SCHEMBL4412482

SCHEMBL4412482

O=P(O)(O)CCC(Cl)CCl

nearest known ligand 0.43

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ENPEP Q07075 2/20 0.41
TYMS P04818 1/20 0.39
TDP1 Q9NUW8 2/20 0.38
FOLH1 Q04609 1/20 0.38
TP53 P04637 1/20 0.38
TSHR P16473 1/20 0.38
ALDH1A1 P00352 3/20 0.37
S1PR2 O95136 5/20 0.35
S1PR1 P21453 5/20 0.35
S1PR3 Q99500 5/20 0.35
S1PR4 O95977 4/20 0.35
LMNA P02545 1/20 0.33
CYP3A4 P08684 1/20 0.33
NFKB1 P19838 1/20 0.33
BLM P54132 1/20 0.33
PMP22 Q01453 1/20 0.33
ANPEP P15144 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4410146 0.86 ALDH1A1 (0.48) ENPEPTYMSTDP1TP53TSHR
SCHEMBL4405162 0.74
SCHEMBL242286 0.69 ENPEP (0.50) ENPEPTYMSTDP1FOLH1ALDH1A1
SCHEMBL7516996 0.67 TP53 (0.50) TDP1TP53TSHR
SCHEMBL601975 0.67
SCHEMBL5720460 0.67 FDPS (0.57) ENPEPTYMSTDP1FOLH1ALDH1A1
SCHEMBL2141213 0.67
Phosphoric Acid SCHEMBL11205442 0.67 TP53 (0.39) TDP1TP53TSHR
Ethephon SCHEMBL2787060 0.66 TYMS (0.62) TYMSTDP1ALDH1A1LMNACYP3A4
Ethephon SCHEMBL37574 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
CN-100345890-C Resin and article molded therefrom TORAY INDUSTRIES (JP) 2007-10-31 CN disclosed
CN-100334138-C Resin, resin compositions, process for production thereof, and moldings made by using the same TORAY INDUSTRIES (JP) 2007-08-29 CN disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
CN-1795226-A Resin and article molded therefrom TORAY INDUSTRIES (JP) 2006-06-28 CN disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
CN-1649940-A Resin, resin compositions, process for production thereof, and moldings made by using the same TORAY INDUSTRIES (JP) 2005-08-03 CN disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed