Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 4/20 | 1.00 |
| ▸ | GAA | P10253 | 3/20 | 1.00 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 1.00 |
| ▸ | MEN1 | O00255 | 1/20 | 1.00 |
| ▸ | POLB | P06746 | 1/20 | 1.00 |
| ▸ | RAB9A | P51151 | 1/20 | 1.00 |
| ▸ | KMT2A | Q03164 | 1/20 | 1.00 |
| ▸ | CA1 | P00915 | 1/20 | 0.61 |
| ▸ | CA2 | P00918 | 1/20 | 0.61 |
| ▸ | CA4 | P22748 | 1/20 | 0.61 |
| ▸ | CA6 | P23280 | 1/20 | 0.61 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.54 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.54 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.52 |
| ▸ | CDC25B | P30305 | 1/20 | 0.52 |
| ▸ | CASP6 | P55212 | 1/20 | 0.52 |
| ▸ | RCE1 | Q9Y256 | 1/20 | 0.52 |
| ▸ | IDH1 | O75874 | 1/20 | 0.50 |
| ▸ | ESR1 | P03372 | 2/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29871296 | 1.00 | MAPT (1.00) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL30350976 | 1.00 | MAPT (1.00) | MAPTGAAKDM4EMEN1POLB | |
| Hydrochloric Acid SCHEMBL21173968 | 0.98 | MAPT (0.95) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL565037 | 0.91 | MAPT (0.83) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL8514724 | 0.91 | GAA (0.83) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL565082 | 0.91 | KDM4E (0.83) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL564637 | 0.89 | KDM4E (0.80) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL565515 | 0.86 | KDM4E (0.74) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL564996 | 0.86 | KDM4E (0.74) | MAPTGAAKDM4EMEN1POLB | |
| SCHEMBL9008928 | 0.85 | KDM4E (0.74) | MAPTGAAKDM4EMEN1POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 579 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105315666-B | Transparent polymer film, electronic device including the same, and composition | 三星电子株式会社 | 2020-03-10 | — | — | CN | claimed |
| EP-3512905-A1 | METHOD FOR PRODUCING A POLYBENZAZOL POLYMER (P) | BASF SE (DE) | 2019-07-24 | — | — | EP | claimed |
| WO-2018050489-A1 | METHOD FOR PRODUCING A POLYBENZAZOL POLYMER (P) | BASF SE (DE) | 2018-03-22 | — | — | WO | claimed |
| US-20160009862-A1 | TRANSPARENT POLYMER FILM AND ELECTRONIC DEVICE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2016-01-14 | — | — | US | claimed |
| US-20070009751-A1 | Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom | CHANG CHUN PLASTICS CO., LTD. (TW) | 2007-01-11 | — | — | US | claimed |
| US-7005163-B2 | Organic-inorganic hybrid film material and its fabrication | CHANG CHUN PLASTICS CO., LTD. (TW) | 2006-02-28 | — | — | US | claimed |
| US-6875554-B2 | Positive photosensitive polyimide resin composition | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2005-04-05 | — | — | US | claimed |
| US-20040110014-A1 | Organic-inorganic hybrid film material and its fabrication | CHANG CHUN PLASTICS CO., LTD. (TW) | 2004-06-10 | — | — | US | claimed |
| US-4927736-A | Hydroxy polyimides and high temperature positive photoresists therefrom | HOECHST CELANESE CORPORATION (US) | 1990-05-22 | — | — | US | claimed |
| EP-4748892-A1 | RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4624527-A1 | RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2025-10-01 | — | — | EP | disclosed |
| US-12422750-B2 | Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device | FUJIFILM CORPORATION (JP) | 2025-09-23 | — | — | US | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-0141781-A2 | Light-sensitive coating composition and use thereof | CIBA-GEIGY AG (CH) | 1985-05-15 | — | — | EP | disclosed |
| EP-0134752-A1 | Layered material and its use | CIBA-GEIGY AG (CH) | 1985-03-20 | — | — | EP | disclosed |
| EP-0132221-A1 | Polyimide, process for its preparation and its use | CIBA-GEIGY AG (CH) | 1985-01-23 | — | — | EP | disclosed |
| EP-0119162-A2 | Photopolymerisable composition, material coated therewith, and process for obtaining relief images | CIBA-GEIGY AG (CH) | 1984-09-19 | — | — | EP | disclosed |
| US-4458041-A | MOLDING MATERIALS, ADHESIVES | CHERNIKHOV ALEXEI Y (SU) | 1984-07-03 | — | — | US | disclosed |
| US-3960980-A | Method of producing elastomer resins | BRIDGESTONE TIRE COMPANY LIMITED (JA) | 1976-06-01 | — | — | US | disclosed |