SCHEMBL4410146

SCHEMBL4410146

O=P(O)(O)CCCC(Cl)CCl

nearest known ligand 0.48

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.48
TDP1 Q9NUW8 2/20 0.48
TYMS P04818 1/20 0.48
ENPEP Q07075 2/20 0.45
LMNA P02545 1/20 0.41
CYP3A4 P08684 1/20 0.41
NFKB1 P19838 1/20 0.41
BLM P54132 1/20 0.41
PMP22 Q01453 1/20 0.41
LPAR3 Q9UBY5 3/20 0.38
LPAR2 Q9HBW0 1/20 0.38
BBOX1 O75936 2/20 0.37
TP53 P04637 1/20 0.35
TSHR P16473 1/20 0.35
S1PR2 O95136 2/20 0.33
S1PR1 P21453 2/20 0.33
S1PR3 Q99500 2/20 0.33
BHMT Q93088 1/20 0.33
S1PR4 O95977 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4412482 0.86 ENPEP (0.41) ALDH1A1TDP1TYMSENPEPLMNA
SCHEMBL5575541 0.78 LPAR3 (0.56) ALDH1A1TDP1LPAR3LPAR2S1PR2
SCHEMBL241353 0.72 TYMS (0.61) ALDH1A1TDP1TYMSENPEPLMNA
SCHEMBL7525524 0.71 TP53 (0.44) TDP1TP53TSHR
SCHEMBL7528143 0.71 TP53 (0.44) TDP1TP53TSHR
SCHEMBL4405162 0.70
SCHEMBL4346946 0.70 TYMS (0.58) ALDH1A1TDP1TYMSENPEPLMNA
SCHEMBL2322124 0.70 FDPS (0.61) ALDH1A1TDP1TYMSENPEPLMNA
SCHEMBL3815181 0.69
SCHEMBL3854505 0.69 TYMS (0.55) ALDH1A1TDP1TYMSENPEPLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed