SCHEMBL4358005

SCHEMBL4358005

CCCCC(=O)OCCC[Si](OC)(OC)OC

nearest known ligand 0.53

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.53
DNM1 Q05193 1/20 0.45
NAAA Q02083 1/20 0.44
HTR2C P28335 1/20 0.44
PRSS1 P07477 1/20 0.43
PRSS2 P07478 1/20 0.43
PRSS3 P35030 1/20 0.43
PAM P19021 2/20 0.41
EPHX2 P34913 2/20 0.40
MGLL Q99685 1/20 0.40
LMNA P02545 1/20 0.40
ALDH1A1 P00352 2/20 0.39
MAPT P10636 2/20 0.39
THRB P10828 1/20 0.39
CNR1 P21554 1/20 0.39
TSHR P16473 1/20 0.39
RAD52 P43351 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8839286 0.93 DGKA (0.65) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL8839460 0.93 DGKA (0.65) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL8839367 0.93 DGKA (0.65) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL6271674 0.91 DGKA (0.46) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL5159381 0.91 DGKA (0.48) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL5164186 0.89 ADRA2A (0.43) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL31506233 0.88 DGKA (0.62) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL31506308 0.88 DGKA (0.62) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL31506254 0.88 DGKA (0.62) DGKADNM1NAAAHTR2CPRSS1
SCHEMBL31506245 0.88 DGKA (0.62) DGKADNM1NAAAHTR2CPRSS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8481669-B2 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element LINTEC CORPORATION (JP) 2013-07-09 US disclosed
US-20090005530-A1 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element LINTEC CORPORATION (JP) 2009-01-01 US disclosed
US-5679821-A Process for preparing organosilicon compound TOAGOSEI CO., LTD. (JP) 1997-10-21 US disclosed