SCHEMBL4412482

SCHEMBL4412482

O=P(O)(O)CCC(Cl)CCl

nearest known ligand 0.43

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ ENPEP Q07075 2/20 0.41
▸ TYMS P04818 1/20 0.39
▸ TDP1 Q9NUW8 2/20 0.38
▸ FOLH1 Q04609 1/20 0.38
▸ TP53 P04637 1/20 0.38
▸ TSHR P16473 1/20 0.38
▸ ALDH1A1 P00352 3/20 0.37
▸ S1PR2 O95136 5/20 0.35
▸ S1PR1 P21453 5/20 0.35
▸ S1PR3 Q99500 5/20 0.35
▸ S1PR4 O95977 4/20 0.35
▸ LMNA P02545 1/20 0.33
▸ CYP3A4 P08684 1/20 0.33
▸ NFKB1 P19838 1/20 0.33
▸ BLM P54132 1/20 0.33
▸ PMP22 Q01453 1/20 0.33
▸ ANPEP P15144 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4410146 0.86 ALDH1A1 (0.48) ENPEPTYMSTDP1TP53TSHR
SCHEMBL4405162 0.74 — —
SCHEMBL242286 0.69 ENPEP (0.50) ENPEPTYMSTDP1FOLH1ALDH1A1
SCHEMBL7516996 0.67 TP53 (0.50) TDP1TP53TSHR
SCHEMBL2141213 0.67 — —
SCHEMBL601975 0.67 — —
SCHEMBL5720460 0.67 FDPS (0.57) ENPEPTYMSTDP1FOLH1ALDH1A1
Phosphoric Acid SCHEMBL11205442 0.67 TP53 (0.39) TDP1TP53TSHR
Ethephon SCHEMBL2787060 0.66 TYMS (0.62) TYMSTDP1ALDH1A1LMNACYP3A4
Ethephon SCHEMBL37574 0.66 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 — — US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 — — US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 — — EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 — — US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 — — US disclosed
CN-100345890-C Resin and article molded therefrom TORAY INDUSTRIES (JP) 2007-10-31 — — CN disclosed
CN-100334138-C Resin, resin compositions, process for production thereof, and moldings made by using the same TORAY INDUSTRIES (JP) 2007-08-29 — — CN disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 — — US disclosed
CN-1795226-A Resin and article molded therefrom TORAY INDUSTRIES (JP) 2006-06-28 — — CN disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 — — EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 — — US disclosed
CN-1649940-A Resin, resin compositions, process for production thereof, and moldings made by using the same TORAY INDUSTRIES (JP) 2005-08-03 — — CN disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 — — EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 — — US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 — — US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 — — EP disclosed
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