Phenol

Phenol

SCHEMBL441809

CCCc1ccccc1O.Oc1ccccc1.Oc1ccccc1

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HTR1A P08908 1/20 0.56
▸ TAAR1 Q96RJ0 1/20 0.52
▸ KEAP1 Q14145 1/20 0.48
▸ HSPA5 P11021 1/20 0.48
▸ AKR1B1 P15121 1/20 0.47
▸ CA12 O43570 1/20 0.46
▸ CA1 P00915 1/20 0.46
▸ CA2 P00918 1/20 0.46
▸ GLA P06280 1/20 0.46
▸ CA3 P07451 1/20 0.46
▸ CA4 P22748 1/20 0.46
▸ CA9 Q16790 1/20 0.46
▸ TDP1 Q9NUW8 1/20 0.46
▸ CA14 Q9ULX7 1/20 0.46
▸ MPO P05164 4/20 0.46
▸ IDO1 P14902 2/20 0.45
▸ TSHR P16473 2/20 0.43
▸ CYP2D6 P10635 1/20 0.43
▸ HIF1A Q16665 1/20 0.43
▸ SLC6A4 P31645 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL1624901 1.00 HTR1A (0.56) HTR1ATAAR1KEAP1HSPA5AKR1B1
Biphenyl SCHEMBL11324275 0.94 HTR1A (0.51) HTR1ATAAR1KEAP1HSPA5AKR1B1
Benzene SCHEMBL21359906 0.94 HTR1A (0.62) HTR1ATAAR1HSPA5AKR1B1CA12
SCHEMBL30595395 0.91 HTR1A (0.64) HTR1ATAAR1HSPA5AKR1B1CA12
SCHEMBL51747 0.91 HTR1A (0.64) HTR1ATAAR1HSPA5AKR1B1CA12
Hydrogen Sulfide SCHEMBL11212668 0.89 HTR1A (0.62) HTR1ATAAR1HSPA5AKR1B1CA12
SCHEMBL28362117 0.89 HTR1A (0.62) HTR1ATAAR1HSPA5AKR1B1CA12
Butane SCHEMBL27313193 0.89 HTR1A (0.62) HTR1ATAAR1HSPA5AKR1B1CA12
Water SCHEMBL28808882 0.89 HTR1A (0.62) HTR1ATAAR1HSPA5AKR1B1CA12
SCHEMBL27567998 0.89 HTR1A (0.62) HTR1ATAAR1HSPA5AKR1B1CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113728031-B Alicyclic epoxy compound product 株式会社大赛璐 2024-07-02 — — CN disclosed
US-20240182705-A1 METHOD FOR PRODUCING ENCAPSULATED STRUCTURE AND EPOXY RESIN COMPOSITION SUMITOMO BAKELITE CO., LTD. (JP) 2024-06-06 — — US disclosed
WO-2024096005-A1 ELECTROCHROMIC SHEET AND ELECTROCHROMIC DEVICE 住友ベークライト株式会社 2024-05-10 — — WO disclosed
WO-2024095928-A1 EPOXY COMPOUND PRODUCT 株式会社ダイセル 2024-05-10 — — WO disclosed
CN-117849914-A Anti-reflective material 株式会社大赛璐 2024-04-09 — — CN disclosed
US-11932723-B2 High-purity 3,4-epoxycyclohexylmethyl methacrylate DAICEL CORPORATION (JP) 2024-03-19 — — US disclosed
WO-2024048369-A1 RESIN COMPOSITION FOR SEALING STATOR, AND METHOD FOR DISASSEMBLING STATOR 住友ベークライト株式会社 2024-03-07 — — WO disclosed
WO-2023234340-A1 EASILY DETACHABLE THERMOSETTING RESIN COMPOSITION AND DETACHING METHOD 住友ベークライト株式会社 2023-12-07 — — WO disclosed
WO-2023234341-A1 EASY-TO-DISMANTLE ROTOR-FIXING RESIN COMPOSITION AND METHOD FOR DISMANTLING ROTOR 住友ベークライト株式会社 2023-12-07 — — WO disclosed
US-11827796-B2 Curable resin composition for three-dimensional shaping and method of manufacturing three-dimensionally shaped product CANON KABUSHIKI KAISHA (JP) 2023-11-28 — — US disclosed
US-6372839-B1 SEMICONDUCTOR WITH FILLER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-04-16 — — US disclosed
US-20020022681-A1 For encapsulation of semiconductor devices by potting, chip-on-bonding or screen printing SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-02-21 — — US disclosed
US-6342309-B1 EPOXY RESIN, CURING AGENT, INORGANIC FILLER AND CATALYST SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-01-29 — — US disclosed
US-20010034382-A1 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-25 — — US disclosed
US-6297306-B1 (A) A BIPHENYL SKELETON EPOXY RESIN, (B) A BIPHENYL SKELETON PHENOLIC RESIN AS A CURING AGENT, (C) MOLYBDENUM COMPOUND, AND (D) AN INORGANIC FILLER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-02 — — US disclosed
US-6274251-B1 FLOWABLE, MOLDABLE AND CURABLE, SHELF-STABLE HOKKO CHEMICAL INDUSTRY CO., LTD. (JP) 2001-08-14 — — US disclosed
US-20010004651-A1 Epoxy resin compositions and premolded semiconductor packages SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-06-21 — — US disclosed
US-6235865-B1 Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-05-22 — — US disclosed
US-6162878-A (A) A BIPHENYL SKELETON-BEARING EPOXY RESIN, (B) A BIPHENYL SKELETON-BEARING PHENOLIC RESIN AS A CURING AGENT, (C) AN ORGANOSILOXANE CONTAINING PHENYL AND ORGANOOXY GROUPS, AND (D) AN INORGANIC FILLER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-12-19 — — US disclosed
EP-1049152-A2 Semiconductor encapsulating epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-11-02 — — EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11932723-B2 High-purity 3,4-epoxycyclohexylmethyl methacrylate MEP1A, MEP1B, FTO HTR1A 2164/4885TAAR1 4514/4885KEAP1 1026/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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