SCHEMBL4361464

SCHEMBL4361464

O=C(O)Cc1ccnn1Cc1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
PTGDR2 Q9Y5Y4 6/20 0.48
AKR1B1 P15121 1/20 0.47
HDAC1 Q13547 1/20 0.46
HDAC7 Q8WUI4 1/20 0.46
P2RX7 Q99572 1/20 0.44
CYP19A1 P11511 1/20 0.43
ALDH1A1 P00352 1/20 0.42
NAPRT Q6XQN6 1/20 0.42
HPGD P15428 1/20 0.42
POLB P06746 1/20 0.42
GAA P10253 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
HSD11B1 P28845 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17627023 0.77 P2RX7 (0.47) PTGDR2HDAC1HDAC7P2RX7CYP19A1
SCHEMBL17869333 0.76 GRN (0.51) P2RX7CYP19A1ALDH1A1HPGDPOLB
SCHEMBL27676261 0.76 P2RX7 (0.50) P2RX7CYP19A1ALDH1A1HPGDPOLB
SCHEMBL4359373 0.74 ALDH1A1 (0.47) PTGDR2AKR1B1ALDH1A1HPGDPOLB
SCHEMBL4353418 0.73 P2RX7 (0.44) HDAC1HDAC7P2RX7CYP19A1ALDH1A1
SCHEMBL26693375 0.73 HTR2C (0.47) PTGDR2HDAC1HDAC7P2RX7CYP19A1
SCHEMBL4352690 0.73 POLB (0.49) PTGDR2POLBGAAMEN1KMT2A
SCHEMBL1628296 0.73 P2RX7 (0.50) P2RX7CYP19A1ALDH1A1HPGD
SCHEMBL7109626 0.72 POLB (0.47) AKR1B1ALDH1A1POLBMEN1KMT2A
SCHEMBL14722888 0.71 NPBWR1 (0.49) HDAC1P2RX7CYP19A1ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed