SCHEMBL4358312

SCHEMBL4358312

CCCCN(c1ccc(C)cc1)C(C)O

nearest known ligand 0.36

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
KCNH2 Q12809 3/20 0.36
HPGD P15428 1/20 0.36
MAPT P10636 1/20 0.36
CNR2 P34972 2/20 0.35
MLYCD O95822 1/20 0.35
ALDH1A1 P00352 2/20 0.34
TSHR P16473 1/20 0.34
MCHR1 Q99705 1/20 0.34
RAB9A P51151 2/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
NPC1 O15118 1/20 0.33
TP53 P04637 1/20 0.33
GPX4 P36969 1/20 0.33
PAX8 Q06710 1/20 0.33
GCGR P47871 1/20 0.33
EGFR P00533 1/20 0.33
ERBB2 P04626 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11787205 0.84 KMT2A (0.37) MAPTCNR2MLYCDKMT2AL3MBTL1
SCHEMBL1674606 0.84 ESR1 (0.42) HPGDMAPTCNR2ALDH1A1RAB9A
SCHEMBL2765782 0.81 ALDH1A1 (0.39) CNR2ALDH1A1TSHRRAB9AMEN1
SCHEMBL11785353 0.80 TP53 (0.47) HPGDMAPTCNR2ALDH1A1RAB9A
SCHEMBL8484830 0.75 MAPT (0.58) KCNH2MAPTCNR2ALDH1A1TSHR
SCHEMBL11786816 0.74 GPX4 (0.54) MAPTCNR2ALDH1A1RAB9ANPC1
SCHEMBL624324 0.74 CYP3A4 (0.41) KCNH2MAPTALDH1A1TSHRMEN1
SCHEMBL26324897 0.74 RAB9A (0.34) KCNH2CNR2MLYCDALDH1A1RAB9A
SCHEMBL26327671 0.73 MEN1 (0.38) KCNH2HPGDMAPTCNR2ALDH1A1
SCHEMBL14432533 0.73 TSHR (0.39) KCNH2MAPTCNR2ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220049039-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION AND STRUCTURE REPAIRING MATERIAL SHOWA DENKO K.K. (JP) 2022-02-17 US disclosed
US-20210283655-A1 STRUCTURE REPAIRING METHOD SHOWA DENKO K.K. (JP) 2021-09-16 US disclosed
EP-3858880-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION AND STRUCTURE REPAIRING MATERIAL Showa Denko K.K. (JP) 2021-08-04 EP disclosed
EP-3858805-A1 STRUCTURE REPAIRING METHOD Showa Denko K.K. (JP) 2021-08-04 EP disclosed
US-20210214471-A1 RADICALLY POLYMERIZABLE PUTTY-LIKE RESIN COMPOSITION, SEALING AGENT AND CRACK REPAIRING METHOD SHOWA DENKO K.K. (JP) 2021-07-15 US disclosed
WO-2020066364-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION AND STRUCTURE REPAIRING MATERIAL 昭和電工株式会社 2020-04-02 WO disclosed
WO-2020066363-A1 STRUCTURE REPAIRING METHOD 昭和電工株式会社 2020-04-02 WO disclosed
US-20180002562-A1 LOW-TEMPERATURE-CURABLE CROSS-SECTION REPAIR MATERIAL, AND CROSS-SECTION REPAIRING METHOD USING THE SAME SHOWA DENKO K.K. (JP) 2018-01-04 US disclosed
EP-3260479-A1 LOW-TEMPERATURE-CURABLE CROSS-SECTION REPAIR MATERIAL, AND CROSS-SECTION REPAIR METHOD USING SAME Showa Denko K.K. (JP) 2017-12-27 EP disclosed
EP-2028202-B1 RADICAL POLYMERIZABLE RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-10-31 EP disclosed
EP-2028202-A1 RADICAL POLYMERIZABLE RESIN COMPOSITION SHOWA HIGHPOLYMER CO., LTD. (JP) 2009-02-25 EP disclosed