SCHEMBL442104

SCHEMBL442104

Cc1nccn1CCC#N.O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.42

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALPL P05186 2/20 0.42
ALPG P10696 2/20 0.42
ALPI P09923 1/20 0.42
PLAA Q9Y263 1/20 0.42
ALDH1A1 P00352 4/20 0.42
KDM4E B2RXH2 2/20 0.42
HTT P42858 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
GFER P55789 1/20 0.41
KMT2A Q03164 3/20 0.39
NOS1 P29475 1/20 0.38
POLB P06746 1/20 0.37
MYC P01106 1/20 0.36
NAMPT P43490 1/20 0.36
CTSZ Q9UBR2 1/20 0.36
MAPT P10636 1/20 0.35
ALOX15 P16050 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31484734 1.00 ALPL (0.42) ALPLALPGALPIPLAAALDH1A1
SCHEMBL811491 1.00 ALPL (0.42) ALPLALPGALPIPLAAALDH1A1
SCHEMBL30438581 0.86 ALPG (0.44) ALPLALPGPLAAALDH1A1KDM4E
SCHEMBL29045399 0.86 ALPG (0.44) ALPLALPGPLAAALDH1A1KDM4E
SCHEMBL154797 0.85 ESR1 (0.51) ALPGPLAAALDH1A1KDM4EKMT2A
SCHEMBL31484739 0.85 ESR1 (0.51) ALPGPLAAALDH1A1KDM4EKMT2A
SCHEMBL29713435 0.85 ESR1 (0.51) ALPGPLAAALDH1A1KDM4EKMT2A
SCHEMBL441418 0.85 ESR1 (0.51) ALPGPLAAALDH1A1KDM4EKMT2A
SCHEMBL217674 0.81 AGTR1 (0.43) ALDH1A1
SCHEMBL346574 0.81 AGTR1 (0.43) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 249 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022120715-A1 INSULATING ADHESIVE FILM MATERIAL, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF 深圳先进技术研究院 2022-06-16 WO claimed
CN-111925765-A Epoxy resin composition and application thereof 深圳先进电子材料国际创新研究院 2020-11-13 CN claimed
EP-0942028-B1 Epoxy resin composition AJINOMOTO KK (JP) 2004-11-24 EP claimed
US-6232426-B1 BLEND CONTAINING A THIOL, COMPOUND, LATENT CURING AGENT AND BORATE EATER AJINOMOTO CO., INC. (JP) 2001-05-15 US claimed
EP-0424376-B1 INSULATING TAPE FOR MAKING AN INSULATING SHEATH IMPREGNATED WITH A HEAT-CURING EPOXIDE RESIN/ACID ANHYDRIDE MIXTURE FOR ELECTRICAL CONDUCTORS SIEMENS AKTIENGESELLSCHAFT (DE) 1993-04-07 EP claimed
US-5158826-A Binding mica to flat flexible support with self-curing mixture: ring-epoxidized, cycloaliphatic epoxy resin and adduct of (meth)acrylate and a piperazine as accelerator SIEMENS AKTIENGESELLSCHAFT (DE) 1992-10-27 US claimed
EP-0424376-A1 INSULATING TAPE FOR MAKING AN INSULATING SHEATH IMPREGNATED WITH A HEAT-CURING EPOXIDE RESIN/ACID ANHYDRIDE MIXTURE FOR ELECTRICAL CONDUCTORS. SIEMENS AG (DE) 1991-05-02 EP claimed
WO-1990000802-A1 INSULATING TAPE FOR MAKING AN INSULATING SHEATH IMPREGNATED WITH A HEAT-CURING EPOXIDE RESIN/ACID ANHYDRIDE MIXTURE FOR ELECTRICAL CONDUCTORS SIEMENS AKTIENGESELLSCHAFT (DE) 1990-01-25 WO claimed
EP-4748870-A1 EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
EP-4748869-A1 EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
WO-2026100231-A1 CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2026-05-15 WO disclosed
US-20260060129-A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MANUFACTURING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-02-26 US disclosed
EP-4692055-A1 THIOL COMPOUND AJINOMOTO CO., INC. (JP) 2026-02-11 EP disclosed
US-20260008904-A1 THIOL COMPOUND AJINOMOTO CO., INC. (JP) 2026-01-08 US disclosed
US-4501853-A HEATING, STIRRING WITH LIQUID RUBBER, VULCANIZATION RUBBER TO GIVE DISPERSION SUNSTAR GIKEN KABUSHIKI KAISHA (JP) 1985-02-26 US disclosed
US-4478906-A Impregnated insulating tape for fabricating an insulating sleeve for electric conductors SIEMENS AKTIENGESELLSCHAFT (DE) 1984-10-23 US disclosed
EP-0102916-A2 Insulating tape based on a thermosetting epoxy resin and an acid anhydride for the impregnation of an insulator for electrical conductors SIEMENS AKTIENGESELLSCHAFT (DE) 1984-03-14 EP disclosed
US-4336302-A SAID TAPE CONTAINING MICA IN A BINDER CONTAINING A QUATERNARY ONIUM SALT HARDEINING ACCELERATOR SIEMENS AKTIENGESELLSCHAFT (DE) 1982-06-22 US disclosed
EP-0033295-A2 Insulating tape for the manufacture of an insulating jacket for electric conductors impregnated with a thermosetting curing mixture of epoxy resin and acid anhydride SIEMENS AKTIENGESELLSCHAFT (DE) 1981-08-05 EP disclosed
US-3975757-A INTEGRATED CIRCUITS ENCAPSULATED IN EPOXIDIZED NOVOLAK RESIN NATIONAL SEMICONDUCTOR CORPORATION (US) 1976-08-17 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260060129-A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MANUFACTURING THE SAME PIK3C3, TES, PRKX ALPL 914/4885ALPG 191/4885ALPI 1897/4885
US-20260008904-A1 THIOL COMPOUND CBR1, PSMA1, KAT2A ALPL 4268/4885ALPG 4847/4885ALPI 3988/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.