SCHEMBL4361517

SCHEMBL4361517

C=C(C)C(=O)OCc1cccc(CO)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.43
MRGPRX4 Q96LA9 1/20 0.43
PRKCA P17252 1/20 0.43
PRKCD Q05655 1/20 0.43
RAB9A P51151 3/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
NPC1 O15118 1/20 0.41
TP53 P04637 1/20 0.41
MAPT P10636 1/20 0.41
XBP1 P17861 1/20 0.41
HTT P42858 1/20 0.41
HSD17B10 Q99714 1/20 0.41
KDM4E B2RXH2 1/20 0.40
GAA P10253 1/20 0.40
STAT1 P42224 1/20 0.40
TSHR P16473 2/20 0.39
CYP4F2 P78329 1/20 0.36
CYP4A11 Q02928 1/20 0.36
HCAR2 Q8TDS4 3/20 0.36
MAOB P27338 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10322053 0.93 ALDH1A1 (0.48) ALDH1A1RAB9AKDM4EGAASTAT1
SCHEMBL28197894 0.87 ALDH1A1 (0.43) ALDH1A1RAB9ANPC1KDM4EGAA
SCHEMBL1323726 0.86 CA2 (0.40) ALDH1A1RAB9ASMN1; SMN2NPC1TP53
SCHEMBL19804280 0.86 MMP1 (0.42) MRGPRX4RAB9ANPC1MMP2MMP9
SCHEMBL1904651 0.85 ALDH1A1 (0.44) ALDH1A1RAB9ANPC1
SCHEMBL28187054 0.84 ALDH1A1 (0.49) ALDH1A1RAB9ASMN1; SMN2KDM4EGAA
SCHEMBL28187045 0.84 ALDH1A1 (0.49) ALDH1A1RAB9ASMN1; SMN2KDM4EGAA
SCHEMBL9555001 0.84 ALDH1A1 (0.43) ALDH1A1RAB9AHTTKDM4EGAA
SCHEMBL10724696 0.84 MAOB (0.52) ALDH1A1MAOBMMP2MMP9MMP12
SCHEMBL12804660 0.83 ALDH1A1 (0.40) ALDH1A1RAB9AHTTKDM4EGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023176172-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-09-21 WO disclosed
US-20090266583-A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed