCHEMBL25341629 0.75 NPBWR1 (0.60) RECQLTSHRNPBWR1ALDH1A1HTT
SCHEMBL31174056 0.75 HTT (0.59) RECQLTSHRNPBWR1ALDH1A1HTT
SCHEMBL4383612 0.74 NPBWR1 (0.75) NPBWR1ALDH1A1HTTNPSR1LMNA
SCHEMBL4359373 0.74 ALDH1A1 (0.47) RECQLTSHRNPBWR1ALDH1A1HTT
SCHEMBL4360401 0.74 ALDH1A1 (0.47) RECQLTSHRNPBWR1ALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed